High-temperature-resistant cable outer sheath layer and preparation method thereof
A technology of outer sheath and high temperature resistance, which is applied to rubber insulators, organic insulators, etc., and can solve problems such as hindering the heat loss of wires and cables, accelerating the aging speed of sheaths, and shortening the life of wires and cables.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
preparation example Construction
[0016] The invention provides a method for preparing the outer sheath of a high temperature resistant cable, the preparation method comprising:
[0017] (1) Mixing bentonite, succinic anhydride, fatty alcohol, organic acid and water, centrifugal dehydration and spray drying to obtain filler M; wherein, the spray drying conditions include: the temperature is 150-180°C, and the time is 20-30min;
[0018] (2) The filler M is subjected to the first heat treatment and the second heat treatment respectively to obtain the modified filler M; wherein, the conditions for the first heat treatment include: the temperature is 50-70°C, and the time is 20-30min; The heat treatment conditions include: the temperature is 30-50°C, and the time is 1-2h;
[0019] (3) Mix modified filler M, chloroprene rubber, butanol etherified amino resin, polyvinylidene fluoride, ethyl acetate, cadmium stearate, carbon black, zinc oxide and barium stearate, and get Synthetic rubber;
[0020] (4) Put the blend...
Embodiment 1
[0032] Mix bentonite, succinic anhydride, fatty alcohol, lauric acid and water, centrifugally dehydrate and spray-dry to obtain filler M; wherein, the spray-drying conditions include: the temperature is 150°C, and the time is 20 minutes; the filler M is subjected to the first The second heat treatment and the second heat treatment to obtain the modified filler M; wherein, the conditions of the first heat treatment include: the temperature is 50°C, and the time is 20min; the conditions of the second heat treatment include: the temperature is 30°C, and the time is 1h; The modified filler M (the modified filler M needs to be ground before use, and the average particle diameter of the modified filler M after grinding is 1mm), chloroprene rubber, butanol etherified amino resin, polyvinylidene fluoride, ethyl acetate Ester, cadmium stearate, carbon black, zinc oxide and barium stearate are mixed, banburying (temperature is 60°C, time is 30min.) to obtain compound rubber; put the comp...
Embodiment 2
[0034]Mix bentonite, succinic anhydride, fatty alcohol, lauric acid and water, centrifugally dehydrate and spray-dry to obtain filler M; wherein, the spray-drying conditions include: the temperature is 180°C, and the time is 30 minutes; the filler M is subjected to the first The second heat treatment and the second heat treatment to obtain the modified filler M; wherein, the conditions of the first heat treatment include: the temperature is 70°C, and the time is 30min; the conditions of the second heat treatment include: the temperature is 50°C, and the time is 2h; The modified filler M (the modified filler M needs to be ground before use, and the average particle diameter of the modified filler M after grinding is 4 mm), chloroprene rubber, butanol etherified amino resin, polyvinylidene fluoride, ethyl acetate Esters, cadmium stearate, carbon black, zinc oxide and barium stearate are mixed, banburyed (at a temperature of 90°C, and for 60 min.) to obtain compound rubber; put th...
PUM
Property | Measurement | Unit |
---|---|---|
particle size | aaaaa | aaaaa |
dielectric strength | aaaaa | aaaaa |
dielectric strength | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com