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Preparation method of high-surface inner-heat-conduction insulation composite membrane

A technology of heat conduction insulation and composite film, which is applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of using a large amount of organic solvents, low yield, long stripping time, etc., and achieves simple preparation methods and high in-plane thermal conductivity , the effect of broad application prospects

Active Publication Date: 2018-06-29
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, Zeng et al. used the ultrasonic stripping method to obtain boron nitride nanosheets and then obtained a polyvinyl alcohol / boron nitride nanosheet composite film through film pumping. They found that boron nitride had a good in-plane arrangement in the composite material and the prepared composite film The thermal conductivity of the film reaches 6.9W / m·K under the condition of 94% boron nitride content ( Zeng, et al. Nanoscale 2015, 7, 6774-6781. ); However, the existing boron nitride stripping method has problems such as low yield, long stripping time and a large amount of use of organic solvents, which have many limitations in practical application.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Prepare 180 mL of a 5 mg / mL graphene oxide aqueous solution, add 100 mg of boron nitride microflakes, and stir ultrasonically to obtain a graphene oxide / boron nitride microflake mixed solution. Pour it into a polytetrafluoroethylene mold, and dry it in an oven at 40° C. to obtain a composite film. It maintains electrical insulation and has an in-plane thermal conductivity of 4.4 W / m·K.

Embodiment 2

[0021] Prepare 140 mL of a 5 mg / mL graphene oxide aqueous solution, add 300 mg of boron nitride microflakes, and stir ultrasonically to obtain a graphene oxide / boron nitride microflake mixture. Pour it into a polytetrafluoroethylene mold, and dry it in an oven at 60° C. to obtain a composite film. It maintains electrical insulation and has an in-plane thermal conductivity of 6.3 W / m·K.

Embodiment 3

[0023] Prepare 100 mL of a 5 mg / mL graphene oxide aqueous solution, add 500 mg of boron nitride microflakes, and stir ultrasonically to obtain a graphene oxide / boron nitride microflake mixed solution. Pour it into a polytetrafluoroethylene mold, and dry it in an oven at 70° C. to obtain a composite film. It maintains electrical insulation and has an in-plane thermal conductivity of 10.3 W / m·K.

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Abstract

The invention belongs to the technical field of fine chemistry industry, and particularly relates to a preparation method of a high-surface inner-heat-conduction insulation composite membrane. According to the method, a graphene oxide water solution is used as a raw material; boron nitride micrometer sheets are added; ultrasonic agitation is performed to obtain the uniform mixed solution; then, the mixed solution is casted and dried to obtain a graphene oxide-boron nitride micrometer sheet composite membrane. The prepared composite membrane has high in-surface heat conduction rate; meanwhile,the electric insulation performance is maintained. The method has the advantages that the operation is simple; the environment-friendly effect is good; the scaled production is easy; wide applicationprospects are realized in the field of micro-electronic materials.

Description

technical field [0001] The invention belongs to the technical field of fine chemicals, and in particular relates to a preparation method of a composite film with high in-plane thermal conductivity and insulation. Background technique [0002] With the rapid development of the microelectronics industry, integrated circuits are becoming increasingly high-speed and high-density, which will inevitably generate a lot of heat locally. If it cannot be conveyed well, it will have a negative impact on the normal use of electronic devices, so microelectronic materials are required to have good thermal conductivity. In addition, for some fields (such as the LED field), it is also necessary for the material to have good electrical insulation properties to prevent electrical short circuits and the like. Therefore, the preparation of materials with good thermal conductivity and insulation has attracted the attention of both academia and industry. [0003] Boron nitride is a widely used ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/14
CPCC09K5/14
Inventor 冯嘉春沈子铭
Owner FUDAN UNIV
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