Tin plating or tin-lead alloy plating solution applied to leadless electronic components as well as preparation method and electroplating method of tin plating or tin-lead alloy plating solution
A technology of tin-lead alloy and electronic components, applied in the field of tin-plating or tin-lead alloy plating solution and its preparation, can solve the problem of "no creeping plating" problem and solutions, to prevent creeping plating and improve yield rate , the effect of inhibiting the growth rate
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[0043] It is applied to the preparation method of multi-complex tin or tin-lead alloy plating solution for leadless electronic components, including the following steps: add pure water of the required volume of about 50% in the container, add complexing agent, stir until completely dissolved, and then Slowly add tin methanesulfonate solution and lead methanesulfonate solution, then add surfactants, semi-bright additives and antioxidants, stir well, add pure water to close to the required volume, use methanesulfonic acid or sodium hydroxide Adjust pH 4~7, add pure water to make the volume.
[0044] Electroplating method
[0045] A tin or tin-lead alloy solution for multi-complex plating of leadless electronic components. The electroplating process includes the following steps: (1) Nickel plating: the silver-coated parts are subjected to 10% methyl Sulfonic acid activation, barrel nickel sulfamate; during the nickel plating process, the temperature of the electroplating solution is ...
Example Embodiment
[0048] Example 1
[0049] This embodiment is applied to tin or tin-lead alloy for leadless electronic components, including 20 grams of triethanolamine, 80 grams of sodium gluconate, 100 grams of sodium methanesulfonate, 0.5 grams of alkylphenol polyoxyethylene ether, and bisphenol A Polyoxyethylene ether 0.5 g, 2-mercaptobenzimidazole 0.05 g, Morin 0.2 g, resorcinol 0.2 g, tin methane sulfonate solution 33.3 ml (containing 10 g tin ions), lead methane sulfonate solution (Add when tin-lead alloy is plated) 2ml (containing 1g of lead ion). 2-Mercaptobenzimidazole, morin and catechol were dissolved in 20 ml of propylene glycol and then added to the electroplating solution. The above is prepared into 1 liter of multi-complex tin or tin-lead alloy solution, and the pH is adjusted to 4-7 with sodium hydroxide or methanesulfonic acid.
Example Embodiment
[0050] Example 2
[0051] This embodiment is applied to tin or tin-lead alloy for leadless electronic components, including 20 grams of triethanolamine, 100 grams of sodium gluconate, 120 grams of sodium methanesulfonate, 2 grams of alkylphenol polyoxyethylene ether, and bisphenol A Polyoxyethylene ether 1 g, 2-mercaptobenzimidazole 0.1 g, Morin 0.2 g, resorcinol 0.6 g, tin methane sulfonate solution 50 ml (containing 15 g tin ions), lead methane sulfonate solution (Added when tin-lead alloy is plated) 3 ml (containing 1.5 g of lead ion). 2-Mercaptobenzimidazole, morin and resorcinol were dissolved in 20 ml of propylene glycol and then added to the electroplating solution. The above is prepared into 1 liter of multi-complex tin or tin-lead alloy solution, and the pH is adjusted to 4-7 with sodium hydroxide or methanesulfonic acid.
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