Refrigerant cooling system with high temperature stability

Abstract

The invention relates to the technical field of heat exchange, and relates to a refrigerant cooling system with high temperature stability. The system comprises a variable-frequency compressor, a condenser, a radiator and a phase-change energy storage unit, wherein the radiator is in contact with heat generating components, and the phase-change energy storage unit is arranged on the radiator; thephase change energy storage unit comprises a high-temperature phase-change material, a medium-temperature phase-change material and a low-temperature phase-change material which are not less than three phase change points in different temperature areas; the high-temperature, the medium-temperature and low-temperature phase-change materials are made of non-metal materials and are correspondingly and independently arranged on the radiator; the phase-change temperature of the medium-temperature phase-change material is the working temperature of the radiator; and a refrigerant pipeline and a coldmedium flowing through the refrigerant pipeline are arranged in the radiator. According to the refrigerant cooling system with high temperature stability, the refrigerant cooling technology and the phase change energy storage technology are organically combined, phase change materials with three or more than three phase change points in different temperature zones are used, multiple temperature buffering and temperature control signals are provided, the temperature runaway risk is reduced, and the problem that a traditional refrigerant cooling system is insufficient in temperature stability when the loss is changed is solved.

Description

technical field [0001] The invention relates to the technical field of heat exchange, in particular to a high-temperature-stable refrigerant cooling system, which uses solid-liquid phase-change materials with different phase-change points to maintain temperature stability. Background technique [0002] With the continuous development of processing technology, the integration degree of electronic devices is getting higher and higher, and the power density of its heat generation is also increasing. High power density heat dissipation technology has always been a research hotspot in the field of thermal control. Refrigerant direct cooling is a kind of phase change cooling. It is a cooling method with high power density and temperature control. It has been applied in power electronic device cooling and data center temperature control. In the foreseeable future, it will also be used in other It is widely used in the field of heat dissipation technology that requires high power de...

AI Technical Summary

Problems solved by technology

The latent heat value of the evaporation phase transition is high, the ratio of the heat dissipation to the mass flow rate of the cooling medium is large, the heat capacity of the system itself is small, the supply of the cooling medium is controlled by mechanical and thermodynamic components, and the response and stability are slow. When the device loss changes rapidly , since the supply of cooling medium cannot quickly follow the response, the temperature of the device will also change rapidly, which will cause the device to be damaged by temperature stress or burn out directly

[0004] In the existing refrigerant cooling system, only a single phase change material is used. When the system is out of control, the phase change material may be completely melted or completely solidified. risk; and in the prior art, the heat-generating device, the phase-change metal, and the evaporator are connected in series on the heat transfer path. Compared with the direct contact between the device and the evaporator, an additional phase-change metal is introduced into the heat transfer path. Thermal resistance, in the application of high heat flux heat dissipation, will increase the temperature of the cooled device; phase change metals are conductive, and the phase change of the substance will be accompanied by volume changes. If the pressure in the packaging box is too high and the phase change metal leaks, It is easy to cause the device to be short-circuited and burned

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