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A kind of electroplating solution and method

A solution and copper electroplating technology, which is applied in the field of electroplating, can solve the problems of easy decomposition of inhibitors and limited inhibitory effect, and achieve the effects of improving filling conditions, improving stability, and improving deep plating ability

Active Publication Date: 2021-02-09
陈深彻
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide an electroplating solution and an electroplating method to solve the problem that the inhibitor in the existing electroplating solution is easy to decompose and the inhibitory effect is limited

Method used

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  • A kind of electroplating solution and method
  • A kind of electroplating solution and method
  • A kind of electroplating solution and method

Examples

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Effect test

Embodiment 1

[0037]The molecular structure of the inhibitor in Example 1 includes a branch node cyclohexane and 3 linking units polyethylene oxide directly connected to the cyclohexane. The molecular weight of the inhibitor in Example 1 is 2000 to 4000. The molecular structure of the inhibitor in Example 2 includes a branch node cyclohexane. Cyclohexane is directly connected to 3 connecting units of polyethylene oxide and then connected to 3 polypropylene oxides respectively. Example 2 Inhibitor molecule relative molecule The quality is 5000 to 10000. The molecular structure of the inhibitor in Example 3 includes a branch node triphenylamine. Triphenylamine is directly connected to three connecting units of polyethylene oxide and then connected to three polypropylene oxides respectively. In Example 3, the relative molecular mass of the inhibitor molecule is 5000 to 10000. The molecular structure of the inhibitor in Example 4 includes a branch node, tetraphenylethane, and 4 connection units direc...

Embodiment 5

[0041]Embodiment 5 is a through-hole electroplating solution based on pulse electroplating prepared according to the foregoing embodiment 2. The specific components are shown in Table 2:

[0042]Table 2

[0043] Serial number Component content 1Inhibitor of Example 2 100mg / L 2Brightener SPS 1mg / L 3Copper sulfate pentahydrate 75g / L 4sulfuric acid 240g / L 5Chloride 50mg / L

[0044]The high aspect ratio electroplating solution prepared in Example 5 mainly adopts pulse electroplating. The electroplating parameters are: forward current density 2ASD, reverse current density 6ASD, forward current time 60ms, reverse current time 3ms, and electroplating time 90 minutes. The finally formed multi-layer board with a plating aperture of 10miI and a hole depth of 120mi1. After the through-hole is plated, the through-hole position is sliced, and the sliced ​​inspection results are as followsfigure 2 As shown, the thickness of the surface copper is 26 μm, and the thickness of the through-hole copper ...

Embodiment 6

[0045]Example 6 is a hole-filling electroplating solution based on direct current electroplating prepared according to the foregoing Example 2. The specific components are shown in Table 3:

[0046]table 3

[0047] Serial number Component content 1Inhibitor of Example 2 150mg / L 2Brightener SPS 5mg / L 3Leveler Gena Green B 10mg / L 4Copper sulfate pentahydrate 230g / L 5sulfuric acid 100g / L 6Chloride 50mg / L

[0048]The hole-filling electroplating solution prepared in Example 6 adopts direct current electroplating. The electroplating parameters are: current density 1ASD plating HDI template with 4miI hole diameter and 2miI hole depth. The electroplating time is 60 minutes. The result isimage 3 As shown, the thickness of the surface copper is 14 μm, and the hole filling position is 0 μm.

[0049]Through the above embodiments, the electroplating solution of the present invention adopts a new type of branched inhibitor, which can be achieved by matching the inhibitor with the electroplating ion ...

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Abstract

The invention relates to an electroplating solution and method. The electroplating solution comprises metal ions, an electrolyte solution, halide ions, brightening agent and at least one inhibitor. The molecular structure of the inhibitors comprises branch nodes and connecting units, and the branch nodes are connected with the connecting units. The electroplating solution provided by the inventionhas high stability and covering power, and can play an important role in the production industries like printed circuit boards, integrated circuit boards and semiconductors.

Description

Technical field[0001]The present invention relates to the technical field of electroplating solutions and electroplating methods. More specifically, the present invention relates to an electroplating solution and a method used for decorative electroplating, through hole electroplating, blind hole electroplating, through hole filling, blind hole filling, thin line electroplating , Copper pillar bump plating and many other electroplating methods.Background technique[0002]Electroplating is to use the principle of electrolysis to spread a layer of metal on conductive metal to achieve certain specific purposes. Metal or alloy plating can be used to decorate and increase material properties, such as oxidation resistance, wear resistance, weldability, etc. Electroplating technology is also widely used in printed circuit boards, integrated circuits, semiconductors and other fields. The above-mentioned substrates generally contain connection designs such as through holes, blind holes or buri...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/02
CPCC25D3/02
Inventor 彭博宇
Owner 陈深彻
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