A display panel, its manufacturing method and display device

A display panel and encapsulation layer technology, which is applied in the field of display panel, display device, and its preparation, can solve problems such as rising cost, reduced device life, and reduced production efficiency, so as to improve density, increase production efficiency, and reduce the number of film layers Effect

Active Publication Date: 2019-12-27
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Among them, due to the existence of intrinsic cohesive stress in the inorganic layer prepared by the existing process, there are pinholes (PinHole) at the grain boundary, that is, the gap between the grains
Pinholes provide channels for water and oxygen penetration, resulting in reduced device life; in addition, in order to ensure a sufficiently low water vapor transmission rate (Water Vapor Transmission Rate, WVTR), the number of composite layers must be increased. The higher the number of layers, the different chambers More changeovers, resulting in higher costs and lower productivity

Method used

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  • A display panel, its manufacturing method and display device
  • A display panel, its manufacturing method and display device
  • A display panel, its manufacturing method and display device

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preparation example Construction

[0050] The embodiment of the present invention also provides a method for preparing a display panel, including forming an encapsulation layer covering the display substrate, the encapsulation layer including an inorganic composite film layer, and the step of forming the inorganic composite film layer includes:

[0051] forming an inorganic matrix, the inorganic matrix comprising a plurality of crystal grains with voids between the crystal grains;

[0052] Spray the slurry on the inorganic matrix, the slurry gradually penetrates into the inorganic matrix, and after heating to remove the solvent in the slurry, an inorganic filler that wraps the crystal grains and fills the gaps is formed , the inorganic matrix and the inorganic filler together constitute an inorganic composite membrane.

[0053] According to the present invention, the encapsulation layer also includes an organic film layer, and the method for forming the encapsulation layer is:

[0054] Alternately forming orga...

Embodiment 1

[0079] Step S1: forming an organic film layer;

[0080] Step S2: forming a silicon nitride inorganic matrix on the organic film layer;

[0081] Preparation of 12%BaO-16%B 2 o 3 -9%Al 2 o 3 -63%SiO2 2 Glass sol, respectively select the highly active precursors of the target product, barium acetate, boric acid, aluminum nitrate nonahydrate, and ethyl silicate, and dissolve them in their respective organic solvents, such as glacial acetic acid, alcohol, etc., and mix them in a certain order to form a sol , and then add diethylenetriamine to the sol to form a gel, spray the prepared gel evenly on the surface of the inorganic substrate, heat it in the range of 280-340°C, and after the solvent evaporates, the slurry of the glass component in the amorphous state The material will fill the gaps in the film layer to form an inorganic composite film layer.

[0082] Step S3: forming an organic film layer on the inorganic composite film layer;

[0083] Repeat step S2 and step S3 un...

Embodiment 2

[0085] Step S1: forming an organic film layer;

[0086] Step S2: forming a silicon nitride inorganic matrix on the organic film layer;

[0087] Preparation of 8%CaO-8%MgO-17%Al 2 o 3 -67% SiO2 2 For glass sol, the highly active precursors of the target product, calcium nitrate tetrahydrate, magnesium nitrate hexahydrate, aluminum nitrate nonahydrate, and ethyl silicate, are also selected and dissolved in their respective organic solvents, and added in a certain order to form a sol, and then added to the sol Diethylenetriamine is added to form a gel, and the prepared gel is evenly sprayed on the surface of the inorganic substrate, and heated in the range of 280-340°C. After the solvent evaporates, the slurry of the amorphous glass component will adhere to the film. The gaps in the layer are filled to form an inorganic composite film layer.

[0088] Step S3: forming an organic film layer on the inorganic composite film layer;

[0089] Repeat step S2 and step S3 until at lea...

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Abstract

The invention relates to the display field, in particular to a display panel, a preparation method thereof and a display device. The display panel includes a display substrate and an encapsulation layer for encapsulating the display substrate, the encapsulation layer includes an inorganic composite film layer, the inorganic composite film layer includes an inorganic matrix and an inorganic filler, and the inorganic matrix includes a plurality of Crystal grains, there are gaps between the crystal grains, and the inorganic filler wraps the crystal grains in the inorganic matrix and fills the gaps. In the present invention, the inorganic filler fully infiltrates into the matrix, envelops the crystal grains in the matrix to form a shell-core structure, and the inorganic filler exists at the grain boundary, which reduces the intrinsic cohesive stress, and then fills the gaps existing at the grain boundary. The function increases the density of the inorganic composite film layer, thereby reducing the water oxygen transmission rate of the inorganic composite film layer.

Description

technical field [0001] The invention relates to the display field, in particular to a display panel, a preparation method thereof and a display device. Background technique [0002] In the field of display technology, OLED (Organic Lighting-Emitting Diodes, organic light-emitting diode display) has become the most advanced technology due to its advantages of self-luminescence, simple structure, ultra-thin, fast response, wide viewing angle, low power consumption and flexible display. One of the display technologies with development potential. Different from the traditional way of encapsulating with a glass cover, because OLED can realize the flexible display function of bending, Thin Film Encapsulation (TFE, Thin Film Encapsulation) is the main development direction of OLED device encapsulation at present. [0003] Barix multilayer thin-film packaging technology is currently a relatively promising packaging technology. The Barix packaging layer improves the water vapor barr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L27/32
CPCH10K59/00H10K50/84Y02E10/549H10K77/111H10K50/844H10K2102/311H10K71/00H10K59/12H10K71/10
Inventor 刘剑峰杨妮董中飞齐智坚李云泽刘信
Owner BOE TECH GRP CO LTD
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