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Ultraviolet light curing composition, and preparation method and application thereof

A technology of ultraviolet light and composition, applied in the direction of organic chemistry, additive processing, etc., can solve the problem of low tensile strength

Active Publication Date: 2018-08-03
FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

It can be seen that although the elongation at break of the 3D printing materials disclosed in these two documents is high, their tensile strength is low, which still cannot meet the increasing demand for high-performance 3D printing.

Method used

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  • Ultraviolet light curing composition, and preparation method and application thereof
  • Ultraviolet light curing composition, and preparation method and application thereof
  • Ultraviolet light curing composition, and preparation method and application thereof

Examples

Experimental program
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Effect test

Embodiment

[0070] 1. In a 500ml four-necked flask with mechanical stirring, temperature control thermocouple and condensing tube, add diisocyanate trimer (HDI trimer), catalyst (dilaurel Dibutyltin acid, stannous octoate) and polymerization inhibitors (p-hydroxyanisole, hydroquinone), and the commercial product of HDI trimer is Bayer's N3600 or N-3300. Heat and stir, keep the temperature at 65°C for 30min. Add hydroxyacrylates (hydroxyethyl methacrylate, hydroxyethyl acrylate, hydroxypropyl acrylate) dropwise to the dropping funnel. After the addition is complete, titrate the -NCO content with di-n-butylamine until the -NCO is completely reacted.

[0071] 2. Take by weighing the photocurable prepolymer in the above step 1 in a beaker according to Examples 1-9 in Table 2, and add a photoinitiator (1-hydroxycyclohexyl phenyl ketone, 2, 4,6 (trimethylbenzoyl) diphenylphosphine oxide) and diluents (hydroxyethyl methacrylate, tripropylene glycol diacrylate, trimethylolpropane triacrylate), a...

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Abstract

The invention provides an ultraviolet light curing composition used for 3D printing, and a preparation method and an application thereof. The composition comprises an ultraviolet light curing prepolymer as shown in a formula (I) which is described in the specification, wherein the usage amount of the ultraviolet light curing prepolymer accounts for 55 wt% or more of the total weight of the composition. The ultraviolet light curing composition provided by the invention has the advantages of high tensile strength, etc., and can be used as a 3D printing material and a light curing material; curedresin prepared from the composition provided by the invention has the advantages of low shrinkage rate, high-temperature resistance, fast curing speed, etc., and is applicable to curing through a manner of 3D printing.

Description

technical field [0001] The invention relates to the technical field of photocurable materials, in particular to an ultraviolet photocurable composition and its preparation method and application. Background technique [0002] 3D printing (Three Dimension Printing) is a rapid prototyping technology based on digital models. It can be used in the automotive industry such as mold manufacturing and auto parts printing, and can also be used in medical industries such as human organ printing and tooth printing. 3D printing can print objects with complex structures in a short period of time at a relatively low cost, and has developed rapidly around the world in recent years. Photocurable resin (also known as photosensitive resin), especially UV curable resin is the main raw material of 3D printing technologies such as laser stereolithography (Stereo Lithography Apparatus, SLA) and digital light processing (Digital Light Processing, DLP); The curing resin is irradiated by ultraviole...

Claims

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Application Information

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IPC IPC(8): C08F222/22C08F220/20C08F222/20C08F222/14C07D251/30B33Y70/00
CPCC07D251/30C08F222/22B33Y70/00C08F222/103C08F220/20C08F222/102
Inventor 周照喜李悦微许莹吴立新
Owner FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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