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Radiation sensitive resin composition and electronic component

A resin composition and sensitive technology, applied in the direction of photosensitive materials, instruments, and opto-mechanical equipment used in opto-mechanical equipment, can solve the problems of high elastic modulus and warpage of resin films, and achieve excellent thermal shock resistance. , the effect of excellent developability

Active Publication Date: 2018-11-23
ZEON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, according to the radiation-sensitive composition described in this patent document 1, although it is possible to form a resin film having excellent electrical properties such as low dielectric properties and excellent developability, the elastic modulus of the obtained resin film may be high, and the resin film may be formed due to the Curing causes warping, therefore, from the viewpoint of improving reliability, it is desired to improve

Method used

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  • Radiation sensitive resin composition and electronic component
  • Radiation sensitive resin composition and electronic component
  • Radiation sensitive resin composition and electronic component

Examples

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preparation example Construction

[0109] The preparation method of the radiation-sensitive resin composition of the present invention is not particularly limited, as long as each component constituting the radiation-sensitive resin composition is mixed by a known method.

[0110] The mixing method is not particularly limited, but it is preferable to mix a solution or a dispersion obtained by dissolving or dispersing each component constituting the radiation-sensitive resin composition in a solvent. Accordingly, the radiation-sensitive resin composition can be obtained in the form of a solution or a dispersion.

[0111] The method of dissolving or dispersing each component which comprises a radiation-sensitive resin composition in a solvent should just follow a conventional method. Specifically, it can be performed using a stirring bar and a magnetic stirrer, a high-speed homogenizer, a disperser, a planetary mixer, a twin-shaft mixer, a ball mill, a three-roll machine, or the like. In addition, after dissolvi...

Embodiment 1

[0159] 291 parts (100 parts based on the cyclic olefin polymer (A-1)) of the cyclic olefin polymer obtained in Synthesis Example 1 as the cyclic olefin polymer (A) having a protic polar group were mixed (A-1) polymer solution, 10 parts of a bifunctional linear epoxy compound (trade name "jER YX7400", manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: 440) as a bifunctional linear epoxy compound (B) , the softening point is below 25°C (liquid at normal temperature), in the above general formula (1), R 1 =-C 4 h 8-, k = about 10 compounds), 30 parts of 4,4'-[1-[4-[1-[4-hydroxyphenyl]-1-methylethyl) as the radiation-sensitive compound (C) ]phenyl]ethylene]biphenyl (1 mole) and 1,2-naphthoquinonediazide-5-sulfonyl chloride (2.0 moles) condensation product (trade name "TS200", manufactured by Toyosei Co., Ltd.), 10 Parts of N,N,N',N',N",N"-hexamethoxymethylmelamine (trade name "NIKALAC MW-100LM ", manufactured by Sanwa Chemical Co., Ltd.), 2 parts of γ-glycidoxy...

Embodiment 2

[0162] In Example 1, the compounding amount of the bifunctional linear epoxy compound (trade name "jER YX7400", manufactured by Mitsubishi Chemical Corporation) was changed from 10 parts to 30 parts, except that it was carried out in the same manner as in Example 1, A radiation-sensitive resin composition was prepared, and measured and evaluated in the same manner. The results are shown in Table 1.

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Abstract

Provided is a radiation sensitive resin composition which contains (A) a cyclic olefin polymer having a protonic polar group, (B) a bifunctional epoxy compound represented by general formula (1) and (C) a radiation sensitive compound. (In general formula (1), R1 represents a linear or branched alkylene group having 1-15 carbon atoms; and k represents an integer of 1-20.)

Description

technical field [0001] The present invention relates to a radiation-sensitive resin composition and an electronic component having a resin film formed from the radiation-sensitive resin composition, and more specifically, to an electronic component capable of forming a low modulus of elasticity, thereby suppressing the occurrence of warpage, heat-resistant A radiation-sensitive resin composition having a resin film excellent in impact properties and developability, and an electronic component having a resin film formed from the radiation-sensitive resin composition. Background technique [0002] In various display elements such as organic EL elements and liquid crystal display elements, integrated circuit elements, solid-state imaging elements, color filters, black matrix (blackmatrix) and other electronic components, various resin films are provided to prevent deterioration of electronic components. , surface protection film for damage, planarization film for flattening the...

Claims

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Application Information

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IPC IPC(8): G03F7/023C08L63/00C08L65/00G03F7/004G03F7/075
CPCC08L63/00C08G59/5086C08G59/245G03F7/038G03F7/0755G03F7/0233G03F7/0226C08K5/23C08L65/00C08K5/54G03F7/004G03F7/075G03F7/023C08G59/22C08G61/02
Inventor 堤隆志藤村诚
Owner ZEON CORP
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