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Method for manufacturing resin product

A resin and product technology, which is applied in the field of manufacturing resin products by compression molding, can solve the problems of no public pure resin product pure resin substrate, difficulty in ensuring the compactness of the substrate, and lack of actual test data verification, etc. The effect of wide coverage and waste reduction

Active Publication Date: 2018-12-07
ELITE ELECTRONICS MATERIAL KUNSHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, a disadvantage of this process is that it is necessary to add additional rubber components to the resin material so that it can form a film. If no rubber components are added, the resin cannot be directly coated on copper foil or PET film by the above-mentioned technology. membrane
Therefore, although this kind of process omits reinforcing materials such as glass fiber cloth, it is not suitable for the production of rubber-free substrates. In addition, this process is not pressed because of the coating step, so it is difficult to ensure the integrity of the substrate. Density
[0006] In the prior art, there is no disclosure of pure resin products without reinforcing materials, especially the preparation method of pure resin substrates, and the current characteristic data of pure resin substrates in the industry are all derived from existing percentage data, lacking actual test data verification

Method used

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  • Method for manufacturing resin product
  • Method for manufacturing resin product

Examples

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Embodiment 1

[0060] In this example, a resin product was prepared through the following steps. The EM-355(D) copper clad laminate used therein is an epoxy resin board with copper foil on both sides.

[0061] 1. Mold substrate preparation: The expected resin product size (height, length and width) is 1mm×50mm×50mm, and the inner mold is designed based on the expected size. Specifically, using the EM-355 (D) copper clad laminate produced by Taiwan Optoelectronic Materials (Kunshan) Co., Ltd. as the raw material, two pieces of 200mm×200mm were cut out using a model TQZX-II scooping machine (Shenzhen Tianqi CNC engraving machine) The copper foil on both sides of the sample was removed using an etching machine to obtain a resin plate with a thickness of 1 mm as a mold substrate.

[0062] 2. Internal mold scooping: Use a TQZX-II scooping machine (Shenzhen Apocalypse CNC engraving machine) to cut out 80mm×80mm square openings on the two mold substrates, and figure 1 As shown, cut along each sid...

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Abstract

A method for manufacturing a resin product comprises the following steps: manufacturing two or more internal molds having openings, and stacking the inner molds on a first plate to form a molding cavity; filling the molding cavity with a powdery material containing resin; placing a tablet on the molding cavity, and placing a second plate; performing pre-pressing at a temperature lower than the melting point of the resin; removing the tablet and at least one of the internal molds; and performing press-forming at a temperature higher than the melting point of the resin in order to produce the resin product, wherein at least one of the internal molds has a glue flow groove. The invention also provides a method of detecting the properties of the resin product.

Description

technical field [0001] This invention relates generally to the field of molding, and more particularly to methods of making resin products by compression molding. Background technique [0002] Resin materials are used in a wide range of applications due to their excellent thermoplastic properties, transparency, stability, thermal insulation and electrical insulation, one of which is in the electronics field for the production of copper clad laminates and multilayer printed circuits plate. In the existing technology of producing copper clad laminates and multilayer printed circuit boards, it is usually to use reinforcing materials such as glass fiber, non-woven fabrics, wood pulp paper, etc. to form strips, which are impregnated in liquid resin and dried , to obtain a strip containing both reinforcing material and resin, which is called a bonding sheet in this field, also known as a prepreg. The resin in the prepreg can be re-melted and bonded at high temperature and comple...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C43/18B29C43/58B29C43/32
CPCB29C43/18B29C43/32B29C43/58B29C2043/5816
Inventor 王统录高振兴
Owner ELITE ELECTRONICS MATERIAL KUNSHAN
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