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Graphite-copper based composite material with network interpenetration structure and preparation method of graphite-copper based composite material

A technology of copper-based composite materials and network interpenetration, which is applied in the field of graphite-copper-based composite materials and its preparation, can solve the problems of low mechanical properties of materials, failure of composite materials, etc., and achieve the effect of low production cost and high efficiency

Active Publication Date: 2018-06-15
HUNAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is reported in the literature "Fabrication and thermal conductivity of copper coated graphite film / aluminum composites for effective thermal management (Journal of Alloys and Compounds)" that adding 17.4-53.2% of continuous graphite sheets can make the aluminum matrix composite parallel to the graphite plane direction (X-Y plane ) on the thermal conductivity of 397-805W m -1 ·K -1 , but the thermal conductivity of this composite material in the Z direction is only 10-28W·m -1 ·K -1
At the same time, since the composite material is a sandwich structure composed of graphite sheets and metal substrates alternately stacked on the X-Y plane, the mechanical properties of the material are low, and the composite material is prone to failure due to graphite interlayer cleavage during use.

Method used

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  • Graphite-copper based composite material with network interpenetration structure and preparation method of graphite-copper based composite material
  • Graphite-copper based composite material with network interpenetration structure and preparation method of graphite-copper based composite material
  • Graphite-copper based composite material with network interpenetration structure and preparation method of graphite-copper based composite material

Examples

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Embodiment 1

[0031] The thickness is 0.2mm and the thermal conductivity is 1200W·m -1 ·K -1 The continuous flakes of graphite were used as the reinforcing phase, and the surface oil was removed by ultrasonic treatment with acetone. Use a carving knife to carve U-shaped lines on the graphite surface, and the local areas of the lines are as follows: figure 2 shown. Among them, h, l, a, and b are 2mm, 3.5mm, 2mm, and 3mm respectively, and the engraved U-shaped lines are turned up one by one to obtain a three-dimensional graphite sheet.

[0032] The electroless copper plating process is used to carry out electroless copper plating on graphite sheets: the electroless copper plating sensitization stage process is to add graphite sheets to 500ml of 20ml / LHCl+20g / LSnCl 2 solution, stir the solution for 15 minutes, pour off the solution, and rinse with distilled water for 3 times; the activation stage process is: add 200ml of 20ml / L HCI+0.5g / LPdCl to the sensitized graphite sheet 2 solution, s...

Embodiment 2

[0035] Take three pieces of equal size, the thickness is 0.1mm, and the thermal conductivity is 1500W·m -1 ·K -1 The continuous flakes of graphite were used as the reinforcing phase, and the surface oil was removed by ultrasonic treatment with acetone. Carve U-shaped lines on the surface of the graphite with a carving knife respectively. The size of the lines is as follows: image 3 As shown, where h is 2.2mm, 2.1mm, and 2mm respectively, l is 6mm, 5mm, and 4mm, a is 3mm, and b is 3mm. Turn up the engraved U-shaped lines one by one to get a three-dimensional graphite sheet.

[0036] Apply electroless copper plating process to graphite sheet to carry out electroless copper plating on graphite sheet: the electroless copper plating sensitization stage process is to add graphite sheet to 500ml of 20ml / LHCl+20g / LSnCl 2 solution, stir the solution for 15 minutes, pour off the solution, and rinse with distilled water for 3 times; the activation stage process is: add 200ml of 20ml / ...

Embodiment 3

[0039] Thickness is 1mm, thermal conductivity is 1500W·m -1 ·K -1 The continuous flakes of graphite were used as the reinforcing phase, and the surface oil was removed by ultrasonic treatment with acetone.

[0040] Use a carving knife to carve U-shaped lines on the surface of graphite, the size of which is as follows figure 2 Shown, where h, l, a, b are 2mm, 3.5mm, 2mm, 3mm respectively. Turn up the engraved U-shaped lines one by one to get a three-dimensional graphite sheet.

[0041] The surface of graphite was plated with Cr by vacuum micro-evaporation plating technology. Add enough CrCl 3 with CrH 3 Mixed according to the mass ratio of 10:1, placed in the vacuum micro-evaporation reaction chamber, after putting the graphite sheet, the reaction chamber was evacuated to 10 -3 Pa. Heat the reaction chamber to 680°C, control the vacuum degree in the reaction chamber within the range of 5-8Pa, and conduct vacuum micro-evaporation plating on the graphite sheet for 2 hours...

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Abstract

The invention discloses a preparation method of a graphite-copper based composite material with a network interpenetration structure. The composite material is mainly composed of two phases of graphite and copper. The volume percent of the graphite in the composite material ranges from 10% to 40%. In the composite material, the two phases of graphite and copper keep continuous to form the interwoven network interpenetration structure. The continuous flaky graphite is used as a raw material, and the graphite is subjected to surface pretreatment; flaky graphite subarea configuration design and stereoscopic operation are carried out; the surface of the graphite is plated with the copper; a porous prefabricated blank is formed by a single or multiple kinds of stereoscopic graphite in a nestedmanner; and the copper permeates into clearances between the graphite through vacuum pressure infiltration, and finally the compact graphite-copper based composite material is obtained. The two phasesof graphite and copper of the composite material keep continuous, the composite material has the good heat-conducting property and mechanical property, efficient conduction of heat can be achieved byadjusting and controlling the spatial orientation of graphite flakes, and the composite material is an electronic packaging material with the large application potential.

Description

technical field [0001] The invention relates to electronic packaging materials, in particular to a graphite-copper-based composite material with a network interpenetrating structure and a preparation method thereof. Background technique [0002] With the rapid development of electronic technology, the power density of electronic components has increased, and the problem of heat dissipation has become increasingly prominent. Therefore, modern electronic circuit design has put forward higher requirements for the thermal conductivity of materials. The thermal conductivity of traditional first-generation Invar, Knvar alloys, second-generation W / Cu, Mo / Cu alloys, and third-generation SiC / Al composite materials can no longer meet the heat dissipation requirements of current high-power electronic devices. [0003] Graphite, as a material with abundant domestic resources and low cost, has a thermal conductivity of up to 2000W·m in the plane direction of its carbon atoms -1 ·K -1 ....

Claims

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Application Information

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IPC IPC(8): C22C1/10C22C32/00C22C9/00H01L23/29
CPCC22C1/101C22C1/1015C22C1/1036C22C9/00C22C32/0084H01L23/29
Inventor 刘骞何泽贤欧阳佳刘泽栋于颖刘露
Owner HUNAN UNIV OF SCI & TECH