Supercharge Your Innovation With Domain-Expert AI Agents!

Modified polyphenylene ether high molecular polymer, high molecular film and corresponding preparation method

A high-molecular polymer and high-molecular film technology, which is applied in the field of modified polyphenylene ether high-molecular polymers, can solve the problem of high-frequency signal transmission and high-speed digitalization, and the inability of flexible circuit boards to achieve high-frequency signal transmission impedance matching And other issues

Active Publication Date: 2021-02-26
ZHEN DING TECH CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the polyimide film layer used in flexible printed circuit boards is generally prepared from diamine compounds and dianhydride compounds, because it contains polar functional groups, so that the dielectric constant of the film layer Often higher than 3.0, the flexible circuit board cannot achieve high-frequency signal transmission impedance matching, which affects the high-frequency and high-speed digitalization of signal transmission

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Modified polyphenylene ether high molecular polymer, high molecular film and corresponding preparation method
  • Modified polyphenylene ether high molecular polymer, high molecular film and corresponding preparation method
  • Modified polyphenylene ether high molecular polymer, high molecular film and corresponding preparation method

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0033] A preferred embodiment of the present invention also provides a method for preparing the above-mentioned modified polyphenylene ether polymer, which includes the following steps:

[0034] Step S1, uniformly mixing a polyphenylene ether polymer, a reactive reactant and a solvent to prepare a resin composition. In the resin composition, the weight ratio of the polyphenylene ether polymer to the active reactant is 1:10˜50:1. The solvent only needs to dissolve the polyphenylene ether polymer and the active reactants. In this embodiment, the viscosity of the resin composition is 40000cps˜60000cps.

[0035] The chemical structural formula of the polyphenylene ether polymer is

[0036]

[0037] The active reactant may be selected from but not limited to one of 2-methacrylic anhydride, 4-chloromethylstyrene and trans-cinnamoyl chloride.

[0038] In this embodiment, the solvent is N,N-dimethylacetamide (DMAc). In other embodiments, the solvent may also be other organic so...

Embodiment 1

[0057] Add 60g of 4,4'-difluorobenzophenone and 71g of 4,4'-difluorobenzophenone successively in the first reaction flask. The polyphenylene ether copolymer, 77g of potassium carbonate, 30mL of xylene and 393.6g of N,N-dimethylacetamide were stirred and dissolved, and then heated at 130 degrees Celsius for 12 hours in a nitrogen atmosphere to prepare the chemical structural formula: of the first product.

[0058]Add 50g of the first product and 23.6g of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO, the chemical formula is ), 102.7g of phenol and 0.9g concentration of 97% sulfuric acid and stirring and dissolving, then heated at 140 degrees centigrade in nitrogen atmosphere for 12 hours to prepare the chemical structural formula as

[0059] polyphenylene ether polymers.

[0060] Add 10g of the above-mentioned polyphenylene ether polymer, 3.5g of 2-methacrylic anhydride, 0.1g of sodium acetate and 100mL of N,N-dimethylacetamide to the third reaction flask in s...

Embodiment 2

[0062] Add 10g of the polyphenylene ether polymer in Example 1, 3.5g of 4-chloromethylstyrene, 0.1g of sodium acetate and 100mL of N,N-dimethylacetamide into the reaction flask in sequence and Stir and dissolve, then heat at 80 degrees Celsius for 12 hours in a nitrogen atmosphere to prepare the chemical structural formula as

[0063] modified polyphenylene ether polymers. The viscosity of the modified polyphenylene ether polymer is 51s000cps.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A modified polyphenylene ether polymer, the chemical structural formula of the modified polyphenylene ether polymer or in addition, the present invention also provides a preparation of the above-mentioned modified polyphenylene ether polymer A method, a polymer film using the modified polyphenylene ether polymer and a preparation method thereof.

Description

technical field [0001] The present invention relates to a modified polyphenylene ether polymer, a preparation method of the modified polyphenylene ether polymer, a polymer film using the modified polyphenylene ether polymer and the polymer Methods for the preparation of molecular membranes. Background technique [0002] In the era of big data, the information processing of electronic products is constantly developing in the direction of high-frequency signal transmission and high-speed digitalization. To ensure that electronic products have good signal transmission quality under the condition of high-frequency signal transmission, the transmission line in the conductive copper foil of the flexible circuit board and the connected electronic components need to be in an impedance matching state to avoid signal reflection, Phenomena such as scattering, attenuation, and delay. The dielectric constant and dielectric loss factor of the material of the adhesive layer in contact wi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08G65/331C08G65/332C08G65/335C08G65/48C08J3/24
CPCC08G65/3317C08G65/3322C08G65/3326C08G65/3355C08G65/485C08J3/247C08J5/18C08J2371/12
Inventor 何明展徐茂峰向首睿黄楠昆林庆炫
Owner ZHEN DING TECH CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com