Winding type PVD physics deposition vacuum magnetron sputtering silver-plated copper alloy layer method

A vacuum magnetron sputtering and silver-plated copper alloy technology, which is applied in sputtering coating, vacuum evaporation coating, metal material coating process, etc., can solve electromagnetic wave protection, shielding signal interference, environmental pollution, and low production efficiency and other issues to achieve the effect of improving production efficiency and product quality, improving shielding effect, and saving production time

Inactive Publication Date: 2018-07-27
广东鑫丰海电子科技有限公司
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Due to the extreme demand for light and thin electronic communication products, the requirements for electromagnetic wave protection and signal interference shielding are getting higher and higher. The traditional sputtering process generally only sputters one kind of metal layer, which has a large resistance and cannot achieve high 5G communication. request etc.
There are also many problems in the traditional electroplating process. Electroplating also contains certain toxic and harmful substances. The processing process is complicated, the processing cost is high, and there is still some pollution to the environment.
Large energy consumption, complex process, low production efficiency, high cost, and not environmentally friendly

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] In order to make the object, technical solution and technical effect of the present invention clearer, the present invention will be further described below in conjunction with specific embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0022] The invention provides a winding-type PVD physical deposition method for vacuum magnetron sputtering silver-plated copper alloy layer, which is applied in the fields of electromagnetic wave protection, shielding signal interference, electromagnetic shielding film and the like. Including the following method steps:

[0023] (1) Pretreatment: prepare magnetron sputtering equipment, perform sputtering ion source cleaning layer on the PET base film, eliminate impurities on the film surface, and form a clear sputtering layer of the bottom ion source;

[0024] (2) Open the vacuum chamber and install the sample dish loade...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

The invention discloses a winding type PVD physics deposition vacuum magnetron sputtering silver-plated copper alloy layer method. The winding type PVD physics deposition vacuum magnetron sputtering silver-plated copper alloy layer method comprises the following steps of purification preprocessing on the surface of a PET basal lamina, vacuum pumping, filling inert gas, heating, sputtering and compounding a plurality of metal layers and the like. The aggregate thickness of the magnetron sputtering silver-plated copper alloy layer is quite thin, and production time is effectively saved; and thesurface layer of the PET basal lamina can achieve the effect of current conduction, electromagnetic wave protection and shielding signal interference, a compound alloy layer can greatly improve the barrier property between a conducting layer and external media, the overall shielding effect is improved by the electromagnetic wave protection and the shielding signal interference.

Description

technical field [0001] The invention relates to the technical field of electromagnetic wave protection and signal interference shielding, in particular to a winding-type PVD physical deposition vacuum magnetron sputtering silver-plated copper alloy layer method. Background technique [0002] Due to the extreme demand for light and thin electronic communication products, the requirements for electromagnetic wave protection and signal interference shielding are getting higher and higher. The traditional sputtering process generally only sputters one kind of metal layer, which has a large resistance and cannot achieve high 5G communication. request etc. There are also many problems in the traditional electroplating process. Electroplating also contains certain toxic and harmful substances. The processing process is complicated, the processing cost is high, and there is still some pollution to the environment. High energy consumption, complex process, low production efficiency,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/16C23C14/20C23C14/35
Inventor 谭勇
Owner 广东鑫丰海电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap