Waterproof putty powder used in low-temperature environment and preparation process of waterproof putty powder

A low temperature environment, putty powder technology, applied in the direction of filling slurry, etc., can solve the problems of low cost, low toughness and tensile strength, freeze cracking of putty, etc., to reduce heat energy loss, improve toughness and tensile strength, and reduce heat The effect of the exchange

Inactive Publication Date: 2018-11-13
ANHUI LENCAQI BUILDING MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in the prior art, cement is mostly used as the binder of putty powder, which has low cost and high

Method used

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  • Waterproof putty powder used in low-temperature environment and preparation process of waterproof putty powder
  • Waterproof putty powder used in low-temperature environment and preparation process of waterproof putty powder
  • Waterproof putty powder used in low-temperature environment and preparation process of waterproof putty powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] The waterproof putty powder used in low temperature environment is composed of 90% putty powder base material, 6% antifreeze and 4% heat preservation agent.

[0033] Above-mentioned antifreezing agent comprises following components by weight:

[0034]

[0035]

[0036] The above-mentioned thermal insulation agent comprises the following components in parts by weight:

[0037]

[0038] Preferably, the putty powder base material comprises the following components in parts by weight:

[0039]

[0040] The preparation process of the waterproof putty powder used in the above-mentioned low temperature environment comprises the following specific steps:

[0041] S1: Mix propolis powder, sodium metasilicate pentahydrate, lithium magnesium silicate, calcium nitrite, strontium oxide, zinc chloride, and calcium lignosulfonate, and dry at 70°C for 1 hour to obtain antifreeze;

[0042] S2: At 200°C, ceramic hollow microspheres with a particle size of 20 μm, sepiolite w...

Embodiment 2

[0046] Waterproof putty powder used in low temperature environment, said waterproof putty powder is composed of 86% putty powder base material, 8% antifreeze, 6% heat preservation agent;

[0047] Wherein, antifreezing agent comprises following components by weight:

[0048]

[0049] The insulating agent comprises the following components in parts by weight:

[0050]

[0051] Preferably, the putty powder base material comprises the following components in parts by weight:

[0052]

[0053] Preparation technology is with embodiment 1, difference is:

[0054] S1: The drying temperature is 75°C;

[0055] S2: The particle size of ceramic hollow microspheres is 25 μm, the particle size of sepiolite wool is 12.5 μm, the length of aluminum borosilicate whiskers is 12.5 μm, the diameter is 0.75 μm, the particle size of silica airgel is 0.25 μm, The sintering temperature is 225°C, and the freezing temperature is -50°C;

[0056] S3: Grinding to a fineness of 375 mesh.

Embodiment 3

[0058] Waterproof putty powder used in low temperature environment, said waterproof putty powder is composed of 82% putty powder base material, 10% antifreeze, and 8% heat preservation agent;

[0059] Wherein, antifreezing agent comprises following components by weight:

[0060]

[0061] The insulating agent comprises the following components in parts by weight:

[0062]

[0063] Preferably, the putty powder base material comprises the following components in parts by weight:

[0064]

[0065]

[0066] Preparation technology is with embodiment 1, difference is:

[0067] S1: The drying temperature is 80°C;

[0068]S2: The particle size of ceramic hollow microspheres is 30 μm, the particle size of sepiolite wool is 15 μm, the length of aluminum borosilicate whiskers is 15 μm, the diameter is 1 μm, the particle size of silica airgel is 0.5 μm, and the sintering temperature is 250°C, the freezing temperature is -55°C;

[0069] S3: Grinding to a fineness of 400 mesh...

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Abstract

The invention discloses waterproof putty powder used in a low-temperature environment and a preparation process of the waterproof putty powder used in the low-temperature environment; the waterproof putty powder comprises 82 to 90% of a putty powder base material, 6 to 10% of an antifreeze agent and 4 to 8% of a heat insulating agent, wherein the antifreeze agent comprises the following componentsin parts by weight: 30 to 40 parts of propolis powder, 40 to 50 parts of sodium metasilicate pentahydrate, 6 to 12 parts of lithium magnesium silicate, 15 to 20 parts of calcium nitrite, 10 to 15 parts of cerium oxide, 4 to 8 parts of zinc chloride, and 1 to 5 parts of calcium lignosulfonate; the heat insulating agent comprises the following components in parts by weight: 40 to 50 parts of ceramic hollow microspheres, 8 to 10 parts of sepiolite fabric, 2 to 5 parts of aluminum borosilicate whisker, and 10 to 15 parts of silica aerogel. The putty powder produced by the invention can be normally constructed in the low-temperature environment which is below 5 DEG C, can automatically repair cracks in a putty structure, and further has excellent frost-crack resisting, waterproof and thermal insulation performance.

Description

technical field [0001] The invention belongs to the field of building materials, and also relates to a functional putty powder, in particular to a waterproof putty powder used in a low-temperature environment and a preparation process thereof. Background technique [0002] Putty powder is a decorative material for leveling the surface of the wall. It is applied on the primer or directly on the wall to remove the unevenness of the wall. The construction environment of traditional putty should not be lower than 5°C. When the temperature is too low, the exterior wall putty coating will be difficult to dry after scraping the putty, and the unevaporated water will freeze. After entering March, as the temperature rises, the ice begins to When it melts, the moisture seeps out of the wall, causing the putty to crack and peel, and when the moisture is completely dry, the putty will fall off. In addition, in the prior art, cement is mostly used as the binder of putty powder, which ha...

Claims

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Application Information

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IPC IPC(8): C09D5/34
CPCC09D5/34
Inventor 乔启信
Owner ANHUI LENCAQI BUILDING MATERIAL
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