A nickel-gold device

Abstract

The invention discloses a nickel-gold depositing device. The nickel-gold depositing device comprises a support, a control assembly, a nickel cylinder arranged on the support, and a material frame; thematerial frame is arranged on the upper portion of the nickel cylinder; the nickel cylinder is internally provided with a temperature control system, a charging assembly and an electroplating assembly; the temperature control system, the charging assembly and the electroplating assembly are all electrically connected with the control assembly; and a defoaming device is further arranged on the nickel cylinder. According to the nickel-gold depositing device, the temperature control system used for controlling the temperature of a solution in the nickel cylinder, the charging assembly used for adding nickel ions and the electroplating assembly used for increasing the electroplating speed are arranged in the nickel cylinder and all electrically connected with the control assembly, nickel depositing automatic production can be effectively achieved by controlling the temperature control system, the charging assembly and the electroplating assembly through the control assembly so that the solution temperature can be adjusted timely, the nickel ion solution can be added automatically and the magnitude of the electroplating current can be adjusted according to the solution temperature andthe nickel ion concentration in the nickel cylinder in the nickel depositing process of a circuit board, thus, the nickel-gold depositing device can adapt to electroplating work of the different circuit boards automatically, and the automation degree is high.

Description

technical field [0001] The invention relates to the technical field of nickel immersion gold, in particular to a nickel immersion gold device. Background technique [0002] As a high-density electronic structure, the surface treatment of the printed circuit board must be able to provide functions such as solderability, wire bonding, and maintenance of low contact resistance. Therefore, the surface treatment of the printed circuit board is very important. Preferred choice for board surface treatment. Electroless nickel gold, that is, the conductor on the surface of the PCB is first electroplated with a layer of nickel and then electroplated with a layer of gold. The nickel plating is mainly to prevent the diffusion between gold and copper. The cost of this production method is relatively high, and the obtained product has poor metallic gloss, low flatness, low brightness, and poor solderability. In particular, the material cost of metal gold as a precious metal is relativel...

AI Technical Summary

Problems solved by technology

The cost of this production method is relatively high, and the obtained product has poor metallic gloss, low flatness, low brightness, and poor weldability

In particular, as a precious metal, the material cost of metal gold is relatively expensive. It is difficult to reduce the amount of gold used by using existing methods and processing structures, so that the cost of printed circuit boards has always been relatively high.

The existing nickel deposition equipment has a low degree of automation and cannot make the surface of the obtained product uniform in nickel deposition. Therefore, a nickel deposition device that can effectively independently adapt to different working conditions and nickel deposition processes is needed

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