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Low-dielectric bismaleimide resin system

A technology of bismaleimide resin and bismaleimide, which is applied in the field of low-dielectric high-performance resin-based composite materials and low-dielectric bismaleimide resin systems, can solve the problem of thermosetting resin system dielectric Poor electrical properties, reduced resin system crosslinking density, strength, heat resistance, low moisture absorption, etc., to achieve excellent mechanical properties and thermal properties, good mechanical properties, and low dielectric properties

Active Publication Date: 2018-12-18
SUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Polyphenylene oxide (PPO) is an important high-performance thermoplastic resin, which has a high glass transition temperature (Tg=210°C), good heat resistance and dimensional stability, high toughness, low Moisture absorption rate, although the addition of PPO can reduce the dielectric properties of the thermosetting resin system to a certain extent, however, the addition of a higher content of PPO will reduce the crosslinking density or other properties of the resin system such as strength and heat resistance, etc., and used alone PPO is less effective in reducing the dielectric properties of thermosetting resin systems

Method used

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  • Low-dielectric bismaleimide resin system
  • Low-dielectric bismaleimide resin system
  • Low-dielectric bismaleimide resin system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] 2g of polyphenylene ether (vinyl-terminated polyphenylene ether (PPO* MX9000-111) with a number average molecular weight of 1100) was completely dissolved in 25ml of toluene to obtain a polyphenylene ether solution, and then 0.6g of mesoporous silica was added (UC-S-1), after stirring and dispersing, add to 500ml aqueous solution of sodium lauryl sulfate surfactant with a mass concentration of 0.15% to form an oil-in-water system. Since polyphenylene ether is insoluble in water, with the gradual volatilization of the toluene solvent, the precipitated polyphenylene ether will be deposited or adsorbed on the surface of the mesoporous silica, sealing the mesopores. After stirring for 4 hours, the precipitate was washed, filtered, and dried in vacuum at 120°C for 4 hours to obtain a polyphenylene ether-filled and coated mesoporous silica material. The mass ratio of polyphenylene ether to the mesoporous silica material was 3.3: 1. figure 1 Scanning electron microscope (SEM) p...

Embodiment 2

[0037] 2g polyphenylene ether (vinyl-terminated polyphenylene ether (PPO* MX9000-111) with a number average molecular weight of 1100) was completely dissolved in 25ml of toluene to obtain a polyphenylene ether solution, and then 1.0g of mesoporous silica was added (UC-S-1), after stirring and dispersing, add it to the aqueous solution of 500ml sodium lauryl sulfate surfactant with a mass concentration of 0.2% to form an oil-in-water system. Since polyphenylene ether is insoluble in water, with the gradual volatilization of the toluene solvent, the precipitated polyphenylene ether will be deposited or adsorbed on the surface of the mesoporous silica, sealing the mesopores. After stirring for 5 hours, the precipitate is washed, filtered, and dried under vacuum at 120°C for 5 hours to obtain polyphenylene ether-filled and coated mesoporous silica material. The mass fraction ratio of polyphenylene ether to mesoporous silica material is 2 :1. Figure 4 SEM picture of mesoporous sili...

Embodiment 3

[0045] 2g of polyphenylene ether (the number average molecular weight of 2200 vinyl-terminated polyphenylene ether (Noryl* SA9000)) was completely dissolved in 30ml of toluene to obtain a polyphenylene ether solution, and then 1.4g of mesoporous silica (UC- S-3) After stirring and dispersing, it is added to the aqueous solution of 500ml potassium monododecyl phosphate surfactant with a mass concentration of 0.3% to form an oil-in-water system. Since polyphenylene ether is insoluble in water, with the gradual volatilization of the toluene solvent, the precipitated polyphenylene ether will be deposited or adsorbed on the surface of the mesoporous silica, filling or sealing the mesopores. After stirring for 6 hours, the precipitates are washed, filtered, and dried under vacuum at 120°C for 6 hours to obtain polyphenylene ether-filled and coated mesoporous silica materials. The mass fraction ratio of polyphenylene ether to mesoporous silica is 1.43. :1.

[0046] Mix 50g of bismaleim...

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Abstract

The invention discloses a low-dielectric bismaleimide resin system. The low-dielectric high-performance bismaleimide resin system is prepared from bismaleimide, an allyl compound, mesoporous silica and polyphenylene ether by preparing polyphenylene ether-coated mesoporous silica and applying the polyphenylene ether-coated mesoporous silica to a bismaleimide resin system. A method disclosed in theinvention has the characteristics of simple process, extensive applicability and the like. The produced low-dielectric bismaleimide resin system has good application potential in fields of aviation, spaceflight and electronics.

Description

[0001] The present invention is a divisional application whose name is a low-dielectric bismaleimide resin system and its preparation method, the application date is December 9, 2016, and the application number is 2016111327196, which belongs to the technical part of the product. Technical field [0002] The invention belongs to the technical field of high-performance resin matrixes, and relates to a low-dielectric high-performance resin matrix composite material, in particular to a low-dielectric bismaleimide resin system. Background technique [0003] Bismaleimide resin system is a typical high-performance thermosetting resin with excellent mechanical properties, thermal properties and electrical properties. It has outstanding application potential in the field of aviation and aerospace electronic materials. With the rapid development of microelectronics technology, the performance of the existing bismaleimide resin system materials can no longer meet the development of high-inte...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/12C08K9/10C08K3/36C08K7/26
CPCC08G73/12C08G73/124C08K3/36C08K7/26C08K9/10C08K2201/011
Inventor 袁莉顾嫒娟梁国正
Owner SUZHOU UNIV
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