Method for preparing modified phenolic resin adhesive from camellia oleifera cakes

A technology of phenolic resin glue and camellia cake, which is applied in the direction of adhesives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., can solve the problem of many residual toxic components, poor viscosity control, low bonding strength, etc. problem, to achieve the effect of improving storage stability, low production cost and high bonding strength

Active Publication Date: 2019-01-04
FUJIAN NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It solves the shortcomings of phenolic resin adhesives such as high brittleness, poor viscosity control, low bonding strength, and more toxic components, and at the same time improves the adhesion and environmental protection of phenolic resin adhesives

Method used

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  • Method for preparing modified phenolic resin adhesive from camellia oleifera cakes
  • Method for preparing modified phenolic resin adhesive from camellia oleifera cakes
  • Method for preparing modified phenolic resin adhesive from camellia oleifera cakes

Examples

Experimental program
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Effect test

Embodiment 1

[0020] The first step, the preparation of liquefied camellia cake: weigh 30g camellia cake, 3.3g acidic liquefier, 24g urea and 210g distilled water in a three-necked round-bottomed flask, react at a water bath temperature of 90℃ for 2.0h and stop heating. When placed in a room and cooled to 60℃, the material is discharged, it is liquefied oil tea cake;

[0021] In the second step, 56g of phenol, 4.8g of sodium hydroxide, 5g of melamine, and 90g of distilled water were added to the above three-necked round-bottomed flask, and reacted in a water bath at 45℃ for 20min; after that, the temperature was adjusted to 55℃ and added in an average of three times. 20g formaldehyde, the reaction time is 50min; then continue to increase the temperature to 70℃, add 40g formaldehyde and 2.4g sodium hydroxide, continue for 20min, then heat up to 90℃, take out after reacting for 35min and continue stirring, when the temperature reaches 40℃ The material is the modified phenolic resin adhesive.

[0...

Embodiment 2

[0024] The first step is the preparation of liquefied camellia cake: weigh 20g camellia cake, 3.3g acidic liquefier, 8g urea and 420g distilled water in a three-necked round-bottom flask, react at a water bath temperature of 90°C for 2.0h and stop heating. When placed in the room and cooled to 60℃, the material is discharged, it is liquefied oil tea cake;

[0025] In the second step, 94g of phenol, 4.9g of sodium hydroxide, 15g of melamine, and 180g of distilled water were added to the above three-necked round bottom flask, and reacted in a water bath at 45°C for 20 minutes; then the temperature was adjusted to 55°C, and 30g was added every three times. Formaldehyde (addition), the reaction time is 50min; then continue to increase the temperature to 70℃, add 38.5g formaldehyde and 2.1g sodium hydroxide, continue for 20min, then heat up to 90℃, react for 30min, take out and continue stirring, when the temperature reaches 40℃ It can be discharged, which is the modified phenolic res...

Embodiment 3

[0028] The first step, the preparation of liquefied camellia cake: weigh 25g camellia cake, 3.3g acidic liquefier, 18g urea and 350g distilled water in a three-necked round-bottom flask, react at a water bath temperature of 90°C for 2.0h and then stop heating. When placed in a room and cooled to 60℃, the material is discharged, it is liquefied oil tea cake;

[0029] In the second step, 70g of phenol, 5.6g of sodium hydroxide, 10g of melamine, and 150g of distilled water were added to the above three-necked round bottom flask, and reacted in a water bath at 45°C for 20 minutes; then the temperature was adjusted to 55°C, and the addition was divided into three times each time. 25g formaldehyde, the reaction time is 50min; then continue to increase the temperature to 70℃, add 32g formaldehyde and 2.4g sodium hydroxide, continue for 20min, then increase the temperature to 90℃, react for 25min, take it out and continue stirring, when the temperature reaches 40℃, it can be discharged ,...

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Abstract

The invention relates to the method for preparing a modified phenolic resin adhesive from camellia oleifera cakes. The method includes: mixing the camellia oleifera cakes, an acid liquefying agent, urea and distilled water, adding into a reactor, and performing reaction to obtain liquefied camellia oleifera cakes; adding the liquefied camellia oleifera cakes, phenol, sodium hydroxide, melamine anddistilled water into the reactor, and performing reaction to obtain the modified phenolic resin adhesive. By adoption of the method, toxic components such as free formaldehyde and free phenols can bereduced, phenolic resin adhesive related performances are modified, and production cost reduction is realized. In addition, the liquefied camellia oleifera cakes substitute part of phenol for synthesizing the phenolic resin adhesive to make full use of effective active components in the camellia oleifera cakes, resin adhesiveness and thickness are enhanced, and dark color, high adhesion strength,high flexibility, low cost and the like are realized. Moreover, defects of high brittleness, difficulty in adhesion control, low adhesion strength, high toxic component residue quantity and the likeof phenolic resin adhesives are overcome, and the modified phenolic resin adhesive can be applied to the field of plywood.

Description

Technical field [0001] The invention relates to the field of natural polymer materials, in particular to a method for preparing a modified phenolic resin adhesive by using camellia cake meal. Background technique [0002] Traditional phenolic resin adhesives are synthesized by polycondensation of phenols and aldehydes. The main reason is that phenol and formaldehyde undergo polycondensation reaction, and its application range is the most extensive. However, the environmental protection effect of phenolic resin adhesive is not good due to the limitation of its raw material source and process conditions. Although there are many ways to overcome this problem, according to the current research progress, although measures such as reducing the phenol-formaldehyde ratio, optimizing the process, and adding formaldehyde trapping agents can reduce the free formaldehyde content in the phenolic resin, the modification effect is still insufficient. good. Therefore, if a substitute for pheno...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G14/12C09J161/34
CPCC08G14/12C09J161/34
Inventor 卢合欢周思耀吴宗华翁景峥
Owner FUJIAN NORMAL UNIV
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