Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Epoxy resin conductive adhesive film and preparation method thereof

A technology of epoxy resin and conductive adhesive film, used in conductive adhesives, adhesives, film/sheet adhesives, etc. , low oxidation resistance, etc.

Pending Publication Date: 2018-07-20
GUANGDONG ZHENGYE TECH
View PDF2 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are also some problems in the silver-plated copper powder prepared in the industry at present. The surface of the copper powder is not completely covered by silver, and its conductivity and oxidation resistance are still lower than that of pure silver powder. In addition, the copper ions produced after the coating process cannot be completely removed. Cleaning, these copper ions will promote some resin chemical reactions and bring many unpredictable problems to the production process
[0005] For example, the Chinese patent with the patent number 201510129222.8 uses a large amount of active diluent in order to reduce the reactivity, which leads to the heat resistance temperature of the obtained conductive adhesive is only 230°C, which is not suitable for lead-free soldering above 260°C

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Epoxy resin conductive adhesive film and preparation method thereof
  • Epoxy resin conductive adhesive film and preparation method thereof
  • Epoxy resin conductive adhesive film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0053] The present invention also provides a kind of preparation method of epoxy resin conductive glue film, comprises the following steps:

[0054] In terms of mass fraction, mix 30-50% of silver-plated copper powder, 2-4% of ion scavenger, and 20-30% of epoxy resin in a solvent, and add 25-35% of butane with active groups. Nitrile rubber and 1-3% curing agent to obtain epoxy resin conductive adhesive paste;

[0055] coating the epoxy resin conductive adhesive paste on the base film, and baking to remove the solvent to obtain the epoxy resin conductive adhesive film.

[0056] In the preparation method of the present invention, the types and amounts of the preparation raw materials involved are consistent with the types and amounts of the corresponding raw materials above, and will not be repeated here.

[0057] In the present invention, the baking temperature is preferably 110-130° C., more preferably 115-125° C.; the baking time is preferably 2-3 minutes.

[0058] The inve...

Embodiment 1

[0065] Add 43 parts of flaky silver-plated copper powder, 3 parts of ion scavenger IXE-100, 25 parts of epoxy resin GESR901, add an appropriate amount of solvent and mix well, then add 28 parts of carboxylated nitrile rubber 1072CG, curing agent 4,4' 1 part of diaminodiphenyl sulfone, stirred evenly to prepare conductive adhesive paste. Then, the slurry is coated on the base film by a coating machine, the solvent is removed by baking, and then the conductive adhesive film is obtained.

[0066] The thickness of the conductive adhesive layer in the prepared conductive adhesive film was 10 μm, the thickness of the release film in the base film was 50 μm, the thickness of the black ink layer was 10 μm, and the thickness of the copper layer was 200 μm.

Embodiment 2

[0068] According to the ratio of raw materials in Table 1, the conductive adhesive film was prepared by the preparation method in Example 1.

[0069] The thickness of the conductive adhesive layer in the prepared conductive adhesive film was 10 μm, the thickness of the release film in the base film was 70 μm, the thickness of the black ink layer was 8 μm, and the thickness of the copper layer was 200 μm.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an epoxy resin conductive adhesive film including a base film and an epoxy resin conductive adhesive layer composited on the base film. The epoxy resin conductive adhesive layeris prepared from a mixture consisting of the following components by the mass fraction: 30-50% of a silver-plated copper powder, 2-4% of an ion trapping agent, 20-30 % of epoxy resin, 25-35% of butadiene-acrylonitrile rubber with active groups, and 1-3% of a curing agent. The reactive activity is reduced by trapping metal ions instead of adding active diluents, and the reaction of active group butadiene-acrylonitrile rubber with epoxy resin is catalyzed by the metal ions, a block structure is formed, and eventually, the conductive adhesive film with higher peeling strength and higher heat resistance is obtained. Experimental results show that the peeing strength of the epoxy resin conductive adhesive film is 0.65 N / mm, and the conductive adhesive film can withstand thermal shock for 30 sat the temperature of 300 DEG C. The invention also provides a preparation method of the epoxy resin conductive adhesive film.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to an epoxy resin conductive adhesive film and a preparation method thereof. Background technique [0002] Flexible printed circuit boards are bendable, which meets the requirements of further high performance and miniaturization of tablet computers, communication equipment, mobile phones, etc. in recent years. In order to shield the electromagnetic noise generated by flexible printed circuit boards, flexible printed circuit boards are usually used The electromagnetic wave shielding film that can shield electromagnetic noise is attached to the circuit board. The electromagnetic wave shielding film is generally provided with a conductive adhesive layer on a thinner substrate film in order to better fit the resistant printed circuit board and make it resistant to bending. not damaged. [0003] As the key structure of the electromagnetic wave shielding film, the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09J7/20C09J7/30C09J187/00C09J9/02C08G81/02
CPCC09J9/02C09J187/005C08G81/024C08K9/02C08K2003/0806C09J2463/00C09J2409/00C09J2301/122C09J2301/312C09J2301/408C09J2301/414
Inventor 李磊苏华弟徐地华梅领亮
Owner GUANGDONG ZHENGYE TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com