Method for manufacturing resin product
A resin and product technology, which is applied in the field of manufacturing resin products by compression molding, can solve the problems of no public pure resin product pure resin substrate, difficulty in ensuring the compactness of the substrate, and lack of actual test data verification, etc. The effect of wide coverage and waste reduction
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[0060] In this example, a resin product was prepared through the following steps. The EM-355(D) copper clad laminate used therein is an epoxy resin board with copper foil on both sides.
[0061] 1. Mold substrate preparation: The expected resin product size (height, length and width) is 1mm×50mm×50mm, and the inner mold is designed based on the expected size. Specifically, using the EM-355 (D) copper clad laminate produced by Taiwan Optoelectronic Materials (Kunshan) Co., Ltd. as the raw material, two pieces of 200mm×200mm were cut out using a model TQZX-II scooping machine (Shenzhen Tianqi CNC engraving machine) The copper foil on both sides of the sample was removed using an etching machine to obtain a resin plate with a thickness of 1 mm as a mold substrate.
[0062] 2. Internal mold scooping: Use a TQZX-II scooping machine (Shenzhen Apocalypse CNC engraving machine) to cut out 80mm×80mm square openings on the two mold substrates, and figure 1 As shown, cut along each sid...
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