A photosensitive coating film composition and application thereof
A technology for covering films and compositions, applied in the directions of optics, optomechanical equipment, photosensitive materials for optomechanical equipment, etc., can solve the problems of heat resistance and chemical resistance limitations, uneconomical, and uneven film, etc. Achieve the effect of improving high temperature resistance, improving adhesion and weakening phase separation
Active Publication Date: 2019-01-11
HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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[0003] Patent CN102015835A discloses a polyimide precursor, a photosensitive polyimide precursor composition, a photosensitive dry film and a flexible printed wiring substrate using them, which have excellent bendability, but have certain warpage At the same time, the cost is relatively high, which is uneconomical and affects the later assembly of the FPC board
Patent US0178448A1 discloses a resin composition containing carboxylic acid and acrylic acid, but its heat resistance and chemical resistance have certain limitations
Patents US7335460B2 and US7670752B2 disclose a photosensitive dry film composition blended with epoxy resin and urethane acrylate, but when blending, since the epoxy resin contains a relatively large rigid structure, it is easy for the urethane acrylate to form phase separation, and the film is not uniform and Subsequent heat curing is not carried out, and its heat resistance needs to be studied
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[0020] The invention is further elucidated below.
[0021] The resin binder involved in a photosensitive developable cover film composition described in the present invention comprises two parts. One part is an epoxy resin adhesive containing the above general structural formula (I), which consists of five basic structural units. The first unit is 10-40 wt% glycidyl (meth)acrylate, which is introduced into the epoxy structure. The second and third units are alkyl acrylate and alkyl methacrylate respectively. The alkyl group contains 1-7 carbons, accounting for 25-60wt%, mainly to adjust the overall flexibility of the epoxy resin , including but not limited to methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, (meth) Isobutyl acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, etc. The fourth unit 2-8wt% component contains alkyl (meth)acrylates with carbon numbers of 8-15, which can be exemplified but not li...
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The invention discloses a photosensitive coating film composition and an application thereof, wherein the photosensitive coating film composition comprises 40-70 part by weight of resin binder, 25-50part by weight of a photopolymerizable composition, 1-10 part by weight of photoinitiator and 1-3 part by weight of additive, wherein the resin binder is composed of 15-50% by weight of a resin bindercontaining an epoxy structure and 50-85% by weight of a (meth)acrylic alkali-soluble resin binder. Compared with traditional printing ink and polyimide photosensitive coating film, the invention hasthe characteristics of weak alkaline aqueous solution development, easy availability of raw materials and direct adhesion of the film, therefore, the invention has the advantages of environment friendliness, low cost and convenient operation.
Description
technical field [0001] The invention relates to a photovoltaic material, in particular to a photosensitive cover film composition and its application. Background technique [0002] In general, the solder resist materials used in FPC (flexible printed circuit boards) mainly have the functions of "three defenses" and "one resistance": to prevent the bridging between conductors or wires during soldering to form a short circuit; to prevent moisture and corrosion from outside the circuit board. Surface scratches, etc. Solder resist ink and polyimide cover film are two types of traditional solder resist materials. It is cumbersome to cover them on the circuit by screen printing and other technologies, and flexible circuit boards are becoming more and more miniaturized now. , Thin film, which will lead to a problem of lamination accuracy during lamination, so now the focus is on the development of photosensitive cover films. Among them, considering the reduction of environmental ...
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Login to View More IPC IPC(8): G03F7/032G03F7/033G03F7/027G03F7/004
CPCG03F7/004G03F7/027G03F7/032G03F7/033
Inventor 朱霞月李志强李伟杰周光大
Owner HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD