Developable UV cured hydrofluoric acid-resistant protection glue
A hydrofluoric acid-resistant and protective adhesive technology, applied in adhesives, adhesive types, polyurea/polyurethane adhesives, etc., can solve problems such as easy failure, corrosion of glass substrates, and insufficient compactness of protective films
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[0036] The preparation method of the developable UV curable hydrofluoric acid resistant protective glue includes the following steps: according to the mass ratio, the resin, active monomer, photoinitiator, filler, auxiliary agent, and organic pigment are stirred at a temperature lower than 30°C Even if it is uniform, a developable UV curable hydrofluoric acid resistant protective glue is obtained.
[0037] Test the viscosity. If the test result does not meet the set viscosity threshold, adjust the viscosity to the viscosity threshold. The set viscosity threshold is the viscosity range of the prepared developable UV curable hydrofluoric acid resistant protective glue. Viscosity is the main parameter that determines the performance of the developable UV curable hydrofluoric acid resistant protective adhesive. Too much viscosity is not conducive to the coating of the developable UV curable hydrofluoric acid resistant protective adhesive; while the viscosity is too small, resulting in...
Example Embodiment
[0044] Example 1
[0045] In this embodiment, the composition and ratio (mass percentage) of the raw materials of the developable UV curable hydrofluoric acid resistant protective glue are as follows:
[0046] Bisphenol A epoxy acrylic light curing resin 50%, polyether-based urethane acrylate 20%, photoinitiator 3694.5%, dodecafluoroheptyl methacrylate 5%, trimethylolpropane tri(meth)acrylate 5%, pentaerythritol tri(meth)acrylate 5%, filler 8%, auxiliary agent 2% and pigment PR2540.5%, stir and mix evenly.
[0047] The etching resistance of the test scheme was measured according to the above-mentioned etching resistance test method. The thickness of the protective film was 35mm, the etching time was 1.5h, the etching depth was 0.45mm, and the film removal time was 30min.
Example Embodiment
[0048] Example 2
[0049] In this embodiment, the composition and ratio (mass percentage) of the raw materials of the developable UV curable hydrofluoric acid resistant protective glue are as follows:
[0050] Bisphenol A epoxy acrylic light curing resin 22%, PU modified epoxy acrylic resin 22%, aliphatic urethane acrylate 20%, photoinitiator 3696.5%, hexafluorobutyl acrylate 2%, dodecafluoromethacrylate Heptyl ester 3%, trimethylolpropane tri(meth)acrylate 10%, filler 9%, auxiliaries 5% and pigment PR2540.5% are stirred and mixed evenly.
[0051] The etching resistance of the test protocol was measured according to the above-mentioned etching resistance test method. The thickness of the protective film was 60mm, the etching time was 3h, the etching depth was 1.10mm, and the film removal time was 75min.
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