Intelligent FPC board adsorbing and releasing device

An intelligent, bottom-plate technology, used in conveyor control devices, transportation and packaging, conveyors, etc., can solve the problems of power consumption, high use cost, and loud noise of adsorption devices, and achieve coordinated operation, convenient release, and low power. Effect

Pending Publication Date: 2018-07-13
深圳市升宇智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The first type is to use a vacuum pump to adsorb FPC circuit boards. This adsorption device uses rotating blades to pump air into the container to obtain a vacuum for adsorbing FPC circuit boards. This adsorption device requires the cooperation of airflow and suction nozzles. Airflow device to adsorb, and this kind of adsorption device consumes a lot of power;
[0004] The second type is to use a large flow vacuum generator to adsorb the FPC circuit board. This adsorption device uses the positive pressure air source in the vacuum generator to generate negative pressure to adsorb the FPC circuit board. This is also a new, efficient and clean And economical adsorption method, and this adsorption device also needs airflow and suction nozzles and other devices that cooperate with airflow to adsorb. This kind of device not only consumes power, but also has high cost and high noise;
[0005] The third type is to use a high-pressure fan to adsorb the FPC circuit board. This adsorption device uses the centrifugal force generated when the impeller rotates to prompt the wind vane to guide the gas to move forward and outward, thereby forming a vacuum, and the FPC circuit board is adsorbed by the vacuum. This kind of adsorption device also needs airflow and suction nozzles and other devices that cooperate with the airflow to adsorb. This kind of device not only consumes power, but also has high cost and high noise.

Method used

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  • Intelligent FPC board adsorbing and releasing device
  • Intelligent FPC board adsorbing and releasing device
  • Intelligent FPC board adsorbing and releasing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] as attached figure 1 As shown, an FPC board intelligent pick-and-place device includes a storage mechanism 2, a receiving mechanism 3, and a moving mechanism 1 for moving the FPC circuit board from the storage mechanism 2 to the receiving mechanism 3.

[0030] Please combine the attached figure 1 , 2As shown in and 3, the moving mechanism 1 includes a manipulator 11, a fixed plate 12, a placement plate 13, an adsorption plate 16, a release plate 17 and a plurality of limiting mechanisms 14 that limit the downward movement of the adsorption plate 16, and the manipulator 11 includes a fixed shell 111 and the moving column 112, the moving column 112 is movably arranged on the fixed shell 111, the fixed plate 12 is fixed on the fixed shell 111, the placing plate 13 is fixed with one end of the moving column 112, the placing plate 13 has a plurality of buffer columns 15, The adsorption plate 16 and the release plate 17 are fixed on the lower ends of different buffer column...

Embodiment 2

[0037] Different from Embodiment 1, in this embodiment, the adsorbent is double-sided adhesive, which has strong cohesive force, good waterproof effect, and the double-sided adhesive is easy to cut. Covered on the adsorption plate 16, the double-sided adhesive tape is easy to replace.

Embodiment 3

[0039] The difference from Example 1 is that in this example, the adsorbent is adhesive glue, which has strong cohesive force, good waterproof effect, easy extrusion, no glue leakage, fast surface drying speed, and convenient operation .

[0040] When the FPC board intelligent suction and release device starts, the moving mechanism 1 moves to the top of the bottom plate 21 of the storage mechanism 2 at the preset position, the manipulator 11 presses down, the adsorption piece absorbs the FPC circuit board, and the laser sensing device 18 senses the FPC circuit board. After being located in the laser resonant cavity 181, the moving mechanism 1 moves upwards. When the FPC circuit board moves to position A19, the retaining ring 22 moves the FPC circuit board to prevent the adsorption piece from absorbing multiple FPC circuit boards, and then the moving mechanism 1 moves To the top of the receiving mechanism 3 and press down, the second buffer pad 145 is in contact with the receiv...

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PUM

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Abstract

The invention relates to an intelligent FPC board adsorbing and releasing device comprising a material storage mechanism, a receiving mechanism and a moving mechanism moving a FPC board to the receiving mechanism from the material storage mechanism. A mechanical arm comprises a fixed shell and a moving column. The moving column is movably arranged on the fixed shell. A fixed plate is fixed to thefixed shell. A holding plate is fixed to one end of the moving column. The holding plate is provided with buffering columns. An adsorption plate and a release plate are fixed to the lower ends of thebuffering columns. Multiple limiting mechanisms are located at the two ends of the adsorption plate. The lower surface of the adsorption plate is provided with adsorption pieces which are adhesive materials. The intelligent FPC board adsorbing and releasing device is simple in structure, harmonious in overall operation action, small in power, convenient to assemble and maintain, free of noise andcapable of conveying FPC boards of different sizes.

Description

technical field [0001] The invention relates to an intelligent suction and release device for FPC boards, in particular to an intelligent suction and release device for FPC boards, which relates to the technical field of suction and release equipment. Background technique [0002] In the field of FPC circuit board production, with the development of the times and technology, the production of FPC circuit boards is gradually automated. In order to realize modernization, it is necessary to move the FPC circuit board. The existing FPC circuit board adsorption Devices can be roughly divided into three categories: [0003] The first type is to use a vacuum pump to adsorb FPC circuit boards. This adsorption device uses rotating blades to pump air into the container to obtain a vacuum for adsorbing FPC circuit boards. This adsorption device requires the cooperation of airflow and suction nozzles. Airflow device to adsorb, and this kind of adsorption device consumes a lot of power;...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G47/90B65G43/08H05K3/00
CPCB65G47/901B65G43/08B65G2201/022B65G2203/044H05K3/00
Inventor 刘坚甘珍贵
Owner 深圳市升宇智能科技有限公司
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