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Adhesive resistance release paper for pressing flexible printed circuit board and preparation method of adhesive resistance release paper

A flexible circuit board, release paper technology, applied in special paper, printed circuit manufacturing, laminated printed circuit boards, etc., to achieve the effects of low viscosity, reduced operating procedures, and prevention of poor lamination and air bubbles

Active Publication Date: 2018-06-29
MATSUMOTO COATING TECH KUNSHAN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem mainly solved by the present invention is to provide a kind of adhesive-resistant release paper for flexible circuit board lamination, which not only has the advantages of good adhesive-resistant performance, good flow uniformity of the adhesive layer, and easy tear-off, but also does not contain silicon, is environmentally friendly, and The flexible circuit board will not have the problem of secondary pollution

Method used

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  • Adhesive resistance release paper for pressing flexible printed circuit board and preparation method of adhesive resistance release paper
  • Adhesive resistance release paper for pressing flexible printed circuit board and preparation method of adhesive resistance release paper
  • Adhesive resistance release paper for pressing flexible printed circuit board and preparation method of adhesive resistance release paper

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Embodiment 1: a kind of flexible printed circuit board is laminated with resisting glue release paper, such as image 3 As shown, including a base paper layer 101, a mixed adhesive layer 102 and a release layer 103, the mixed adhesive layer 102 is formed on the surface of the base paper layer 101, and the release layer 103 is formed on the upper surface of the mixed adhesive layer 102, And the mixed adhesive layer 102 bonds the base paper layer 101 and the release layer 103;

[0047] Described release layer is made of following raw material (by weight percentage):

[0048] TPX (poly-4-methylpentene): 70%;

[0049] PP (polypropylene): 30%;

[0050] The mixed adhesive layer is made of the following raw materials (in weight percent):

[0051] TPX (poly-4-methylpentene): 10%;

[0052] PP (polypropylene): 60%;

[0053] EMMA (ethylene-methyl methacrylate copolymer): 15%

[0054] PE (polyethylene): 15%.

[0055] The Vicat softening temperature of the laminated structure...

Embodiment 2

[0066] Embodiment 2: The structure of this embodiment is the same as that of Embodiment 1, and will not be repeated. The difference is that the release layer is made of the following raw materials (by weight): TPX: 80%; PP: 20%;

[0067] The mixed adhesive layer is made of the following raw materials (by weight): TPX: 20%; PP: 70%; EMMA: 5%; PE: 5%.

[0068] The thickness of the release layer 103 is 25 μm, the thickness of the mixed adhesive layer 102 is 60 μm, and the thickness of the base paper layer 101 is 60 μm.

Embodiment 3

[0069] Embodiment 3: The structure of this embodiment is the same as that of Embodiment 1, and will not be repeated. The difference is that the release layer is made of the following raw materials (by weight): TPX: 100%;

[0070] The mixed adhesive layer is made of the following raw materials (by weight): TPX: 30%; PP: 50%; EMMA: 8%; PE: 12%.

[0071] The release layer 103 has a thickness of 30 μm, the mixed adhesive layer 102 has a thickness of 50 μm, and the base paper layer 101 has a thickness of 120 μm.

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Abstract

The invention discloses an adhesive resistance release paper for pressing a flexible printed circuit board. The adhesive resistance release paper comprises a raw paper layer, a mixed adhesive layer and a release layer, the release layer is a TPX-containing release layer, the mixed adhesive layer is an EMMA-containing adhesive layer, the stacked vicat softening temperature of the mixed adhesive layer and the release layer is 150-170 DEG C, the temperature of the FPC pressing process is usually 160-180 DEG C at present, the release paper is fully softened in the pressing process and collapses and clings closely along the concave pit and the corner of the surface of the circuit board, the filling and fitting effects are good, the excellent role of resisting an adhesive is played, the adhesiveresistance release paper has the advantages of excellent levelling property and easiness in tearing, does not contain silicon, a plasticizer or halogen at the same time, and is environmentally friendly, and the problem of secondary pollution of the flexible printed circuit board does not exist after the adhesive resistance release paper is torn off.

Description

technical field [0001] The invention relates to the technical field of release paper and its preparation, in particular to a glue-resistant release paper for flexible circuit board (FPC) fast pressing. Background technique [0002] Flexible Printed Circuit Board (Flexible Printed Circuit Board) referred to as "soft board", commonly known as FPC in the industry, has many advantages that rigid printed circuit boards do not have, such as it can be bent, wound, and folded freely. The use of FPC can greatly reduce the volume of electronic products, which is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communications, laptop computers, computer peripherals, handheld computers and digital cameras and other fields or products. [0003] FPC is mainly made of a flexible copper foil substrate and a protective film by high-temperature laminat...

Claims

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Application Information

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IPC IPC(8): D21H23/50D21H25/04D21H27/20D21H19/22C09J123/12C09J123/20C09J123/06C09J123/08H05K3/00
CPCC08L2205/02C08L2205/035C09J123/12D21H19/22D21H23/50D21H25/04D21H27/20H05K3/0058H05K2203/068C08L23/20C08L23/0869C08L23/06
Inventor 陈辉代明水孙守文
Owner MATSUMOTO COATING TECH KUNSHAN CO LTD
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