A kind of manufacturing method of porous double-sided smooth copper foil
A manufacturing method and copper foil technology are applied in the manufacturing field of porous double-sided optical copper foil, which can solve the problems of difficult realization of porous copper foil, inability to etch copper foil with a thickness of less than 12 microns, etc. Low cost and improved overall performance
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Embodiment 1
[0025] The solution composition of the electrolyte 2 was prepared according to Table 1; the surface of the cathode roller 1 was treated with a sponge polishing wheel so that the roughness Ra of the cathode roller surface reached 0.18um, and then the cathode roller 1 was treated with a polishing brush made of silicon carbide. Polish two laps; use the auxiliary cathode power supply 10 of the raw foil machine as the cathode, use the dilute sulfuric acid solution 11 as the electrolyte to oxidize the surface of the cathode roller 1, and the cathode roller 1 as the anode to form an electroplating circuit. (Copper rod) moves point by point on the cathode roller surface 1, the current value is 60A, and the oxidation time is about 30 seconds. The total area of oxidation points is controlled at about 10% of the surface area of the cathode roller 1, and then the electrolysis of copper is carried out on the cathode roller 1 , prepared a porous double-sided copper foil with a thickness ...
Embodiment 2
[0029] The solution composition of the electrolyte 2 is prepared according to Table 2; the surface of the cathode roller 1 is treated with a sponge polishing wheel so that the roughness Ra of the cathode roller surface reaches 0.2um, and then the cathode roller 1 is treated with a polishing brush made of silicon carbide. Polish two laps; use the auxiliary cathode power supply 10 of the raw foil machine as the cathode, use the dilute sulfuric acid solution 11 as the electrolyte to oxidize the surface of the cathode roller 1, and the cathode roller 1 as the anode to form an electroplating circuit. (Copper rod) moves point by point on the cathode roller surface 1, the current value is 45A, the oxidation time is about 30 seconds, the total area of oxidation points is controlled at about 10% of the surface area of the cathode roller 1, and then the electrolysis of copper is carried out on the cathode roller 1 , prepared a porous double-sided copper foil with a thickness of 9um a...
Embodiment 3
[0033] The solution composition of the electrolyte solution 2 is prepared according to Table 3; the surface of the cathode roller 1 is treated with a sponge polishing wheel so that the roughness Ra of the cathode roller surface reaches 0.2um, and then the cathode roller 1 is treated with a polishing brush made of silicon carbide. Polish two laps; use the auxiliary cathode power supply 10 of the raw foil machine as the cathode, use the dilute sulfuric acid solution 11 as the electrolyte to oxidize the surface of the cathode roller 1, and the cathode roller 1 as the anode to form an electroplating circuit. (Copper rod) moves point by point on the cathode roller surface 1, the current value is 30A, and the oxidation time is about 30 seconds. The total area of oxidation points is controlled at about 10% of the surface area of the cathode roller 1, and then the electrolysis of copper is carried out on the cathode roller 1 , prepared a porous double-sided smooth copper foil with ...
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