Production method of double-faced and multilayer printed circuit board

Abstract

The embodiment of the invention provides a production method of a double-faced and multilayer printed circuit board. The production method comprises the following steps: 1, performing the selective protection by using a wet membrane; 2, performing the anticorrosive protection for a metallic hole wall by using an electrophoresis coating method; 3, removing the wet membrane of a to-be-etched part; 4, etching; and 5, removing the wet membrane and the electrophoresis membrane. After the printed circuit is coated with the wet membrane, pigment and resin microparticles suspended in the electrophoresis solution are driven by applying an external electric field to migrate in a fixed direction and to be deposited on the surface of a substrate of one electrode to complete the electrophoresis coating, the part which does not need the electrophoresis coating is completely covered by using liquid photosensitive anticorrosive agent in the electrophoresis coating process, the part needing the electrophoresis coating is exposed, then the anticorrosive membrane is selectively coated in an electrophoresis manner, and the wet membrane of the to-be-etched part is removed; and then the etching is performed again, and finally the wet membrane and the electrophoresis membrane are removed. By adopting the production method, field pollution problem and the fire potential hazard problem caused by the volatilization of solvent in the anticorrosive protection process of the hole wall metal of the double-faced and multilayer printed circuit board can be solved.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board production, and in particular relates to a production method of double-sided and multilayer printed circuit boards. Background technique [0002] The patent No. ZL 2015 1 0324085.3 invented by me has solved the shortcomings of low circuit pattern fineness, low wiring density, high cost, and large metal ion pollution, but in the process of technology promotion, glue coating on the hole wall appeared. During the process, the on-site gas pollution and fire hazards of the organic solvent caused by the volatilization of the diluent. Contents of the invention [0003] In view of the problems existing in the above-mentioned prior art, the purpose of the present invention is to provide a production method of double-sided and multi-layer printed circuit boards to solve the problem of air pollution at the work site due to solvent volatilization during the anti-corrosion protection process of...

AI Technical Summary

Problems solved by technology

[0003] In view of the problems existing in the above-mentioned prior art, the purpose of the present invention is to provide a production method of double-sided and multi-layer printed circuit boards to solve the problem of air pollution at the work site due to solvent volatilization during the anti-corrosion protection process of the hole wall metal. Problem, because there are 80-85% wet film and 15-20% organic solvent ethylene glycol butyl ether in the formula of the existing gluing technology hole wall glue, and the wet film contains 20-30% organic Solvent, the wet hole wall glue needs to be dried, and the solvent will volatilize. In addition, the solvent is also volatilizing continuously during the glue application process, so the workers on the operation site cannot accept it.