Method for integrating three-dimensional conductive metal micro-nano structure inside transparent material

Abstract

The invention discloses a method for integrating a three-dimensional conductive metal micro-nano structure inside a transparent material. The method comprises the following steps: firstly, preparing athree-dimensional micro-channel inside the transparent material by using the femtosecond laser micro-machining technology; and then continuously transmitting electroless plating solution through a peristaltic pump, carrying out surface modification and metal deposition inside the channel through the micro-channel, so that the three-dimensional conductive metal micro-nano structure is integrated inside the transparent material. According to the integrated three-dimensional conductive metal micro-nano structure manufactured by the invention, the space shape can be randomly designed, the size isadjustable, the electrical conductivity is high, and the melting point is high; and the integrated three-dimensional conductive metal micro-nano structure has great application prospect in the technical fields of microelectronic devices, optoelectronic devices, micro-nano motor systems and the like.

Description

technical field [0001] The invention relates to three-dimensional metal structure manufacturing and femtosecond laser micromachining, in particular to a method for integrating a three-dimensional conductive metal micro-nano structure in a transparent material by combining femtosecond laser micromachining and flow chemical plating. The invention is suitable for integrating a three-dimensional conductive metal micro-nano structure inside various transparent materials such as glass, crystal and transparent polymer. Background technique [0002] The three-dimensional metal micro-nano structure integrates the characteristics of metal and three-dimensional micro-nano structure, and has shown great application potential in the fields of microelectronics, optoelectronics, biomedicine and so on. Based on the above characteristics, people are exploring the integration of three-dimensional metal micro-nano structures on the chip to enhance the functionality and active regulation capabi...

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to overcome the disadvantages of the existing three-dimensional conductive metal micro-nano structure integrated in the transparent material, such as the use stability of the metal micro-nano structure, inflexible spatial geometric configuration of the metal structure, and limited precision, etc., to provide A three-dimensional metal micro-nano structure integration method that is efficient, fast, and three-dimensional shape design inside a transparent material, and can work stably and firmly

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