Surface-treated copper foil and copper-clad laminate produced using same

A technology of surface treatment and copper foil, which is applied in the direction of printed circuit manufacturing, application, coating, etc., can solve the problems of reduced transmission loss characteristics, insufficient required characteristics, etc., and achieve the effect of excellent dielectric properties

Active Publication Date: 2018-09-28
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the copper foil of this example is used for a high-frequency substrate, the transmission loss characteristics will be lowered due to the influence of fine unevenness on the surface, resulting in insufficient required characteristics.

Method used

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  • Surface-treated copper foil and copper-clad laminate produced using same
  • Surface-treated copper foil and copper-clad laminate produced using same
  • Surface-treated copper foil and copper-clad laminate produced using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0100] Under the following conditions, the surface-treated copper foil was fabricated into an unroughened (surface roughness Rz about 0.8 μm) copper foil substrate with a thickness of 18 μm.

[0101] (1) Formation of roughened layer

[0102] The roughening treatment on the surface of the copper foil base was performed in the following order: roughening plating treatment 1 was performed under the conditions in Table 1, and then roughening plating treatment 2 shown below was performed to form a roughened layer.

[0103]

[0104] (rough surface plating treatment 2)

[0105] Copper sulfate: 13 to 72g / L in terms of copper concentration

[0106] Sulfuric acid concentration: 26 to 133g / L

[0107] Liquid temperature: 18 to 67°C

[0108] Current density: 3 to 67A / dm 2

[0109] Processing time: 1 second to 1 minute 55 seconds

[0110] (2) Formation of base layer containing Ni

[0111] After forming a roughened layer on the surface of the copper foil substrate, electroplating i...

Embodiment 2 to Embodiment 18

[0143] The surface roughening plating process 1 was performed based on the content of Table 1, and the silane coupling agent process was performed based on the content of Table 2, and it processed similarly to Example 1 except having performed it.

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Abstract

The present invention provides: a surface-treated copper foil which achieves a balance at a high level between reflow heat resistance and transmission characteristics, while ensuring sufficient adhesion to an insulating substrate. A surface-treated copper foil according to the present invention is obtained by providing a surface roughening layer (120) on a copper foil base (110), and is characterized in that: the surface roughening layer (120) has a recessed and projected surface that is formed of roughening particles; in a cross-section that is perpendicular to the copper foil base surface, the ratio of the creepage distance (Da) measured along the recessed and projected surface of the surface roughening layer (120) relative to the creepage distance (Db) measured along the copper foil base surface, namely Da / Db is within the range of 1.05-4.00; the average height difference (H) between recesses and projections in the recessed and projected surface is within the range of 0.2-1.3 [mu]m;and a silane coupling agent layer having a silane coating amount of 0.0003-0.0300 mg / dm<2> is formed on the surface roughening layer (120) directly or with an intermediate layer being interposed therebetween.

Description

technical field [0001] The present invention relates to a surface-treated copper foil that ensures sufficient adhesion to an insulating substrate and has both high reflow heat resistance and transmission characteristics, and a copper-clad laminate manufactured using the same. Background technique [0002] In recent years, with the improvement of performance and functionality of computers and information communication equipment, and the development of networking, there is a tendency to increase the frequency of signals to perform high-speed transmission processing of large-capacity information. Such information and communication equipment uses copper-clad laminated boards. Copper-clad laminates are produced by heating and pressing an insulating substrate (resin substrate) and copper foil. In general, resins with excellent dielectric properties must be used for insulating substrates constituting high-frequency copper-clad laminates. However, resins with low relative permittiv...

Claims

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Application Information

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IPC IPC(8): C25D7/06B32B3/30B32B15/20C23C26/00C25D5/16H05K1/09
CPCB32B15/20B32B3/30C25D7/06C23C26/00H05K1/09C25D5/605B32B15/08C25D5/48H05K3/389B32B2457/00B32B2255/06B32B2307/206C25D7/0614C23C2222/20
Inventor 佐藤章宇野岳夫
Owner FURUKAWA ELECTRIC CO LTD
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