Optical detection device and detection method for hybrid integrated circuit component defects

Abstract

The invention discloses a hybrid integrated circuit component defect optical detection device and a detection method thereof. This device uses a smart camera lens to take pictures of the detected object. When taking pictures, supplemented by different lighting methods, the obtained image is processed by image matrix operation to obtain a pattern that effectively distinguishes the detected object from the background, which is beneficial to the image processing algorithm to extract pictures of the detected object of interest. The computer system can obtain the numerical defect information and position distribution of the detected object through the specific image detection algorithm preset by the program. The software architecture suitable for the characteristics of hybrid integrated circuits minimizes false positives and negative detections caused by substrate or placement errors. The invention realizes the effective identification of various defects of the hybrid integrated circuit, especially the defects of gold wires and solder balls, and realizes the digital defect detection standard that cannot be realized under a microscope.

Description

technical field [0001] The invention relates to the technical field of optical detection, and more specifically to an optical detection device and a detection method for hybrid integrated circuit component defects. Background technique [0002] Microwave multi-chip module technology (Multi-Chip Module) is to directly install the bare integrated circuit chip on the multi-layer high-density interconnection substrate, and the metal wires of the layers are connected by via holes. This assembly method allows the chip to be very close to the chip, which can reduce the signal delay, crosstalk noise, and inductive / capacitive coupling problems generated in interconnection and wiring. Through this assembly method, the integrated circuit is greatly reduced in size and weight. [0003] Since the optical inspection equipment used in the surface mount process (Surface Mount Technology) in the past can only be used to detect some standard surface mount components such as standard resistor...

AI Technical Summary

Problems solved by technology

[0003] Since the optical inspection equipment used in the surface mount process (Surface Mount Technology) in the past can only be used to detect some standard surface mount components such as standard resistors, standard capacitors, standard inductors, QFP, QFN package components, welding and mounting defects, etc. Wait

However, there is no specialization for the detection of standard silicon chips or gallium arsenide chips in MCM components, the detection of conductive adhesives containing a large amount of silver powder with inconsistent reflective degrees, and the detection of gold wire and solder ball morphology during gold wire bonding. The detection hardware configuration and algorithm

On the other hand, MCM component technology has been widely used in military, communication, automotive electronics and other fields, and its output and module assembly density are increasing sharply. The traditional manual visual inspection method used in the past has been applied to large quantities of MCM components. For the detection of tiny defects on the chip, the detection of abnormal morphology of solder balls, the detection of a large number of densely arranged gold wires, and the detection of the amount of conductive adhesive containing silver powder with inconsistent reflectivity and certain fluidity

The traditional manual visual inspection method cannot guarantee the defect detection rate of hybrid integrated circuit components when the number of production components starts to increase in batches

Moreover, the numerical standards for defect detection stipulated in the national military standard cannot be effectively implemented in the actual production process.

[0004] Traditional optical non-destructive testing devices can only be used to detect components at the same height or with little difference in height, lack of flexible devices suitable for different height detection, and often only have multiple colors and multi-angle light sources to print The light method, the software structure is simple, and it is only suitable for some components with a relatively simple background. Its detection algorithm cannot effectively realize the numerical calibration of the defects of the detected object, and cannot realize the parametric analysis of the component assembly process.

For components with gold wires and solder balls, or even multi-layer chip structures, it is often impossible to detect, or cause a large number of false positives and negative negatives

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