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A kind of silicone rubber sheet with antistatic heat conduction function and preparation method thereof

A silicone rubber sheet, anti-static technology, applied in the direction of heat exchange materials, chemical instruments and methods, can solve the problem of only focusing on thermal conductivity, ignoring the anti-static ability of products, etc., to improve anti-static ability, reduce harmfulness, cost saving effect

Active Publication Date: 2020-07-31
SHANGHAI LEVSON ENTERPRISE GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the problem that traditional thermal pads only pay attention to thermal conductivity and ignore the antistatic ability of products, and provide a silicone rubber sheet with antistatic thermal conductivity and its preparation method. The silicone rubber sheet has both thermal conductivity and antistatic ability

Method used

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  • A kind of silicone rubber sheet with antistatic heat conduction function and preparation method thereof
  • A kind of silicone rubber sheet with antistatic heat conduction function and preparation method thereof
  • A kind of silicone rubber sheet with antistatic heat conduction function and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0029] A method for preparing a silicone rubber sheet with antistatic and heat conduction functions is prepared according to the following steps:

[0030] (1) Add to 50g of liquid silicone gel component A to meet the conditions (according to the GB / T-24521-2009 standard test, the volume resistivity of the conductive agent powder is ≤10 under the pressure of 20-30MPa -3 Ω·cm) conductive agent conductive carbon black powder 5.6g, use 500W power to ultrasonically disperse for 0.5 hours; add 5.6g of conductive agent conductive carbon black powder that meets the conditions to 50g liquid silicone gel B component, use 500W power to ultrasonically disperse 0.5 hours.

[0031] (2) Select 150g of magnesium oxide powder with a sheet diameter of 2μm, 375g of α-spherical alumina with a particle size of 90μm, and 225g of α-spherical alumina with a particle size of 45μm for compound mixing, and then add it to 300ml to dissolve 1g of A174 In the 95% ethanol solution of the joint agent, use a...

Embodiment 2

[0035] A method for preparing a silicone rubber sheet with antistatic and heat conduction functions is prepared according to the following steps:

[0036] (1) Add to 50g of liquid silicone gel component A to meet the conditions (according to the GB / T-24521-2009 standard test, the volume resistivity of the conductive agent powder is ≤10 under the pressure of 20-30MPa -3 Ω cm) conductive agent graphene powder 5.6g, use 1000W power ultrasonic dispersion for 0.5 hours; add 5.6g conductive agent graphene powder meeting the conditions to 50g liquid silicone gel B component, use 1000W power ultrasonic dispersion 0.5 hours.

[0037](2) Select 150g of hexagonal boron nitride powder with a diameter of 2μm, 375g of α-spherical alumina with a particle size of 90μm, and 225g of α-spherical alumina with a particle size of 45μm for compound mixing, and then add it to 300ml to dissolve 1g of KH560 coupling agent in 95% ethanol solution, disperse with high-speed disperser for 2 hours, dry in ...

Embodiment 3

[0041] A method for preparing a silicone rubber sheet with antistatic and heat conduction functions is prepared according to the following steps:

[0042] (1) Add to 50g of liquid silicone gel component A to meet the conditions (according to the GB / T-24521-2009 standard test, the volume resistivity of the conductive agent powder is ≤10 under the pressure of 20-30MPa -3 Ω·cm) conductive agent graphite fiber powder 5.6g, use 800W power to ultrasonically disperse for 0.5 hours; add conductive agent graphite fiber powder 5.6g to 50g liquid silicone gel B component, use 800W power to ultrasonically disperse for 0.5 hours .

[0043] (2) Select 150g of hexagonal boron nitride powder with a diameter of 2μm, 375g of α-spherical alumina with a particle size of 90μm, and 225g of α-spherical alumina with a particle size of 45μm for compound mixing, and then add it to 300ml to dissolve 1g of KH560 coupling agent in 95% ethanol solution, disperse with high-speed disperser for 2 hours, dry ...

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Abstract

The invention provides a silicone rubber sheet with antistatic and heat conduction functions and a preparation method thereof, and belongs to the field of antistatic heat-conduction composite materials, and relates to an antistatic and heat-conduction flexible sheet for electronic circuit boards, thermal power components and thermal interface sealants, wherein the antistatic and heat-conduction flexible sheet is prepared by treating liquid silicone gel with a conductive agent and then compounding the liquid silicone gel with modifying heat conductive powder for thermally curing under certain conditions. The antistatic and heat-conduction flexible sheet comprises a liquid silicone gel matrix containing A and B components treated with the conductive agent and the heat conductive inorganic filler powder obtained by compounding of a plurality of different types and different particle sizes and treatment by use of a coupling agent. The antistatic and heat-conduction flexible sheet can be mass-produced by calendaring and thermocuring by a multi-roll calendar. The surface resistance of the sheet can be adjusted within a range of 10<5>-10<9>, the stripping electrostatic voltage is <1 KV, and the thermal conductivity is up to 5.2 W / mk or more.

Description

technical field [0001] The invention belongs to the field of preparation of composite materials, and relates to a preparation method of a multifunctional composite material, in particular to a preparation method of a silicone rubber sheet with antistatic and heat conduction functions. Background technique [0002] The miniaturization of today's electronic products, such as mobile phones, tablet computers, readers, computers, etc., has led to higher integration of integrated circuits and higher packaging requirements. During the packaging process, the electrostatic hazards generated by the accessories themselves cannot be ignored. Another On the one hand, the ensuing heat dissipation problem also restricts the development of consumer electronics to be thin, light, small, and portable. Before the popularization and application of high-temperature superconducting materials, it is very important to explore new materials with good antistatic performance, high thermal conductivity...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/04C08K13/06C08K9/06C08K7/18C08K3/22C08K3/04C08K3/38C08K7/06C08K3/28C09K5/14
CPCC08K2003/222C08K2003/282C08K2003/385C08K2201/001C08K2201/003C08L83/04C08L2201/04C08L2205/025C09K5/14C08K13/06C08K9/06C08K7/18C08K3/22C08K3/04C08K3/38C08K3/042C08K7/06C08K3/041C08K3/28
Inventor 贺祖章张燕萍赵志国
Owner SHANGHAI LEVSON ENTERPRISE GRP
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