Four-color LED preparation method based on transverse arrangement

Abstract

The invention relates to a four-color LED preparation method based on transverse arrangement. The preparation method comprises the following steps of selecting a sapphire substrate; preparing a blue light material on the sapphire substrate; etching the blue light material to form a yellow light lamp core groove, a green light lamp core groove and a red light lamp core groove respectively, preparing a yellow light material in the yellow light lamp core groove, preparing a green light material in the green light lamp core groove and preparing a red light material in the red light core groove; preparing a blue light isolation groove in the blue light material, and preparing a metal electrode, so as to complete the preparation of the four-color LED based on the transverse arrangement. Materials of four colors are prepared into the same LED device, so that light with multiple colors is generated. The defects that the LED device is low in light emitting efficiency and low in integration degree due to the fact thatthe LED device is coated with fluorescent powder during packaging in the prior art can be overcome.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a method for preparing four-color LEDs based on lateral arrangement. Background technique [0002] LED (Lighting Emitting Diode) is a light-emitting diode, which is a semiconductor solid-state light-emitting device. It uses a solid semiconductor chip as a light-emitting material. In the semiconductor, the excess energy is released through the recombination of carriers to cause photon emission, which directly emits red, yellow, blue, and green light. LED is a new type of solid-state light source, which has many advantages such as small size, high luminous efficiency, low energy consumption, long life, no mercury pollution, all solid state, fast response, low working voltage, safety and reliability. [0003] Utilizing the principle of three primary colors, phosphor powder can be added in the packaging of LED devices to emit light of any color, so LEDs can be used as li...

AI Technical Summary

Problems solved by technology

Among them, the packaging method in which the phosphor powder is evenly distributed in the packaging material is easy to operate, but the excitation efficiency of the phosphor powder in this packaging method is low; because the phosphor powder is far away from the chip, the process is complicated and difficult to control. Industrial production has not yet been realized; the phosphor powder is close to the chip. The packaging method is to bond the chip with the help of an intermediary packaging material. The defect is that the refractive index of the intermediary packaging material is low, and the light emitted by the chip is prone to total reflection, resulting in heat accumulation, which reduces the light output efficiency of the chip and affects the excitation of phosphors. (The excitation temperature of the phosphor is relatively high)

Applying phosphor powder directly to the semi-finished product that has been bonded to the die will cause a lot of waste of phosphor powder

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