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Anti-flaming epoxy resin composition capable of serving as electronic packaging material and preparation method thereof

An electronic packaging material and epoxy resin technology, applied in the field of electronic packaging materials, can solve problems such as affecting human health and the environment, banning flame retardants, human and animal hazards, etc., achieving excellent heat resistance, high flame retardant efficiency, The effect of excellent flame retardancy and flame retardancy

Active Publication Date: 2018-09-04
吴先锋
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the halogen and antimony trioxide flame retardant materials used for epoxy resin flame retardant have been proved to be harmful to human body and animals, and these flame retardants will produce toxic smoke such as dioxin (Dioxin) when burned and corrosive gases (such as hydrogen bromide), seriously affecting human health and the environment; at the same time, this type of flame retardant has been banned by the European Union

Method used

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  • Anti-flaming epoxy resin composition capable of serving as electronic packaging material and preparation method thereof
  • Anti-flaming epoxy resin composition capable of serving as electronic packaging material and preparation method thereof
  • Anti-flaming epoxy resin composition capable of serving as electronic packaging material and preparation method thereof

Examples

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Effect test

Embodiment 1

[0036] A preparation method of a flame-retardant epoxy resin composition that can be used for electronic packaging materials, the steps are as follows:

[0037] Pre-mix epoxy resin Ⅰ, self-made halogen-free flame-retardant epoxy resin (A), curing agent, curing accelerator, inorganic filler and flame-retardant synergist according to the proportion by mass, and the pre-mixing time is 3 to 10 minutes , speed 600-1200r / min; melt extrusion mixing, extruder temperature 80-160°C, extruder speed 800-2400r / min, tablet cooling and crushing, crushing and sieving through ACM mill, to obtain the epoxy resin composition.

[0038] Wherein, the synthetic method of halogen-free flame-retardant epoxy resin resin (A):

[0039] (1) After the four-necked flask, stirrer, condenser tube and temperature-controlled heating mantle are finished, add 570g of CYD128 (Baling Petrochemical, bisphenol A epoxy resin, epoxy value 0.515-0.543eq / 100g), and slowly raise the temperature to 145 ~155°C, carry out ...

Embodiment 2

[0045] A preparation method of a flame-retardant epoxy resin composition that can be used for electronic packaging materials, the steps are as follows:

[0046] Premix epoxy resin Ⅰ, self-made halogen-free flame-retardant epoxy resin (B), curing agent, curing accelerator, inorganic filler and flame-retardant synergist according to the proportion by mass, and the pre-mixing time is 3 to 10 minutes , speed 600-1200r / min; melt extrusion mixing, extruder temperature 80-160°C, extruder speed 800-2400r / min, tablet cooling and crushing, crushing and sieving through ACM mill, to obtain the epoxy resin composition.

[0047] Wherein, the synthetic method of halogen-free flame-retardant epoxy resin resin (B):

[0048] (1) After the four-neck flask, stirrer, condenser tube and temperature control heating mantle are finished, add 550g of CYD128 (Baling Petrochemical, bisphenol A epoxy resin, epoxy value 0.515-0.543eq / 100g), and slowly raise the temperature to 145 ~155°C, carry out vacuum...

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PUM

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Abstract

The invention relates to an anti-flaming epoxy resin composition and a preparation method thereof. The anti-flaming epoxy resin composition is prepared from the components, in parts by mass: 18-28 parts of epoxy resin I, 22-32 parts of self-made halogen-free flame retardant epoxy resin, 3.2-12 parts of curing agent, 0.04-0.8 part of curing accelerator, 20-35 parts of inorganic filler and 15-30 parts of flame retardant synergist. The epoxy resin composition has the characteristics that the P element does not migrate, and the heat resistance is good by adopting a reactive type phosphine oxide fire retardant, and the electronic packaging material can be endowed with the excellent flame resistance, flame resistant durability, heat resistance, hydrolysis resistance and low water absorption property.

Description

technical field [0001] The invention belongs to the field of electronic packaging materials, in particular to a flame-retardant epoxy resin composition that can be used in electronic packaging materials and a preparation method thereof. Background technique [0002] Epoxy resin refers to a polymer containing two or more epoxy groups, with aliphatic, alicyclic or aromatic organic compounds as the backbone and formed by the reaction of epoxy groups; epoxy groups can be located in the molecular chain The end, middle or ring structure of the segment; it is one of the most widely used matrix resins in polymer matrix composites. Due to the special molecular structure of epoxy resin, epoxy resin has excellent adhesion, heat resistance, chemical resistance and excellent electrical insulation properties, and is easy to process, low shrinkage, small linear expansion coefficient and low cost. Advantages such as low cost. Widely used in the packaging of electronic components such as v...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/22C08K3/36C08G59/40C08G59/62
CPCC08G59/4071C08G59/621C08K2003/2227C08L63/00C08L2201/02C08L2201/08C08L2201/22C08L2203/206C08L2205/025C08K3/22C08K3/36
Inventor 吴先锋
Owner 吴先锋