LED packaging method

Abstract

The invention relates to an LED packaging method, which comprises the steps of selecting a heat dissipation substrate; welding an ultraviolet chip on the heat dissipation substrate by using a weldingprocess; growing lower silica gel on the ultraviolet chip; growing a spherical silica gel lens on the lower silica gel; and growing upper silica gel on the spherical silica gel lens to complete packaging of an LED. According to an LED packaging structure, the heat dissipation effect of the LED is improved by adopting the iron heat dissipation substrate with a through hole structure; the conditionthat an LED chip can better irradiate outwards through a packaging material can be ensured by adopting a spherical silica gel lens structure; and the light transmittance is improved.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to an LED packaging method. Background technique [0002] As a new type of solid-state light source, LED has many advantages such as small size, high luminous efficiency, low energy consumption, long life, no mercury pollution, all solid state, quick response, low working voltage, safety and reliability, etc. And other fields have very broad application prospects and market economic benefits, and are expected to become a new generation of green and environmentally friendly lighting sources to replace the existing fluorescent lamps and incandescent lamps, so they have received extensive attention from researchers at home and abroad. [0003] In recent years, LEDs mostly use blue wicks plus yellow fluorescent light to generate white light to achieve lighting. This method has the following problems. [0004] First of all, the light emitted by the LED light source is generally di...

AI Technical Summary

Problems solved by technology

Finally, because high-power LEDs are used in lighting and other occasions, cost control is very important, and the structural size of the external heat sink of high-power LED lamps is not allowed to be too large, and it is impossible to allow active cooling by adding electric fans and other methods. The safe junction temperature should be within 110°C. If the junction temperature is too high, it will lead to a series of problems such as reduced light intensity, spectral shift, increased color temperature, increased thermal stress, and accelerated chip aging, which greatly reduces the service life of the LED. At the same time, it can also lead to accelerated aging of the encapsulation gel filled on the chip, affecting its light transmission efficiency

At present, most of the chips are packaged on thin metal heat dissipation substrates. Because metal heat dissipation substrates are thin, have small heat capacity, and are easy to deform, the contact between them and the bottom surface of the heat sink is not close enough to affect the heat dissipation effect.

Images