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Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same

A printed circuit board and surface treatment technology, which is applied in the direction of printed circuit manufacturing, printed circuit, printed circuit parts, etc., can solve the problems of reduced circuit spacing and poor formation of micro-circuits

Active Publication Date: 2018-12-21
MITSUI MINING & SMELTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is necessary to reduce the circuit spacing in consideration of a larger amount of etching, so it can be said that the MSAP method is slightly inferior to the SAP method in terms of fine circuit formation.

Method used

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  • Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same
  • Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same
  • Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0063] The present invention will be described more specifically by the following examples.

example 1 and 2

[0065] As a tape carrier surface-treated copper foil, a tape carrier roughened copper foil was produced and evaluated as follows.

[0066] (1) Production of carrier

[0067] A copper sulfate solution having the composition shown below was used as the copper electrolyte; a titanium rotating electrode having an arithmetic average surface roughness Ra (according to JIS B 0601: 2001) of 0.20 μm was used as the cathode; DSA (dimensionally stable anode) was used as the anode ), at a solution temperature of 45°C and a current density of 55A / dm 2 Electrolysis was carried out under the hood to obtain an electrolytic copper foil with a thickness of 12 μm as a carrier. The ten-point average roughness Rzjis of the surface on the release layer side of the obtained carrier was measured in accordance with JIS B 0601:2001, and was 0.9 μm.

[0068]

[0069]‐Copper concentration: 80g / L

[0070] ‐Sulfuric acid concentration: 260g / L

[0071] ‐Bis (3-sulfopropyl) disulfide concentration: 30m...

example 3

[0107] Example 3 (Compare)

[0108] In the roughening treatment, the electric quantity Q in the plating process of the first stage 1 Relative to the electric quantity Q in the plating process of the second stage 2 ratio (Q 1 / Q 2 ) becomes 2.16 (specifically, electrodeposition is performed under the conditions shown in Table 1), except that, in the same manner as described in Example 1, the tape carrier roughened copper foil production and evaluation.

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Abstract

Provided is a treated surface copper foil that, when used in SAP, is able to impart to a laminate body a surface profile that is not only excellent in plated circuit adhesiveness but also in etchability with respect to electroless copper plating and in dry film resolution. Said treated surface copper foil has a treated surface on at least one side. For the treated surface, the arithmetic mean peakcurvature Spc of the ridge peaks measured in accordance with ISO 25178 is at least 55 mm<-1>. When a resin film is thermocompression-bonded on the treated surface, the surface profile of the treatedsurface is transferred to the surface of the resin film and the treated surface copper foil is removed by etching, the arithmetic mean peak curvature Spc of the ridge peaks on the remaining resin filmsurface measured in accordance with ISO 25178 is at least 55 mm<-1>.

Description

technical field [0001] The present invention relates to a surface-treated copper foil, a copper foil with a carrier, a copper-clad laminate using them, and a method for producing a printed circuit board. Background technique [0002] In recent years, the semi-additive method (SAP method) has been widely used as a manufacturing process for printed wiring boards suitable for miniaturization of circuits. The SAP method is extremely suitable for forming a fine circuit, and as an example, it is performed using a tape carrier roughened copper foil. For example, if figure 1 and 2 As shown, using a prepreg 12 and a primer layer 13, an ultra-thin copper foil 10 with a roughened surface is crimped and bonded to an insulating resin substrate 11, which is formed on a base material Insulating resin substrate with lower layer circuit 11b on 11a (step (a)); after peeling off the carrier (not shown), via hole 14 is formed by laser drilling if necessary (step (b)). Next, the ultra-thin c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/06B32B15/04C25D5/16C25D21/12H05K1/09H05K3/38
CPCB32B15/04C25D7/06C25D21/12H05K1/09H05K3/38C25D5/605C25D1/04C25D5/48H05K3/381B32B15/08B32B15/20C25D5/10C25D7/0614H05K3/108
Inventor 加藤翼松田光由饭田浩人吉川和广
Owner MITSUI MINING & SMELTING CO LTD