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Preparation method for special bonding resin applied to lining stainless steel composite pipes

A technology for bonding resin and polyethylene, applied in the polymer field, can solve the problems of unfavorable high temperature heat preservation, increased thermal conductivity, increased density and thermal conductivity, etc.

Inactive Publication Date: 2018-07-06
SHANGHAI BANGZHONG NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are some shortcomings in the traditional high-temperature adhesive resin used in high-temperature insulation materials: high-temperature adhesive resins mostly use epoxy, phenolic and other resins as the main body of the adhesive resin, supplemented by high-purity graphite powder or ceramic powder, etc. Heat-resistant fillers, and with the addition of these heat-resistant fillers, especially the increase in high thermal conductivity fillers, the density and thermal conductivity of the bonding layer will increase accordingly
In order to obtain the high structural strength of the bonding, the cohesive strength of the bonding resin layer and the compactness of the structure are deliberately pursued, which will eventually lead to an increase in the overall density of the insulation material, and the thermal conductivity of the material will also increase with the increase of the density, which is obvious. Not conducive to high temperature insulation behavior

Method used

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  • Preparation method for special bonding resin applied to lining stainless steel composite pipes

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The binder resin in this embodiment, in parts by weight, its preparation raw materials include: 50 parts of polyethylene, 30 parts of ethyl acetoacetate, 10 parts of diethylene glycol ethyl ether acetate, 10 parts of solid powdery filler, butyl 5 parts of dianhydride. Among them, the molecular weight of polyethylene is 50,000; the solid powder filler is calcium carbonate.

[0021] The preparation method of the bonding resin in the present embodiment comprises the steps: (1) add succinic anhydride after mixing polyethylene, ethyl acetoacetate, diethylene glycol ethyl ether acetate, and solid powdery fillers according to the proportioning ratio, and continue Mix evenly; (2) Apply the mixture obtained in step (1) evenly on the surface of the material to be bonded, press it tightly, and then put it in an oven at 100°C to cure for 1 hour; (3) Move the cured material into the carbonization furnace (4) Vacuumize, heat at 200°C for 2 hours and then cool with the furnace.

Embodiment 2

[0023] The binder resin in this embodiment, in parts by weight, its preparation raw materials include: 80 parts of polyethylene, 40 parts of ethyl acetoacetate, 20 parts of diethylene glycol ethyl ether acetate, 10 parts of solid powdery filler, butyl 5 parts of dianhydride. Among them, the molecular weight of polyethylene is 100,000; the solid powder filler is talcum powder.

[0024] The preparation method of the bonding resin in the present embodiment comprises the steps: (1) add succinic anhydride after mixing polyethylene, ethyl acetoacetate, diethylene glycol ethyl ether acetate, and solid powdery fillers according to the proportioning ratio, and continue Mix evenly; (2) Apply the mixture obtained in step (1) evenly on the surface of the material to be bonded, press it tightly, and then put it in an oven at 95°C to cure for 2 hours; (3) Move the cured material into the carbonization furnace (4) Vacuumize, heat at 200°C for 4 hours and then cool with the furnace.

Embodiment 3

[0026] The binder resin in this embodiment, in parts by weight, its preparation raw materials include: 100 parts of polyethylene, 50 parts of ethyl acetoacetate, 30 parts of diethylene glycol ethyl ether acetate, 10 parts of solid powdery filler, butyl 5 parts of dianhydride. Among them, the molecular weight of polyethylene is 60,000; the solid powder filler is zinc oxide.

[0027] The preparation method of the bonding resin in the present embodiment comprises the steps: (1) add succinic anhydride after mixing polyethylene, ethyl acetoacetate, diethylene glycol ethyl ether acetate, and solid powdery fillers according to the proportioning ratio, and continue Mix evenly; (2) Apply the mixture obtained in step (1) evenly on the surface of the material to be bonded, press it tightly, and then put it in an oven at 100°C to cure for 1 hour; (3) Move the cured material into the carbonization furnace (4) Vacuumize, heat at 200°C for 2 hours and then cool with the furnace.

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Abstract

The invention specifically relates to a special bonding resin applied to lining stainless steel composite pipes, and preparation and application thereof, belonging to the technical field of high polymers. The bonding resin is prepared from the following raw materials by weight: 50-100 parts of polyethylene, 30-50 parts of ethyl acetoacetate, 10-30 parts of diethylene glycol ethyl ether acetate, 5-10 parts of a solid powdery filler and 1 to 5 parts of succinic anhydride. According to the invention, the special bonding resin is prepared on the basis of the characteristics that polyethylene is cheap, ethyl acetoacetate leaves few residues during high-temperature carbonization and diethylene glycol ethyl ether acetate has a great amount of residual carbon during high-temperature carbonization;and a large number of pores are left after carbonization of polyethylene, residual glassy carbon of ethyl acetoacetate and diethylene glycol ethyl ether acetate forms porous carbon in virtue of the pores, thereby forming a porous low-density carbon material layer with low thermal conductivity and the dual functions of heat preservation and bonding.

Description

technical field [0001] The invention belongs to the technical field of macromolecules, and in particular relates to a special adhesive resin for lining stainless steel composite pipes and its preparation and application. Background technique [0002] Bonding is a simple and easy way, and various countries in the world are competing to develop high-temperature bonding resins. However, there are some shortcomings in the traditional high-temperature adhesive resin used in high-temperature insulation materials: high-temperature adhesive resins mostly use epoxy, phenolic and other resins as the main body of the adhesive resin, supplemented by high-purity graphite powder or ceramic powder, etc. Heat-resistant fillers, and with the addition of these heat-resistant fillers, especially the increase in high thermal conductivity fillers, the density and thermal conductivity of the bonding layer will increase accordingly. This is especially prominent on the laminated carbon felt bonded...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J123/06C09J11/06C09J11/04C09J1/00
CPCC09J123/06C08K3/22C08K3/26C08K3/34C08K5/09C08K13/02C08K2003/2296C08K2003/265C09J1/00C09J11/04C09J11/06
Inventor 储江顺毕宏海毕宏江欧阳贵肖传富
Owner SHANGHAI BANGZHONG NEW MATERIAL
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