Lightweight high temperature resistant heat insulation board for metallurgy and preparation method thereof
A technology of high temperature resistance and heat insulation board, applied in the field of metallurgy, can solve the problems of easy pulverization, low service life, low cost performance, etc., and achieve the effect of simple manufacturing process, high strength retention rate and synchronized service life
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Embodiment 1
[0037] The raw material composition and weight percentage of lightweight high temperature resistant heat insulation board 1 are:
[0038] Vitrified beads with a particle size of 50 mesh: 50%;
[0039] Floating beads of 0.088mm
[0040] Floating beads with a particle size of ≤0.088mm: 3%;
[0041] Magnesia with particle size ≤0.088mm: 18%;
[0043] Guangxi white mud: 2%;
[0044] Sodium hexametaphosphate: 3%;
[0045] Silica powder: 8%;
[0046] Pyrophyllite powder: 1%;
[0047] Quicklime: 0.2%
[0048] Mix the above raw materials with water in a mixer according to the ratio, put them in a mold and vibrate for molding, place at room temperature for 24 hours, put the mold in a 50°C thermostat for 24 hours, and put it in a 120°C drying oven to dry for 48 hours after demoulding. Lightweight high temperature resistant insulation board1.
Embodiment 2
[0050] The raw material composition and weight percentage of lightweight high temperature resistant heat insulation board 2 are:
[0051] Vitrified beads with a particle size of 200 mesh: 30%;
[0052] Floating beads of 0.088mm
[0053] Magnesia with particle size ≤0.088mm: 10%;
[0055] Guangxi white mud: 5%;
[0056] Sodium hexametaphosphate: 3%;
[0057] Silica powder: 5%;
[0058] Pyrophyllite powder: 2%;
[0059] Quicklime: 0.1%
[0060]Mix the above raw materials with water in the mixer according to the ratio, put them in the mold and vibrate for molding, place at room temperature for 8 hours, put the mold in a 60°C thermostat for 8 hours, and put it in a 120°C drying oven to dry for 24 hours after demoulding. Lightweight high temperature resistant insulation board 2.
Embodiment 3
[0062] The raw material composition and weight percentage of lightweight high temperature resistant heat insulation board 3 are:
[0063] Vitrified microbeads with a particle size of 50 mesh: 30%;
[0064] Floating beads of 0.088mm
[0065] Magnesia with particle size ≤0.088mm: 12%;
[0066] Alumina cement 16.8%;
[0067] Guangxi white mud: 8%;
[0068] Sodium hexametaphosphate: 0.2%;
[0069] Silica powder: 3%;
[0070] Pyrophyllite powder: 10%;
[0071] Quicklime: 0.2%
[0072] Mix the above raw materials with water in the mixer according to the ratio, put them in the mold and vibrate for molding, place at room temperature for 12 hours, put the mold in a 60°C thermostat for 12 hours, and put it in a 150°C drying oven to dry for 12 hours after demoulding. Lightweight high temperature resistant insulation board3.
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