Resin composition containing liquid crystal polymer particles, molded article using same, and method for producing them
A technology of resin composition and liquid crystal polymer, applied in printed circuit parts, circuit substrate materials, etc., can solve the problem that the decrease of dielectric loss factor cannot obtain sufficient effect, etc., and achieve the effect of excellent electrical characteristics and economy
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[0063] Liquid crystal polymers can be prepared, for example, from the above-mentioned monomeric compounds (or mixtures of monomeric compounds) using direct polymerization or transesterification according to methods well known in the art. Usually, melt polymerization or slurry polymerization can be used. . Compounds with ester-forming ability can be used for polymerization in their original form, and in addition, they can be modified from precursors to derivatives with ester-forming ability in the early stage of polymerization. When these are polymerized, various catalysts can be used, and typical catalysts include dialkyltin oxides, diaryltin oxides, titanium dioxide, titanium alkoxides, silicates, titanium alcoholates, Alkali and alkaline earth metal salts of carboxylic acids, BF 3 Such Lewis acid salts etc. The usage-amount of a catalyst is about 0.001-1 mass % normally with respect to the total mass of a monomer compound, Especially preferably, it is about 0.01-0.2 mass %...
Embodiment 1～3
[0190] The liquid crystal polymer particles, liquid epoxy resin (XNR5002G manufactured by Nagase ChemteX), and tetrahydromethyl phthalate as a curing agent were prepared at room temperature (23°C) according to the mass ratio shown in Table 1. Formic anhydride (XNH5002G manufactured by Nagase ChemteX) was kneaded to obtain a uniform mixed composition.
[0191]
[0192] A mixed composition was obtained in the same manner as in Examples 1 to 3 except that the liquid crystal polymer particles were not used.
[0193]
Embodiment 1～3、 comparative example 1
[0195] The mixed composition was poured into a polyethylene mold of 8 cm×3 cm×2 mm, heated at 100° C. for 1 hour, and then heated at 150° C. for 3 hours to obtain a test piece.
[0196] Cut the obtained test piece into The cylindrical shape, and the dielectric constant and dielectric loss factor at 5GHz were measured at 23°C using a perturbation method resonator and dielectric constant measuring device (Cavity Resornator, Kanto Electronics Application Development Co., Ltd.).
[0197] In addition, the surface of the obtained test piece was visually observed, and the test piece without cracks was marked as ⊚, the test piece with a part (less than 30% of the surface area) of the crack was marked as ○, and about half (30% of the surface area) ~70% of the test piece) with cracks was marked as △, and the test piece with cracks in the whole (more than 70% of the surface area) was marked as × to evaluate the dispersibility.
[0198] Moreover, after the obtained test piece was broken...
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