Photosensitive resin solution and photosensitive dry film of circuit board and preparation methods

A technology of gum resin and circuit board, which is applied in the field of photosensitive resin glue, photosensitive dry film and preparation of circuit board, can solve the problems of affecting the imaging quality of photosensitive dry film, increasing the amount of product scrapping, and slow photosensitive speed, etc., to achieve Fast photosensitive speed, low cost, good adhesion effect

Inactive Publication Date: 2018-07-20
广东鑫丰海电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The film sheets used in the PCB circuit pattern manufacturing process need to be protected by a protective film. At present, the existing photosensitive stems have problems of exposure and development image resolution, low resolution, slow photosensitive speed, and low adhesion. Phenomenon, which greatly affects the imaging quality of photosensitive dry film and increases the amount of product scrap

Method used

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  • Photosensitive resin solution and photosensitive dry film of circuit board and preparation methods
  • Photosensitive resin solution and photosensitive dry film of circuit board and preparation methods
  • Photosensitive resin solution and photosensitive dry film of circuit board and preparation methods

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] The chemical composition of the circuit board photosensitive adhesive resin glue of the first embodiment of table 1

[0043]

[0044]

[0045] Based on the materials in Table 1, the preparation method of the first circuit board photosensitive adhesive resin glue is as follows:

[0046] (1) Raw glue preparation: 1.5 parts of ethyl p-dimethylaminobenzoate (EDB), 6.1 parts of n-alkyl methacrylate, 5.1 parts of polystyrene, 13 parts of methacrylic acid, 3 parts of 2-butyl acrylate Esters, 3.5 parts of 2,2'-azobisisobutyronitrile are fully mixed and 20 parts of methyl ethyl ketone are added to the reaction axe, and heated to 60 degrees Celsius, the chemical reaction starts, and evenly stirred for 48 hours to obtain the raw gum liquid;

[0047] (2) Photosensitive adhesive preparation: 1.3 parts of ethyl p-dimethylaminobenzoate (EDB), 3.3 parts of 4,4'-bis(diethylamino)benzophenone, 3.0 parts of ETPTA, 2.4 parts of polypropylene glycol dimethyl Base acrylate, 3.0 parts...

Embodiment 2

[0051] The chemical composition of the circuit board photosensitive adhesive resin glue of the 2nd embodiment of table 2

[0052]

[0053]

[0054] Based on the materials in Table 2, the preparation method of the second circuit board photosensitive adhesive resin glue is as follows:

[0055] (1) Preparation of the original glue solution: 1 part of ethyl p-dimethylaminobenzoate, 7.5 parts of n-propyl methacrylate, 4.5 parts of expandable polystyrene (EPS), 14 parts of 2-methacrylic acid, 2.8 Mix one part of 2-butyl acrylate and 4 parts of 2,2'-azobisisobutyronitrile and add 25 parts of 2-oxobutane into the reaction axe, and heat it to 60 degrees Celsius, the chemical reaction starts, and stir evenly After 48 hours, the original glue solution was obtained;

[0056] (2) Photosensitive adhesive preparation: 1.3 parts of ethyl p-dimethylaminobenzoate, 3.8 parts of MCO, 2.5 parts of ETPTA, 3.3 parts of polypropylene glycol dimethacrylate, 2.7 parts of polyethylene glycol diac...

Embodiment 3

[0060] The chemical composition of the circuit board photosensitive adhesive resin glue of the 3rd embodiment of table 3

[0061]

[0062] Based on the materials in Table 3, the preparation method of the third circuit board photosensitive adhesive resin glue is as follows:

[0063] (1) Preparation of the original glue solution: 1.3 parts of ethyl 4-dimethylaminobenzoate, 6.5 parts of methacrylate stearate, 4.8 parts of high impact polystyrene (HIPS), 12 parts of MAA, 2.9 parts Mix n-butyl acrylate, 3.8 parts of 2,2'-diazoisobutyronitrile and add 20 parts of MEK into the reaction axe, and heat it to 60 degrees Celsius, the chemical reaction starts, and stir evenly for 48 hours to obtain the raw gum liquid;

[0064] (2) Preparation of photosensitive adhesive: 1.2 parts of ethyl 4-dimethylaminobenzoate, 3.2 parts of 4,4'-di(diethylamino)benzophenone, 2.8 parts of ETPTA, 3 parts of polypropylene glycol dimethyl Acrylic ester, 2.9 parts of polyethylene glycol diacrylate, 2.2 p...

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Abstract

The invention discloses a photosensitive resin solution and a photosensitive dry film of a circuit board and preparation methods. The photosensitive resin solution of the circuit board comprises the following raw material ingredients: a methyl methacrylate monomer, a styrene monomer, a methacrylic acid monomer, butyl acrylate, azodiisobutyronitrile, ethyl 4-dimethylaminobenzoate, tetraethyl Michler ketone, ethoxylated trimethylolpropane triacrylate, polypropylene glycol acrylate, polyethylene glycol diacrylatebisphenol A polyoxyethylene ether dimethacrylate, crystal violet, basic green, a polymerization inhibitor, butanone and methanol. The photosensitive dry film prepared from the photosensitive resin solution is excellent in photodecomposability, photo-crosslinking and photopolymerization, can generate a high resolution of an exposure developed image, and is high in photosensitive speed and good in adhesion.

Description

technical field [0001] The invention relates to the technology in the field of chemical products, in particular to a circuit board photosensitive adhesive resin glue, a photosensitive dry film and a preparation method. Background technique [0002] The continuous progress of the information and communication industry has driven the rapid development of the microelectronics industry, and printed circuit boards (PCBs) have been more widely used in many fields such as mobile phones, notebook computers, and liquid crystal displays. The film sheets used in the PCB circuit pattern manufacturing process need to be protected by a protective film. At present, the existing photosensitive stems have problems of exposure and development image resolution, low resolution, slow photosensitive speed, and low adhesion. Phenomenon, which greatly affects the imaging quality of photosensitive dry film and increases the amount of product scrap. Contents of the invention [0003] In view of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/00
CPCG03F7/00G03F7/027
Inventor 谭勇
Owner 广东鑫丰海电子科技有限公司
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