Circuit board substrate with good heat dissipation and preparation method thereof

Abstract

The invention discloses a circuit board substrate with good heat dissipation. The circuit board substrate comprises the following raw materials in parts by weight: 60-80 parts of bisphenol A type epoxy resin, 20-30 parts of polytetramethylene adipamide, 10-20 parts of silicone resin, 10-20 parts of phenolic resin, 3-6 parts of glass fiber, 5-10 parts of calcium carbonate, 8-16 parts of silicon carbide, 3-6 parts of graphene, 5-10 parts of diamond micro-powder, 10-20 parts of polyethylene glycol, 2-6 parts of 2-hydroxy-4-methoxybenzophenone, 1-2 parts of N, N-dimethylformamide, 2-4 parts of di-2,4-dichlorobenzoyl peroxide, 1-2 parts of an antioxidant, and 3-5 parts of copper foil. The invention also discloses a preparation method of the circuit board substrate with good heat dissipation. The circuit board substrate has good heat dissipation performance under the cooperation effect of various raw materials, and ensures the service life and performance of the electronic products.

Description

technical field The invention relates to the field of electronic technology, in particular to a circuit board substrate with good heat dissipation and a preparation method thereof. Background technique Substrate is the basic material for manufacturing circuit boards. In general, substrates are copper-clad laminates. Single- and double-sided printed boards are manufactured on the substrate material-copper-clad laminates, selectively processing holes, Electroless copper plating, electroplating copper, etching and other processing to obtain the required circuit pattern, which has three functions of conduction, insulation and support, the performance, quality, processability in manufacturing, manufacturing cost, and manufacturing level of printed boards, etc. , depends largely on the substrate material. The existing circuit board substrate generally has the problem of poor heat dissipation. In electronic products, the integration of electronic circuits is getting higher and hi...

AI Technical Summary

Problems solved by technology

The existing circuit board substrate generally has the problem of poor heat dissipation. In electronic products, the integration of electronic circuits is getting higher and higher, and the heat generated during the operation of the chip is difficult to release. The accumulation of heat will affect the working stability of the device. , the existing circuit board will hinder the dissipation of heat, affecting the service life and performance of electronic products

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