Preparation method of nano-silver-coated copper powder for electronic paste
A technology of electronic paste and nano-silver, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, transportation and packaging, metal processing equipment, etc., can solve the problem of increasing silver consumption and affecting the conductivity of silver-coated copper. Effect, poor oxidation resistance of silver-clad copper, etc., to achieve high oxidation resistance, easy mass production, and reduce costs
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Embodiment 1
[0024] The present embodiment provides a preparation method of nano-silver-coated copper powder for electronic paste, which includes the following steps:
[0025] Step 1. Add deionized water to a dispersant and a reducing agent with a mass ratio of 1:3 to 1:4 to form a mixed solution, adjust the mixed solution to neutrality by adding an alkaline solution, add it to the reaction vessel and stir electromagnetically 30min; wherein, the volume of deionized water is 60-70 times the mass of the dispersant;
[0026] Step 2: Take copper salt with a mass of 5 times the mass of the dispersant and deionized water to form a copper salt solution, fully dissolve and add a complexing agent to complex to obtain a cupro ammonia solution; The cupro ammonia solution is added dropwise to the mixed solution obtained in step 1 at the dropping speed of min, and under the condition that the reaction temperature is 70-90 ° C, the reducing solution is obtained after the reaction for 30-60 min; wherein,...
Embodiment approach
[0035] Step 1. Add 5.79g VC (ascorbic acid) and 1.5g PVP (polyvinylpyrrolidone) into 200ml of deionized water to form a mixed solution, and add an alkaline solution to adjust the pH of the mixed solution to neutral, and then mix the neutral The solution was added to the three-necked flask and stirred electromagnetically for 30min;
[0036] Step 2: Mix 7.47g of copper sulfate pentahydrate solution with 50ml of deionized water to form a copper salt solution, and after fully dissolving, add 30ml of ammonia water with a mass fraction of 25% to obtain a copper-ammonia solution; stir at a stirring speed of 2000r / min Under the condition of 0.01L / min, the cupro ammonia solution was added dropwise to the three-necked flask after step 1, and the reducing solution was obtained after the reaction for 30-60min under the condition that the reaction temperature was 70-90°C;
[0037] Step 3: Mix 0.566g of silver nitrate with 50ml of deionized water to form a silver salt solution, add 1.5ml of...
Embodiment 3
[0040] On the basis of Embodiment 1, this embodiment further provides a specific implementation manner:
[0041] Step 1. Add 46.32g VC (ascorbic acid) and 12g PVP (polyvinylpyrrolidone) into 800ml of deionized water to form a mixed solution, and add an alkaline solution to adjust the pH of the mixed solution to neutral, and then adjust the neutral mixed solution was added to the three-necked flask, and stirred electromagnetically for 30 min;
[0042]Step 2: Mix 59.76g of copper sulfate pentahydrate solution with 350ml of deionized water to form a copper salt solution, and after fully dissolving, add 90ml of ammonia water with a mass fraction of 25% to obtain a copper-ammonia solution; stir at a stirring speed of 2000r / min Under the condition of 0.01L / min, the cupro ammonia solution was added dropwise to the three-necked flask after step 1, and the reducing solution was obtained after the reaction for 30-60min under the condition that the reaction temperature was 70-90°C;
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