Ultraviolet photo-curing photosensitive resin for 3D printing and preparation method thereof

A photosensitive resin and 3D printing technology, applied in the field of 3D printing materials, can solve the problems of slow curing speed and high viscosity of photocurable materials, and achieve the effects of good retention, low volume shrinkage and good toughness

Inactive Publication Date: 2018-10-23
上海云铸三维科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For this reason, the technical problem to be solved by the present invention is to overcome technical bottlenecks such as high viscosity and slow curing speed of existing ...

Method used

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  • Ultraviolet photo-curing photosensitive resin for 3D printing and preparation method thereof
  • Ultraviolet photo-curing photosensitive resin for 3D printing and preparation method thereof
  • Ultraviolet photo-curing photosensitive resin for 3D printing and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] This embodiment provides a UV-curable photosensitive resin for 3D printing, its components and mass percentages are: 45wt.% aliphatic epoxy resin, 25wt.% aliphatic epoxy acrylate, 6wt.% carbon dioxide Silicon, 2wt.% N,N-ethyl dimethylbenzoate, 1.9wt.% tripropylene glycol diacrylate, 5wt.% triethylene glycol divinyl ether, 3wt.% modified graphene, 5wt.% light Initiator, 5wt.% reactive diluent, 0.1wt.% dispersant, 2wt.% accelerator.

[0036] Preparation:

[0037] A. Add aliphatic epoxy resin, aliphatic epoxy acrylate, silicon dioxide, N,N-ethyl dimethylbenzoate to the reaction kettle equipped with stirrer, thermometer, condenser and feeding tank , tripropylene glycol diacrylate, triethylene glycol divinyl ether, modified graphene and reactive diluent, and stir evenly for 60 minutes;

[0038] B. In the reaction kettle, add a dispersant and stir evenly for 50 minutes;

[0039] C. Add photoinitiator and accelerator into the reaction kettle, the temperature of the reaction...

Embodiment 2

[0042] This embodiment provides a UV-curable photosensitive resin for 3D printing, its components and mass percentages are: 25wt.% aliphatic epoxy resin, 25wt.% aliphatic epoxy acrylate, 1wt.% carbon dioxide Silicon, 10wt.% N,N-ethyl dimethylbenzoate, 0.5wt.% tripropylene glycol diacrylate, 15wt.% triethylene glycol divinyl ether, 4wt.% modified graphene, 5wt.% light Initiator, 6.5wt.% reactive diluent, 5wt.% dispersant, 3wt.% accelerator.

[0043] Preparation:

[0044] A. Add aliphatic epoxy resin, aliphatic epoxy acrylate, silicon dioxide, N,N-ethyl dimethylbenzoate to the reaction kettle equipped with stirrer, thermometer, condenser and feeding tank , tripropylene glycol diacrylate, triethylene glycol divinyl ether, modified graphene and reactive diluent, and stir evenly for 60 minutes;

[0045] B. In the reaction kettle, add dispersant and stir evenly for 5 minutes;

[0046] C. Add photoinitiator and accelerator into the reaction kettle, the temperature of the reaction ...

Embodiment 3

[0049]This embodiment provides a UV-curable photosensitive resin for 3D printing, its components and mass percentages are: 35wt.% aliphatic epoxy resin, 10wt.% aliphatic epoxy acrylate, 3.5wt.% Silicon oxide, 6wt.% N, N-ethyl dimethylbenzoate, 6wt.% tripropylene glycol diacrylate, 10wt.% triethylene glycol divinyl ether, 0.05wt.% modified graphene, 0.05wt. % photoinitiator, 24.3wt.% reactive diluent, 5wt.% dispersant, 0.1wt.% accelerator.

[0050] Preparation:

[0051] A. Add aliphatic epoxy resin, aliphatic epoxy acrylate, silicon dioxide, N,N-ethyl dimethylbenzoate to the reaction kettle equipped with stirrer, thermometer, condenser and feeding tank , tripropylene glycol diacrylate, triethylene glycol divinyl ether, modified graphene and reactive diluent, and stir evenly for 35 minutes;

[0052] B. In the reaction kettle, add dispersant and stir evenly for 25 minutes;

[0053] C. Add photoinitiator and accelerator into the reaction kettle, the temperature of the reaction ...

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Abstract

The invention discloses ultraviolet photo-curing photosensitive resin for 3D printing and a preparation method thereof. The photosensitive resin is prepared from the following components in percentageby mass: 25 to 45 percent of aliphatic epoxy resin, 10 to 25 percent of aliphatic epoxy acrylate, 1 to 6 percent of silicon dioxide, 2 to 10 percent of N,N-dimethylethyl benzoate, 0.5 to 6 percent oftripropylene glycol diacrylate, 5 to 15 percent of triglycol divinyl ether, 0.05 to 4 percent of modified graphene, 0.05 to 5 percent of photoinitiator, 5 to 30 percent of active diluting agent, 0.1to 5 percent of dispersing agent, and 0.1 to 3 percent of promoting agent. The photosensitive resin can be directly applied to 3D printing to produce a product having a complicated structure, the toughness is good, the viscosity is low and formation is quick; quick formation property of 3D printing products is ensured, and an industrial use requirement is met.

Description

technical field [0001] The invention belongs to the technical field of 3D printing materials, and in particular relates to a UV-curable photosensitive resin for 3D printing and a preparation method thereof. Background technique [0002] 3D printing is a new technology developed in recent decades and has been accepted by more and more people. Stereolithography (SLA) is the earliest and most mature technology in the field of 3D printing. Light-curing rapid prototyping technology is also called stereolithography or stereolithography. The working process is under the control of the computer, the ultraviolet laser beam scans the photosensitive resin in the raw material pool sequentially based on the profile data of the cross-section of each layer, and the photosensitive resin absorbs the light energy and undergoes photopolymerization to cure in the area where the ultraviolet light passes. , forming a thin section layer. When one layer is cured, the computer controls the workbe...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L63/10C08K9/04C08K3/04C08K3/36B33Y70/00
CPCB33Y70/00C08L63/00C08L63/10C08K9/04C08K3/042C08K3/36
Inventor 李俊锋
Owner 上海云铸三维科技有限公司
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