Light emitting diode packing structure and method

Abstract

The invention provides a light emitting diode packing structure and method. The light emitting diode packing structure comprises a heat-dissipation substrate, an LED chip, a first fluorescent powder glue layer, a second fluorescent powder glue layer, a first buffer layer and a second buffer layer; the LED chip is arranged on the heat-dissipation substrate; the first buffer layer, the first fluorescent powder glue layer, the second buffer layer and the second fluorescent powder layer successively coat the LED chip so as to form a sandwiched optical structure; a first light filter layer furthercoats a portion between the first buffer layer and the LED chip; and / or a second light filter layer further coats a portion between the first fluorescent powder glue layer and the second buffer layer.According to the provided light emitting diode packing structure and method, by the buffer layers and the light filter layers, on the one hand, the chip is prevented from being in direct contact withfluorescent powder, and the problem of reduction of quantum efficiency of the fluorescent powder due to high temperature is solved; and on the other hand, the problem of reduction of the quantum efficiency of the fluorescent powder due to mutual absorption between fluorescent powder layers is avoided.

Description

technical field [0001] The invention relates to white light LED packaging technology and belongs to the technical field of semiconductors. Background technique [0002] Compared with traditional lighting sources, white LEDs have the advantages of low energy consumption, long life, small size, fast response, and no pollution. They are widely used in liquid crystal display backlight applications, mobile phones, signal lights, and solid-state lighting. At present, the way to realize LED white light is mainly realized by multi-chip combination or single-chip matching phosphor. Among them, the realization of white light LED by phosphor matching method has the advantages of simple preparation method, low cost, and easy industrialization, and has been widely used in the preparation of white light LED. The main ways to achieve white light by phosphor matching method are: blue chip + yellow phosphor or blue chip + green phosphor or yellow phosphor + red phosphor or ultraviolet chip ...

AI Technical Summary

Problems solved by technology

Among them, the blue light chip + yellow phosphor powder method cannot meet the requirements of high color rendering and high light efficiency at the same time because the color rendering index is too low; therefore, at present, two or more phosphor powders are usually used to achieve white light when a single chip is matched with phosphor powder.

Based on the above scheme, there must be overlapping coupling between phosphor spectra. In this case, mutual absorption will occur between phosphors. For example, part of the light of green phosphor is likely to be reabsorbed by red phosphor, resulting in a decrease in light efficiency.

In addition, due to the large difference in thermal matching between the LED chip and the phosphor, the quantum efficiency of the phosphor will inevitably decrease under high temperature conditions, which will further affect the light efficiency of the LED package.

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