A kind of curing method of photosensitive resin bcb

Abstract

The invention belongs to the technical field of semiconductor chip manufacturing, and specifically relates to a method for curing photosensitive resin BCB, comprising the following steps: 1) coating a photosensitive BCB glue on the surface of an epitaxial wafer, and forming a photosensitive BCB glue on the surface of the epitaxial wafer by photolithography 2) Treat the photosensitive BCB adhesive on the surface of the epitaxial wafer by plasma reactive etching; 3) Put the etched epitaxial wafer into the annealing furnace, and pass H 2 and Ar mixed gas protection, using a multi-stage temperature rise and heat preservation method from 50°C to 275°C, and kept at 275°C for 2h; 4) Then increase the amount of H 2 and Ar mixed gas flow rate, quickly lower the temperature of the annealing furnace to room temperature, stop feeding H 2 and Ar mixed gas to complete the curing. The curing method of the photosensitive resin BCB provided by the invention adopts the mode of multi-stage temperature rise and heat preservation, so that the polymerization reaction of BCB is more sufficient; and when annealing, H 2 Mixed gas with Ar replaces traditional N 2 As a protective gas, it reduces the possibility of oxidative aging and improves the quality of BCB.

Description

technical field [0001] The invention belongs to the technical field of semiconductor chip manufacturing, especially the high-speed and high-frequency chip part of high-end products, and specifically relates to a curing method of photosensitive resin BCB, which is used for making passivation layers and filling layers of chips. Background technique [0002] In the process of semiconductor chip processing, with the increase of frequency and speed, such as in the field of microelectronics processing and high-speed communication, the requirements for chip size, parasitic effect parameters, reliability, and insulation are getting higher and higher. The traditional processing passivation method can no longer meet the requirements of high-end products, and there is an urgent need for a material that can meet the processing of high-end chip products. BCB (benzocyclobutene) is a material with good performance that meets various requirements. This photosensitive photoresist has the cha...

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Problems solved by technology

[0004] The purpose of the present invention is to overcome the defects of the prior art, and provide a new curing method for photosensitive resin BCB, which can improve the quality of photosensitive BCB glue after formation, solve the problem of device BCB related failure caused by traditional methods, and then improve the overall performance of the chip. performance

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