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Preparation method of conductive silver paste for printed circuit

A technology of conductive silver paste and printed circuit, which is applied in the field of electronic information materials, can solve the problems of intolerance to bending and high resistance of conductive silver paste, and achieves the effects of excellent electrical conductivity, reduced silver content, and excellent mechanical properties.

Active Publication Date: 2022-03-08
DONGGUAN DOMAL ELECTRONICS SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The main technical problem to be solved by the present invention is to provide a method for preparing conductive silver paste specially used for printed circuits in view of the problems that the existing conductive silver paste has relatively large resistance and is not resistant to bending

Method used

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  • Preparation method of conductive silver paste for printed circuit
  • Preparation method of conductive silver paste for printed circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Step (1) prepare the required raw materials according to the following parts by weight ratio

[0049] Particle size 0.7μm~1.3μm, tap density 4g / cm 3 ~5g / cm 3 of spherical silver powder: 140g

[0050] Average particle size 1.2μm~1.8μm, tap density 4g / cm 3 ~5g / cm 3 flaky silver powder: 280g

[0051] Graphene with a particle size of 6nm to 8nm: 100g

[0052] Epoxy-modified polyester resin with an average molecular weight of 70,000 to 80,000: 120g

[0053] Propylene Glycol Methyl Ether Acetate: 140g

[0054] Spherical aluminum nitride with an average particle size of 50 nm to 1 μm: 10 g

[0055] Defoamer polyether modified siloxane: 7g

[0056] Leveling agent polyacrylate: 6g

[0057] Curing agent diaminodiphenyl sulfone: 8g.

[0058] A certain proportion of graphene is added to the raw materials used in the formula. Graphene is a new type of two-dimensional carbon material. 2 The hybrid orbitals form a hexagonal flat film with a honeycomb lattice, which has exce...

Embodiment 2

[0067] (1) Prepare the required raw materials according to the following proportions by weight

[0068] Step (1) prepare the required raw materials according to the following parts by weight ratio

[0069] Particle size 0.5μm~1.0μm, tap density 4g / cm 3 ~5g / cm 3 of spherical silver powder: 100g

[0070] Average particle size 1.0μm~1.5μm, tap density 4g / cm 3 ~5g / cm 3 flaky silver powder: 200g

[0071] Graphene with a particle size of 6nm to 8nm: 100g

[0072] Epoxy modified polyester resin with an average molecular weight of 50,000 to 70,000: 120g

[0073] Propylene Glycol Methyl Ether Acetate: 100g

[0074] Spherical aluminum nitride with an average particle size of 50 nm to 1 μm: 20 g

[0075] Defoamer polyether modified siloxane: 1g

[0076] Leveling agent polyacrylate: 1g

[0077] Curing agent diaminodiphenyl sulfone: 5g.

[0078] (2) Preparation of organic carrier

[0079] Add the epoxy modified polyester resin into the organic solvent, heat it to 70℃~80℃, fully...

Embodiment 3

[0083] (1) Prepare the required raw materials according to the following proportions by weight

[0084] Step (1) prepare the required raw materials according to the following parts by weight ratio

[0085] Particle size 1.0μm~1.5μm, tap density 3g / cm 3 ~4g / cm 3 of spherical silver powder: 150g

[0086] Average particle size 1.5μm~2.0μm, tap density 3g / cm 3 ~4g / cm 3 flaky silver powder: 300g

[0087] Graphene with a particle size of 6nm to 8nm: 70g

[0088] Epoxy modified polyester resin with an average molecular weight of 50,000 to 60,000: 80g

[0089] Propylene Glycol Methyl Ether Acetate: 150g

[0090] Spherical aluminum nitride with an average particle size of 50 nm to 1 μm: 12 g

[0091] Defoamer polyether modified siloxane: 6g

[0092] Leveling agent polyacrylate: 7g

[0093] Curing agent diaminodiphenylmethane: 12g.

[0094] (2) Preparation of organic carrier

[0095] Add the epoxy-modified polyester resin into the organic solvent, heat it to 70℃~80℃, stir fu...

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Abstract

The invention belongs to the technical field of conductive silver paste, and specifically relates to a preparation method of conductive silver paste for printed circuits, which includes the following steps: (1) preparing the required raw materials according to the proportion by weight, 10 to 15 parts of spherical silver powder, 20-30 parts of flaky silver powder, 7-10 parts of graphene, 8-12 parts of epoxy modified polyester resin, 10-15 parts of organic solvent, aluminum nitride, defoamer, leveling agent; (2) Preparation of organic vehicle, (3) Preparation of conductive silver paste. The conductive silver paste for printed circuit prepared according to the preparation method provided by the invention has excellent conductivity, good adhesion and bending resistance.

Description

technical field [0001] The invention belongs to the field of electronic information materials, and in particular relates to a special conductive silver paste for printed circuits and a preparation method thereof. Background technique [0002] Conductive silver paste is widely used in electronic industry fields such as computers, mobile phone keyboards, membrane switches, touch screens, smart cards, radio frequency identification, etc. Currently, the most widely used conductive silver pastes include: PET-based membrane switches and flexible circuit boards with low temperature Silver paste, low temperature conductive silver paste for touch screen, paste for single-plate ceramic capacitor, silver paste for varistor and thermistor, silver paste for piezoelectric ceramics and silver electrode paste for carbon film potentiometer. The printed conductive silver paste is a low-temperature baking conductive silver paste specially designed for the circuit wires of resistive and capacit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/09H01B13/00
CPCH05K1/092H01B13/00
Inventor 付剑珍
Owner DONGGUAN DOMAL ELECTRONICS SCI & TECH
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