A method for manufacturing a solid state capacitor

Abstract

The invention discloses a manufacturing method of a solid state capacitor, which comprises the following steps in sequence: S1, winding a core bag; Numbering each core pack; 2, detect whether that core bag is short circuit one by one, and immerse the tested qualified core bag into a chemical forming liquid for chemical for repairing treatment. The positive electrode guide pin and the negative electrode guide pin of the core package are electrically connected with the positive electrode and the negative electrode of the power supply respectively in the forming and repairing process. The residual current of the core pack is detected one by one after the forming and repairing treatment. 3, dry that core pack; S4, immersing the core pack in the monomer solution for immersion treatment; 5, aftthat immersion treatment is finished, dry the core pack; S6, injecting a quantitative oxidant into the core pack; 7, heat to carry out polymerization reaction to generate conductive polymer in that core pack; S8. Assembled sealing; S9. Ageing. The invention adopts one-to-one charging to the core pack in the chemical forming process, avoids the defective products affecting the forming effect of other adjacent core packs, reduces the ESR series equivalent resistance, and improves the consistency of the products.

Description

technical field [0001] The invention relates to the technical field of capacitor manufacturing technology, in particular to a manufacturing method of a solid capacitor. Background technique [0002] Compared with ordinary liquid electrolytic capacitors, solid capacitors have outstanding electrical properties, such as low equivalent series resistance (ESR), high ripple current resistance, long service life, and stable performance. [0003] The existing production process of solid capacitors is: nail roll→welding→first formation→carbonization→second formation→drying→impregnation of monomers→drying→impregnation of oxidant→polymerization→assembly→cleaning→aging→printing, the above process There are following defects: [0004] One is to facilitate the subsequent formation and impregnation operations, the wound core package is loaded on the fusion machine through the vibrating plate, and the positive electrode guide pin of the core package is welded to the iron bar, and then the ...

AI Technical Summary

Problems solved by technology

Using the above process, due to the concentrated placement of a large number of core packages and the process of passing through the vibrating plate, the lead wires will be crooked and the core packages will be damaged. Poor crooked feet will easily cause the core packages welded on the iron bar to be out of line, and the core packages of each core package will be damaged. There is a difference in welding height, and it is difficult to accurately control the liquid level when the monomer and oxidant are impregnated, resulting in poor product consistency

[0005] The second is in the chemical formation process, the positive pole of the power supply is electrically connected to the iron bar, the negative pole of the power supply is electrically connected to the chemical liquid, and the first chemical chemical treatment is carried out after the voltage is applied; Immerse again in the chemical conversion solution for the second chemical conversion treatment; in actual operation, it is found that after the positive electrode foil is connected to the voltage, although there is electrolytic paper between the negative electrode foil and the negative electrode foil, due to the certain resistance value of the chemical conversion solution, there is A certain voltage drop will easily cause the negative electrode foil to be formed, so that the negative electrode foil will inevitably bear a certain voltage value. Since the withstand voltage of the negative electrode is very low, after the voltage is applied, the functional layer on the surface will be damaged to a certain extent, and the carbon layer will fall off. The ESR series equivalent resistance increases, and the ESR value fluctuates greatly, the product uniformity is not good, and the defect rate is high; at the same time, defective products may affect the formation effect of the entire plate

[0006] The third is that an oven is often used for drying and polymerization. On the one hand, the temperature consistency in the oven is not good; The core packs are then subjected to the polymerization process together. The wet core packs are exposed to the air for a long time, and each causes the wet core packs to be exposed to the air for different times. The wet core packs absorb moisture in the air and other substances in the air. Impurities, which greatly affect the life of the product and can affect the consistency of the product

[0007] The third is to put the capacitor core package into the monomer solution for monomer impregnation, then dry it, and then put it into the oxidant solution for oxidant impregnation. The oxidant solution is often used repeatedly, because the oxidant solution is very acidic, and it will dissolve part of it after repeated use. Aluminum, and other impurities such as paper dust will also affect the quality of the oxidant, thereby affecting the consistency and quality of the product

[0008] Fourth, the important process cannot realize real-time monitoring of each product, and the production data of each product cannot be retained

[0009] Fifth, the impregnation assembly workshop needs to do temperature and humidity control, and the additional cost is relatively high

[0010] Sixth, there are many processes in the production process, the circulation is cumbersome, and the product production cycle is long