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A technology of nickel-plated carbon nanotubes and carbon fibers, which is applied to circuit substrate materials, printed circuit manufacturing, printed circuit components, etc., and can solve problems such as poor heat dissipation and device failure
Inactive Publication Date: 2018-06-01
姜莉
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Problems solved by technology
At present, most LEDs are packaged in MCPCB. With the increase of chip power, the problem of device failure due to poor heat dissipation has become increasingly prominent.
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[0023] A method for preparing an insulating aluminum substrate filled with carbon fiber-nickel-plated carbon nanotubes, characterized in that, the steps are as follows:
[0024] a. Treatment of aluminum substrate:
[0025] Cut the aluminum plate into small aluminum plates, polish it with coarse sandpaper, wash it with water, put it in NaOH solution for 7 minutes, take it out and wash it with water, and then put it in HNO 3 Corrode in the solution for 6 minutes, take it out and wash it with water, then ultrasonically clean it, and dry it with a hair dryer;
[0026] b. Surface treatment of thermally conductive filler:
[0027] First heat the acetone solution in a water bath to 60-80°C, then immerse 2kg of carbon fibers in it, soak for 2 hours, rinse repeatedly with deionized water, and dry in vacuum to obtain desized carbon fibers; then add concentrated nitric acid solution, ultrasonically oscillate for 1 hour, and then Clean with deionized water, vacuum dry, obtain surface tr...
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Abstract
The invention discloses a preparation method for a carbon fiber-nickel-plated carbon nano-tube filled insulating aluminum substrate, and the method is characterized in that the method comprises the steps: cutting an aluminum plate into small aluminum plate blocks, grinding the small aluminum plate blocks through flint paper, washing the small aluminum plate blocks, corroding the small aluminum plate blocks in NaOH solution, corroding the small aluminum plate blocks in HNO3 solution, and carrying out the supersonic cleaning and drying; enabling carbon fibers to be immersed into acetone solution, carrying out the water bath heating, obtaining desized carbon fibers, adding concentrated nitric acid solution, carrying out the supersonic oscillation, obtaining the desized carbon fibers with theprocessed surfaces, and mixing the desized carbon fibers with a nickel-plated carbon nano-tube; wrapping copper powder, aluminium nitride and organic silica gel with graphene, carrying out the uniformmixing and kneading, putting the mixture into a die for heating and solidifying, and obtaining a graphene-coated copper powder-aluminium nitride heat conducting material after demolding; heating epoxy resin in a drying box, adding a heat conducting filling material and a heat conducting material, carrying out the mechanical stirring and supersonic oscillation, carrying out the vacuum defoamation,adding a curing agent, carrying out stirring slowly, performing vacuum pumping for several times, obtaining an unsolidified mixture, coating the processed aluminum substrate with the mixture uniformly, carrying out the curing, cooling and grinding, and obtaining an insulating aluminum substrate.
Description
technical field [0001] The invention relates to the field of printed circuit boards, in particular to a method for preparing an insulating aluminum substrate filled with carbon fiber-nickel-plated carbon nanotubes. Background technique [0002] With the rapid development of electronic information technology, higher requirements are placed on the performance of printed circuit boards (PCBs) for electronic circuits. Electronic equipment that is light, thin and consumes a lot of power has been plagued by heating problems since its birth. As the bridge and carrier of each heating device, PCB has always been the focus of research on enhancing equipment heat dissipation. Substrate materials with excellent thermal conductivity and good heat dissipation structure All PCBs can evenly distribute the heat generated by the heating device, enhance the heat dissipation efficiency, and reduce the thermal damage of expensive devices. LED has the characteristics of small size, low power c...
Claims
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Application Information
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