A flexible image sensor based on hair and its manufacturing method

An image sensor and manufacturing method technology, applied in semiconductor/solid-state device manufacturing, final product manufacturing, sustainable manufacturing/processing, etc., can solve the problems of inflexible photosensitive materials, poor mechanical properties, etc., to improve light response speed, reduce Compound rate, light weight effect

Active Publication Date: 2020-07-10
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a flexible image sensor based on hair and its manufacturing method, so as to solve the problems that the photosensitive materials commonly used in image sensors in the prior art cannot be bent generally, and have poor mechanical properties.

Method used

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  • A flexible image sensor based on hair and its manufacturing method
  • A flexible image sensor based on hair and its manufacturing method
  • A flexible image sensor based on hair and its manufacturing method

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Embodiment Construction

[0034] In the specific implementation process, the present invention is based on the manufacturing method of the flexible image sensor on the hair, including steps:

[0035] S1: Preparation of UV-sensitive heterojunction materials based on hair;

[0036] S2: preparing a flexible substrate;

[0037] S3: Using metal electrodes to connect several hair-based UV-sensitive heterojunction materials to each other, and fixing them on a flexible substrate to form the hair-based flexible image sensor.

[0038] Among them, the UV-sensitive heterojunction materials based on hair include human hair, Al-doped ZnO (AZO, Al doping amount accounts for 1-2wt%), ZnO nanorod arrays, poly( 9-vinylcarbazole) (PVK) and polyethylenedioxythiophene-poly(styrenesulfonate) (PEDOT:PSS). Flexible substrates include polyethylene terephthalate (PET), polyimide (PI), paper or plastic. The AZO end of any heterojunction material based on the ultraviolet light sensitive heterojunction material on the hair is c...

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Abstract

The invention belongs to the technical field of semiconductor devices, in particular to a hair-based flexible image sensor and a manufacturing method thereof. The manufacturing method includes: preparing a hair base→preparing a light-sensitive material on the hair base→assembling the prepared light-sensitive material based on the hair into an image sensor on a flexible substrate. The invention utilizes the characteristics of hair such as excellent flexibility, low cost, renewability, easy degradation, stability in the air, and easy cutting, and uses it as a growth base for light-sensitive materials. The flexible image sensor includes: a flexible substrate, a photosensitive material grown on hair and metal electrodes. The flexible image sensor of the present invention has the advantages of high sensitivity to ultraviolet light, low cost, good flexibility, light weight, etc., and can still clearly display graphics under various bending angles, and has huge potential applications.

Description

technical field [0001] The invention belongs to the technical field of semiconductor devices, in particular to a hair-based flexible image sensor and a manufacturing method thereof. Background technique [0002] An image sensor is an optoelectronic device that converts an optical image into an electrical signal. It is widely used in fields such as video, measurement, monitoring, medical treatment, and artificial intelligence. The core of a typical image sensor is a charge-coupled device (CCD) unit or Complementary Metal Oxide Semiconductor (CMOS). However, the photosensitive materials commonly used in current image sensors are generally not bendable and have poor mechanical properties. Therefore, these image sensors cannot meet the requirements of future flexible, wearable and portable applications. [0003] The photoelectric imaging performance and mechanical properties of flexible image sensors are closely related to the flexible substrate. On one-dimensional flexible s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/30H01L51/42H01L51/44H01L51/46H01L51/48B82Y40/00
CPCB82Y40/00H10K39/32H10K71/00H10K85/141H10K85/1135H10K30/152H10K30/88H10K77/111Y02E10/549Y02P70/50
Inventor 刘宝丹张兴来李晶杨文进张偲刘小元王柯周洋姜辛
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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