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Gold-palladium-silver alloy composite bonding wire and manufacturing method thereof

A manufacturing method and silver alloy technology, applied in the field of bonding wire, can solve the problems that hinder the application and development of gold bonding wire, unfavorable enterprises to improve their competitiveness, low tensile strength of gold bonding wire, etc., and achieve excellent oxidation resistance and anti-sulfurization performance , Improve reliability, anti-oxidation and anti-vulcanization ability

Inactive Publication Date: 2018-06-22
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the international gold price continues to rise, the price of gold bonding wire has also risen all the way, resulting in high cost of end products, which is not conducive to enterprises to improve their competitiveness
In addition, the tensile strength of gold bonding wire is low (for example, the maximum tensile strength of gold bonding wire with a diameter of 20 microns is less than 5 gf after welding), and the elongation is not easy to control
The above two factors have become the bottleneck hindering the application and development of gold bonding wire

Method used

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  • Gold-palladium-silver alloy composite bonding wire and manufacturing method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] The gold-palladium-silver alloy composite bonding wire of the present embodiment comprises a core wire and a gold coating coated on the outside of the core wire; the core wire contains 60% gold, 35% silver, and 5% palladium by weight; the gold coating The thickness is 100nm.

[0033] In the present embodiment, the manufacturing method of gold-palladium-silver alloy composite bonding wire comprises the following steps:

[0034] (1) Melting and casting: Gold, silver and palladium are mixed in proportion, and after vacuum melting and directional continuous casting process, a core wire with a diameter of 8 mm is obtained;

[0035] (2) Wire drawing: draw the core wire obtained in step (1) to obtain a core wire with a diameter of 15-40 um (such as 20 um);

[0036] During the wire drawing process, the wire is subjected to intermediate annealing several times, and N is used in the annealing process 2 As the annealing atmosphere, the effective length of the annealing furnace i...

Embodiment 2

[0049] The gold-palladium-silver alloy composite bonding wire of the present embodiment comprises a core wire and a gold coating coated on the outside of the core wire; the core wire contains 46% gold, 48% silver, and 6% palladium by weight; the gold coating The thickness is 200nm.

[0050] In the present embodiment, the manufacturing method of gold-palladium-silver alloy composite bonding wire comprises the following steps:

[0051] (1) Melting and casting: Gold, silver and palladium are mixed in proportion, and after vacuum melting and directional continuous casting process, a core wire with a diameter of 6 mm is obtained;

[0052] (2) Wire drawing: draw the core wire obtained in step (1) to obtain a core wire with a diameter of 15-40 um (such as 20 um);

[0053] During the wire drawing process, the wire is subjected to intermediate annealing several times, and N is used in the annealing process 2 As the annealing atmosphere, the effective length of the annealing furnace i...

Embodiment 3

[0066] The gold-palladium-silver alloy composite bonding wire of the present embodiment comprises a core wire and a gold coating coated on the outside of the core wire; the core wire contains 72% gold, 25% silver, and 3% palladium by weight; the gold coating The thickness is 25nm.

[0067] In the present embodiment, the manufacturing method of gold-palladium-silver alloy composite bonding wire comprises the following steps:

[0068] (1) Melting and casting: Gold, silver and palladium are mixed in proportion, and after vacuum melting and directional continuous casting process, a core wire with a diameter of 8 mm is obtained;

[0069] (2) Wire drawing: draw the core wire obtained in step (1) to obtain a core wire with a diameter of 15-40 um (such as 20 um);

[0070] During the wire drawing process, the wire is subjected to intermediate annealing several times, and N is used in the annealing process 2 As the annealing atmosphere, the effective length of the annealing furnace is...

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Abstract

The invention provides a gold-palladium-silver alloy composite bonding wire. The gold-palladium-silver alloy composite bonding wire is characterized by comprising a core wire and a gold plating layercoating the outside of the core wire, wherein the core wire contains the following elements by weight: 45-72% of gold, 25-49% of silver and 3-6% of palladium; and the thickness of the gold plating layer is 20-200nm. The invention further provides a manufacturing method of the gold-palladium-silver alloy composite bonding wire. The gold-palladium-silver alloy composite bonding wire has excellent oxidation resistance and vulcanization resistance, high tensile strength and good solder joint connectivity, and the cost can be reduced.

Description

technical field [0001] The invention relates to a bonding wire for IC and LED packaging, in particular to a gold-palladium-silver alloy composite bonding wire and a manufacturing method thereof. Background technique [0002] Bonding wire (bonding wire, also known as bonding wire) is the main connection method for connecting a chip to an external packaging substrate (substrate) and / or multilayer circuit board (PCB). The development trend of bonding wire, in terms of product direction, mainly includes wire diameter miniaturization, high floor life and high bobbin length; in terms of chemical composition, there are mainly copper wires (including bare copper wires, palladium-coated copper wires) , flash gold palladium-plated copper wire) has largely replaced gold wires in the semiconductor field, while silver wires and silver alloy wires have replaced gold wires in LED and some IC packaging applications. Another important direction is the development of gold alloy wires to furt...

Claims

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Application Information

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IPC IPC(8): H01L23/49H01L21/48C22C5/02C22C30/00B22D11/00C22F1/14C25D7/06C25D5/34C25D3/48C25D5/50
CPCH01L24/43H01L24/45H01L23/49C22C5/02C22C30/00C22F1/14C25D3/48C25D5/34C25D5/50C25D7/0607B22D11/001B22D11/005H01L2224/45644H01L2224/45565H01L2224/45144H01L2224/45139H01L2224/45164H01L2924/00011H01L2924/01049
Inventor 周振基周博轩于锋波彭政展麦宏全
Owner NICHE TECH KAISER SHANTOU