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FPC electromagnetic shielding film with polyimide film as insulating layer and preparation method thereof

A technology of polyimide film and electromagnetic shielding film, which is applied in the direction of magnetic/electric field shielding, coating, electrical components, etc., can solve the problems of metal layer cracks, large film thickness, poor weather resistance, etc., and improve the service life , Improve the effect of weather resistance

Active Publication Date: 2019-07-02
SHENZHEN HONGHAI ELECTRON MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the electromagnetic shielding film has the following problems: (1) The insulating layer of the electromagnetic shielding film for FPC mostly uses ink or paint, but the ink or paint is easy to age and has poor weather resistance, especially in the environment of high temperature and high humidity in the south The service life of electronic products is greatly affected
Polyimide (abbreviated as PI) is the king of materials, but due to technical limitations, the thickness of the film is relatively large, and the flexibility is not good, so it cannot be used as an electromagnetic wave shielding film for electronic products.
(2) The shielding layer of the electromagnetic shielding film adopts a metal shielding layer or a conductive layer. In the subsequent complex high-temperature and high-pressure operation process of FPC, the metal layer is prone to cracks, oxidation, etc., which will reduce the shielding performance. , and even lose the shielding performance, and at the same time, it is easy to bubble and delaminate in the subsequent reflow soldering process
(3) The shielding film made of ordinary conductive adhesive is difficult to meet the needs of the FPC industry because of its low conductivity, poor continuous conduction, and poor shielding performance.

Method used

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  • FPC electromagnetic shielding film with polyimide film as insulating layer and preparation method thereof
  • FPC electromagnetic shielding film with polyimide film as insulating layer and preparation method thereof
  • FPC electromagnetic shielding film with polyimide film as insulating layer and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0047] The manufacturing process used in the preparation of the FPC electromagnetic shielding film with the polyimide film as the insulating layer of the present invention is as follows.

[0048] The first step is to prepare black polyimide precursors, reflective electromagnetic shielding coatings and absorptive electromagnetic shielding coatings, which can be prepared in the following order, but the scope of protection is not limited to the following A1, A2, A3 Order.

[0049] A1. Preparation of black polyimide precursor;

[0050] (1) Add 4,4'-diaminodiphenyl ether (ODA for short) into the solvent of dimethylformamide (DMF for short) to make the final total solid content less than 20%. After dissolving, cool to -10℃~ At 5℃, add 4,4-diphenyl ether dianhydride (abbreviated as ODPA), pyromellitic dianhydride (abbreviated as PMDA), biphenyltetracarboxylic dianhydride (abbreviated as BPDA), 3,3'-(between Benzene) diether dianhydride (abbreviated as RsDPA), 3,3',4,4'---benzophenonetetra...

Embodiment 2

[0070] The manufacturing process of the FPC electromagnetic shielding film with polyimide film as the insulating layer in this embodiment is basically the same as that of Example 1, except that the components and ratios of the reflective shielding coating paint in A2 and A3 are:

[0071] The ratio of each raw material of acrylic resin III prepared in A2 is different. The addition amounts of acrylic acid, acrylonitrile, butyl acrylate, and hydroxyethyl acrylate are 7, 35, 20, and 20 parts, respectively; The ratio of raw materials is different. Bisphenol F epoxy resin replaces bisphenol A epoxy resin. The addition amounts of acrylic resin III, bisphenol F epoxy resin, dicyandiamide and diaminodiphenyl sulfone are 50 and 10 respectively. , 5, 5 copies.

[0072] Take flake silver-coated copper powder (Mitsui Metals 1100YP, ball mill, 400 mesh sieving for use; or Fukuda Metals, 10% AgコートCu-HWQ 5μm, for direct use), and ultrasonic activation with activator for 24h to obtain activated shi...

Embodiment 3

[0076] The manufacturing process of the novel composite electromagnetic shielding film for FPC in this embodiment is basically the same as that in embodiment 1, except that the composition ratio of the paint in A2 and A3 is:

[0077] The ratio of each raw material of acrylic resin III prepared in A2 is different. The addition amount of acrylic acid, acrylonitrile, butyl acrylate, and hydroxyethyl acrylate are 15, 50, 30, and 30 parts respectively; The ratio of raw materials is different. Novolac epoxy resin replaces bisphenol A epoxy resin. The addition amount of acrylic resin III, novolac epoxy resin, dicyandiamide, and diaminodiphenyl sulfone are 70, 30, 10, and 10 parts respectively.

[0078] Take flake silver-coated copper powder with a thickness of 1~2μm and a plane size of 3~9μm (Mitsui Metals 1100YP, ball milled, 400 mesh sieved for use; or Fukuda Metals, 10% AgコートCu-HWQ 5μm, used directly), The activator is ultrasonically activated for 24 hours to obtain an activated shield...

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Abstract

Provided is an FPC electromagnetic shielding film with a polyimide film as an insulating layer, the FPC electromagnetic shielding film comprising a PI insulating layer, a reflective shielding coating coating the PI insulating layer, and an absorptive shielding coating coating the reflective shielding coating, wherein a layer of a release protection film layer is arranged on the absorptive electromagnetic shielding coating. Provided are an FPC electromagnetic shielding film with a polyimide film as an insulating layer, and a preparation method therefor, wherein same have improved weather-resistance, flexibility, bending resistance, product smoothness and shielding performance.

Description

Technical field [0001] The invention relates to the technical field of electromagnetic shielding, in particular to an FPC electromagnetic shielding film with a polyimide film as an insulating layer and a preparation method thereof. Background technique [0002] Printed circuit board (FPC) is an indispensable material in electronic products. It is currently widely used in computers and their peripherals, communication products, and consumer electronic products. As the demand for consumer electronic products continues to grow, the need for printed circuit The requirements for boards are also increasing day by day. [0003] In the prior art, the electromagnetic shielding film has the following problems: (1) The insulating layer of the electromagnetic shielding film for FPC mostly uses ink or paint, but the ink or paint is easy to age and has poor weather resistance, especially in the high temperature and high humidity environment in the south The service life of electronic products i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J7/04C08J5/18C09D5/32C09D5/33C09D133/20C09D163/00C09D179/04C09D7/62C09D7/61C09D175/06H05K9/00C08L79/08
CPCC08J5/18C08J7/042C08J2379/08C08K2003/385C09D5/004C09D5/32C09D7/61C09D7/62C09D7/70C09D133/20C09D175/06H05K9/0081C08L63/00C08K9/10C08K7/00C08K3/40C08K3/08C08L79/04C08K3/04C08K3/22
Inventor 刘仁成谢文波王绍亮洪腾万彩兵
Owner SHENZHEN HONGHAI ELECTRON MATERIAL TECH CO LTD
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