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Alkali-soluble light-curing epoxy resin containing cinnamic acid or coumarin groups, preparation method of resin and solder resist prepared by using same

An epoxy resin and coumarin-based technology, which is applied in the field of light-curing solder resist preparation, can solve the problems of low adhesion, poor development, and poor light-curing effect of copper-clad laminates, and reduce the influence of cured film performance. Effect of improving storage stability and excellent photocuring properties

Active Publication Date: 2018-05-15
广东炎墨方案科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Adding a large amount of photoinitiator or photosensitizer will easily lead to photocuring delay in the prepared solder resist, and the photocuring effect is not good, so that the cured film has the disadvantages of low softening temperature and low adhesion to copper clad laminates , thus causing operational problems such as poor development, which not only affects the efficiency of continuous automatic production, but also reduces the yield of products; and the excessive amount of initiator will affect the durability, bonding strength and storage stability of the cured film. Negative impact, and long-term exposure to UV light will degrade, causing yellowing effects on light-colored materials

Method used

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  • Alkali-soluble light-curing epoxy resin containing cinnamic acid or coumarin groups, preparation method of resin and solder resist prepared by using same
  • Alkali-soluble light-curing epoxy resin containing cinnamic acid or coumarin groups, preparation method of resin and solder resist prepared by using same
  • Alkali-soluble light-curing epoxy resin containing cinnamic acid or coumarin groups, preparation method of resin and solder resist prepared by using same

Examples

Experimental program
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Effect test

Synthetic example 1

[0049] Under nitrogen protection, add 80g of diethylene glycol ethyl ether acetate into a 1000mL three-necked flask equipped with a stirrer, raise the temperature to 90°C, add 195.5g of epoxy resin NPCN-704, and keep the temperature for one hour to fully dissolve it, then cool down to 70°C and add 139.2g of cinnamic acid dissolved in 100g of diethylene glycol ether acetate (DCAC) (the molar ratio of epoxy group to cinnamic acid is: 1:1), raise the temperature to 80°C and add in 2g of diethylene glycol diethyl ether acetate (DCAC). The catalyst 4-dimethylaminopyridine in ethylene glycol diethyl ether acetate (DCAC) was 0.6 g, the temperature was raised to 105° C. and kept at a constant temperature for one hour, then the temperature was raised to 115° C. and kept at a constant temperature for 9 hours. Then the reaction system was cooled to 95° C., and 71.5 g of tetrahydrophthalic anhydride dissolved in 100 g of diethylene glycol ether acetate (DCAC) was added (the molar ratio of ...

Synthetic example 2

[0051] Under nitrogen protection, add 80g of diethylene glycol ethyl ether acetate into a 1000mL three-necked flask equipped with a stirrer, raise the temperature to 90°C, add 195.5g of epoxy resin NPCN-704, and keep the temperature for one hour to fully dissolve it, then cool down to 70°C and add 152.4g of 4-methylcinnamic acid dissolved in 100g of diethylene glycol ether acetate (DCAC) (the molar ratio of epoxy group to 4-methylcinnamic acid is: 1:1), and heat up to Add 0.8 g of catalyst 4-dimethylaminopyridine dissolved in 2 g of diethylene glycol diethyl ether acetate (DCAC) at 80°C, raise the temperature to 105°C and keep the temperature constant for one hour, then raise the temperature to 115°C and keep the temperature constant for 8 hours. Then the reaction system was cooled to 95°C, and 143.0 g of tetrahydrophthalic anhydride dissolved in 100 g of diethylene glycol ethyl ether acetate (DCAC) was added (the molar ratio of 4-methylcinnamic acid to unsaturated anhydride wa...

Synthetic example 3

[0053] Under nitrogen protection, add 80g of diethylene glycol ethyl ether acetate into a 1000mL three-necked flask equipped with a stirrer, raise the temperature to 90°C, add 195.5g of epoxy resin NPCN-704, and keep the temperature for one hour to fully dissolve it, then cool down to 70°C and add 178.6g 3-carboxycoumarin dissolved in 100g diethylene glycol ether acetate (DCAC) (the molar ratio of epoxy group to 3-carboxycoumarin is: 1:1), and the temperature is raised to Add 0.6 g of catalyst 4-dimethylaminopyridine dissolved in 2 g of diethylene glycol diethyl ether acetate (DCAC) at 80°C, raise the temperature to 105°C and keep the temperature constant for one hour, then raise the temperature to 115°C and keep the temperature constant for 9 hours. Then the reaction system was cooled to 95°C, and 71.5g of tetrahydrophthalic anhydride dissolved in 100g of diethylene glycol ethyl ether acetate (DCAC) was added (the molar ratio of 3-carboxycoumarin to unsaturated acid anhydride ...

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Abstract

The invention provides alkali-soluble light-curing epoxy resin containing cinnamic acid or coumarin groups, a preparation method of the resin and a solder resist prepared by using the same, wherein the alkali-soluble light-curing epoxy resin containing the cinnamic acid or coumarin groups is obtained through the steps that epoxy resin undergoes a ring-opening reaction to introduce a cinnamic acidderivative or coumaric acid, and then the product undergoes an esterification reaction with an acid anhydride. Compared with the prior art, during the process of introducing unsaturated groups into the epoxy resin, the preparation method does not need addition of a polymerization inhibitor; and compared with the prior art, the solder resist prepared by using the alkali-soluble light-curing epoxy resin has a lower photoinitiator additive amount, thereby improving the performance and application effect of the solder resist.

Description

technical field [0001] The invention belongs to the technical field of photocurable inks, and relates to an alkali-soluble photocurable epoxy resin containing cinnamic acid or coumarin groups, a preparation method thereof, and a solder resist prepared by using the same, in particular to photocurable inks for printed circuit boards. Solder mask preparation. Background technique [0002] The solder resist used in the circuit board industry refers to the protective coating covering the copper wire of the printed circuit, which requires a certain thickness, hardness, solvent resistance, excellent adhesion, good uniformity and appearance. Usually, the solder resist is a resin composition that is photocurable, heat curable, and alkali soluble. [0003] The popular solder resists on the market are usually a combination of a photopolymerization initiator and a carboxyl group-containing photocurable thermosetting resin. Among them, the photocurable heat-curable resin containing car...

Claims

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Application Information

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IPC IPC(8): C08G59/14C08G59/16C09D11/03C09D11/102G03F7/004
CPCC08G59/1455C08G59/1461C08G59/1494C09D11/03C09D11/102G03F7/004
Inventor 李明辉徐明亨谢明星张军华李捷
Owner 广东炎墨方案科技有限公司
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