Method for recycling chemical copper plating waste liquid

Abstract

The invention discloses a method for recycling a chemical copper plating waste liquid. The method comprises the following steps: (1) collecting the chemical copper plating waste liquid, and adjustingthe pH value of the waste liquid to 9.5-11; (2) performing oxidation complex-breaking treatment on the treated chemical copper plating waste liquid obtained in step (1), performing an oxidation complex-breaking reaction to change dissolved complexed copper into a copper-containing deposit, and keeping the pH value of the waste liquid in the oxidation complex-breaking reaction not less than 9; (3)performing solid-liquid separation to obtain the copper-containing deposit and a filtrate; and (4) adding isopyknic clear water to the copper-containing deposit, uniformly dispersing the deposit, adding an enriching agent, performing a reaction to obtain a copper-rich deposit, separating the copper-rich deposit and the clear water, and drying the copper-rich deposit. The highly pure copper depositis obtained through a simple enriching and purifying technology while performing the oxidation complex-breaking treatment on the dissolved complexed copper in the chemical copper plating waste liquid, so the method realizes recycling of precious metal copper and has significant environmental and economic benefits.

Description

technical field [0001] The invention belongs to the field of high-concentration electroplating waste liquid treatment, and specifically relates to a resource utilization method of electroless copper plating waste liquid. Background technique [0002] Electroless copper plating is one of the most important types of electroless plating at present, and it is also the preferred way to metallize non-metallic materials. It is widely used in the production of large-scale integrated circuit chips in the fields of electronic computers, electronic communications, and household appliances. The electroless copper plating solution is mainly deionized water containing copper salts, complexing agents, reducing agents, stabilizers, pH regulators and other additives. Among them, the commonly used reducing agents are formaldehyde and sodium hypophosphite. The redox corresponding to different reducing agents The overall reaction equation is as follows: [0003] Cu 2+ +2HCHO+4OH - → Cu 0 +2...

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to solve the problems of resource utilization of the current electroless copper plating waste liquid, such as difficulty