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Tin plating or tin-lead alloy plating solution applied to leadless electronic components as well as preparation method and electroplating method of tin plating or tin-lead alloy plating solution

A technology of tin-lead alloy and electronic components, applied in the field of tin-plating or tin-lead alloy plating solution and its preparation, can solve the problem of "no creeping plating" problem and solutions, to prevent creeping plating and improve yield rate , the effect of inhibiting the growth rate

Active Publication Date: 2018-11-23
GUANGZHOU SANFU NEW MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The plating solution is a neutral system, and there is no mention of the problem and solution of "climbing plating"

Method used

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  • Tin plating or tin-lead alloy plating solution applied to leadless electronic components as well as preparation method and electroplating method of tin plating or tin-lead alloy plating solution
  • Tin plating or tin-lead alloy plating solution applied to leadless electronic components as well as preparation method and electroplating method of tin plating or tin-lead alloy plating solution

Examples

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preparation example Construction

[0043] The preparation method for multi-component complex tin plating or tin-lead alloy solution applied to leadless electronic components comprises the following steps: adding pure water with a required volume of about 50% into a container, adding a complexing agent, stirring until completely dissolved, and successively Slowly add tin methanesulfonate solution, lead methanesulfonate solution, then add surfactant, semi-brightness additives and antioxidant, stir well, add pure water to the required volume, use methanesulfonic acid or sodium hydroxide Adjust the pH to 4-7, add pure water to volume.

[0044] Plating method

[0045] A kind of tin or tin-lead alloy solution that is applied to multi-component complex complex of leadless electronic components, electroplating process comprises the following steps: (1) applies nickel plating: the plated piece that is coated with silver layer is 10% methyl by volume ratio Sulfonic acid activation, nickel sulfamate nickel barrel plating...

Embodiment 1

[0049] This embodiment is applied to tin plating or tin-lead alloy of leadless electronic components, including 20 grams of triethanolamine, 80 grams of sodium gluconate, 100 grams of sodium methylsulfonate, 0.5 grams of alkylphenol polyoxyethylene ether, bisphenol A 0.5 g of polyoxyethylene ether, 0.05 g of 2-mercaptobenzimidazole, 0.2 g of morin, 0.2 g of resorcinol, 33.3 ml of tin methanesulfonate solution (containing 10 g of tin ions), lead methanesulfonate solution (Added when tin-lead alloys are plated) 2 ml (containing 1 gram of lead ions). 2-mercaptobenzimidazole, morin, and catechol were first dissolved in 20 milliliters of propylene glycol and then added to the electroplating solution. The above is prepared into 1 liter of multi-component tin-plating or tin-lead alloy solution, and the pH is adjusted to 4-7 with sodium hydroxide or methanesulfonic acid.

Embodiment 2

[0051] This embodiment is applied to tin plating or tin-lead alloy of leadless electronic components, including 20 grams of triethanolamine, 100 grams of sodium gluconate, 120 grams of sodium methylsulfonate, 2 grams of alkylphenol polyoxyethylene ether, bisphenol A 1 g of polyoxyethylene ether, 0.1 g of 2-mercaptobenzimidazole, 0.2 g of morin, 0.6 g of resorcinol, 50 ml of tin methanesulfonate solution (containing 15 g of tin ions), lead methanesulfonate solution (Added when tin-lead alloys are plated) 3 ml (containing 1.5 grams of lead ions). 2-mercaptobenzimidazole, morin, and resorcinol were first dissolved in 20 milliliters of propylene glycol and then added to the electroplating solution. The above is prepared into 1 liter of multi-component tin-plating or tin-lead alloy solution, and the pH is adjusted to 4-7 with sodium hydroxide or methanesulfonic acid.

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Abstract

The invention discloses a tin plating or tin-lead alloy plating solution applied to leadless electronic components as well as a preparation method and an electroplating method of the tin plating or tin-lead alloy plating solution. The plating solution is prepared from the following components: a multi-component complexing agent, tin methanesulfonate, lead methanesulfonate, a surfactant, a semi-bright additive and an antioxidant; the pH value of the plating solution is 4-7; the contents of the multi-component complexing agent, the tin methanesulfonate, the lead methanesulfonate, the surfactant,the semi-bright additive, the antioxidant and water in the plating solution are respectively 200-300g / L, 10-25g / L, 1.0-2.5g / L, 1-8g / L, 0.05-0.3g / L, 0.4-2g / L and margin. Compared with the prior art, the plating solution provided by the invention has the main advantages that the multi-component complex is adopted, so that tin and lead are effectively complexed, and overplating is better avoided; furthermore, the plating solution is stable, is not easily turbid after being used for a long time, and is harmless to a human body and the environment.

Description

technical field [0001] The invention relates to the field of electroplating, in particular to a tin or tin-lead alloy plating solution applied to leadless electronic components, a preparation method thereof, and an electroplating method. Background technique [0002] The electrodes of leadless electronic components (capacitors, resistors, inductors) mostly use three-layer metal technology, that is, the bottom electrode metal of the terminal is Ag, the middle layer is nickel, and the external electrode metal is tin or tin-lead alloy layer. The bottom electrode is finished by coating, drying and sintering the conductive silver paste, and the middle electrode and the external electrode are finished by electroplating. Such components were tin-plated or tin-lead alloys in the early days with stronger acidic fluoboric acid or methanesulfonic acid systems. However, due to the faster plating speed in acidic plating solution, when the plating layer exceeds a certain thickness, that ...

Claims

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Application Information

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IPC IPC(8): C25D3/32C25D3/60C25D7/12
CPCC25D3/32C25D3/60C25D7/12
Inventor 邓正平
Owner GUANGZHOU SANFU NEW MATERIALS TECH
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