Optical detection device and detection method for hybrid integrated circuit component defects

A hybrid integrated circuit and defect optics technology, which is applied in the field of optical inspection, can solve problems such as poor welding and mounting of QFN package components, inability to detect, inconsistent amount of conductive adhesive, etc., so as to avoid inaccurate measurement of parameters and reduce false alarms and false positives, the effect of accurate solder ball radius
CN108802046BActive Publication Date: 2021-01-29CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
Publication Date
2021-01-29

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Abstract

The invention discloses a hybrid integrated circuit component defect optical detection device and a detection method thereof. This device uses a smart camera lens to take pictures of the detected object. When taking pictures, supplemented by different lighting methods, the obtained image is processed by image matrix operation to obtain a pattern that effectively distinguishes the detected object from the background, which is beneficial to the image processing algorithm to extract pictures of the detected object of interest. The computer system can obtain the numerical defect information and position distribution of the detected object through the specific image detection algorithm preset by the program. The software architecture suitable for the characteristics of hybrid integrated circuits minimizes false positives and negative detections caused by substrate or placement errors. The invention realizes the effective identification of various defects of the hybrid integrated circuit, especially the defects of gold wires and solder balls, and realizes the digital defect detection standard that cannot be realized under a microscope.
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Description

technical field

[0001] The invention relates to the technical field of optical detection, and more specifically to an optical detection device and a detection method for hybrid integrated circuit component defects. Background technique

[0002] Microwave multi-chip module technology (Multi-Chip Module) is to directly install the bare integrated circuit chip on the multi-layer high-density interconnection substrate, and the metal wires of the layers are connected by via holes. This assembly method allows the chip to be very close to the chip, which can reduce the signal delay, crosstalk noise, and inductive / capacitive coupling problems generated in interconnection and wiring. Through this assembly method, the integrated circuit is greatly reduced in size and weight.

[0003] Since the optical inspection equipment used in the surface mount process (Surface Mount Technology) in the past can only be used to detect some standard surface mount components such as standard resistor...

Claims

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