Thermoset artificial board starch adhesive and preparation method thereof

A technology of starch adhesives and wood-based panels, which is applied to the bonding method of adhesive heating, adhesives, adhesive products, etc., can solve problems such as excessive expansion, poor heat resistance, and decomposition of the adhesive layer, and achieve improved thermal stability and performance. Water resistance, broad application field, and easy operation

Active Publication Date: 2019-01-25
JIANGNAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A.Roger once used paste Dextrin reacts with NMA to make paper adhesive. The water resistance standard of the adhesive in this method is low, and it is tested by soaking in cold water. Using dextrin alone as a raw material has low bond strength
This method is based on a solid-state reaction to improve reaction efficiency. The production process is troublesome and costly, and requires the participation of a series of instruments such as fluidized bed and freeze-drying, which is not suitable for industrial applications.
In 2008 (CN101418199B), our research group studied the adhesive prepared with starch as raw material under the dual monomer system, but did not investigate the reactivity ratio of the two monomers. It is easy to produce oligomers when applied to this formula. The intermittent emulsion polymerization method is not stable, the cost is high, and there is no hot pressing process
[0004] At present, the starch-based adhesives produced by existing processes have achieved ideal results in storage stability and dry strength, but most of the starch-based adhesives produced are thermoplastic adhesives, and no hot-pressing research has been carried out. Its essence is a linear polymer, which can easily lead to excessive expansion and internal decomposition of the adhesive layer in the process of hot pressing dehydration, and then shows poor water resistance, dry strength, and heat resistance, which limits the application of starch adhesives in the field of hot pressing adhesives. application

Method used

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  • Thermoset artificial board starch adhesive and preparation method thereof
  • Thermoset artificial board starch adhesive and preparation method thereof
  • Thermoset artificial board starch adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Formula (mass percentage):

[0043]

[0044]

[0045] Process flow:

[0046] (1) Prepare an emulsion with a mass concentration of 35% from cornstarch, acidify it with hydrochloric acid at 60°C for 2 hours, then adjust the pH to about 3-5 with sodium hydroxide, raise the temperature to 90°C, and keep it warm for 0.5h, Then cool down to 70°C.

[0047] (2) Slowly drop the pre-configured seed emulsion into the reaction kettle, the stirrer speed is about 300r / min, observe the condenser tube, when the reflux liquid is significantly reduced;

[0048] (3) Add the initiator of remaining total addition 50% in the reactor, slowly add dropwise remaining monomer solution, dropwise time is 3h, add the initiator of 15% total addition to continue reaction 1.5h;

[0049] (4) Slowly add the N-methylolacrylamide solution of 10% mass concentration prepared in advance and the initiator accounting for 35% of the total initiator addition to the reaction kettle dropwise within 2 hours,...

Embodiment 2

[0053] Formula (mass percentage):

[0054]

[0055] Process flow:

[0056] (1) Prepare an emulsion with a mass concentration of 35% using cornstarch as a raw material, acidify it with hydrochloric acid at 60°C for 2 hours, then adjust the pH to about 3-5 with sodium hydroxide, add urea, heat up to 90°C, and keep it warm 0.5h, then lower the temperature to 70°C.

[0057] (2) Slowly drop the pre-configured seed emulsion into the reaction kettle, the stirrer speed is about 300r / min, observe the condenser tube, when the reflux liquid is significantly reduced;

[0058] (3) Add the initiator of remaining total addition 50% in the reactor, slowly add dropwise remaining monomer solution, dropwise time is 3h, add the initiator of 15% total addition to continue reaction 1.5h;

[0059] (4) Slowly add the N-methylolacrylamide solution with a mass concentration of 10% prepared in advance and the initiator accounting for 35% of the total initiator addition to the reaction kettle dropwi...

Embodiment 3

[0063] Formula (mass percentage):

[0064]

[0065] Process flow:

[0066] (1) Prepare an emulsion with a mass concentration of 35% using cornstarch as a raw material, acidify it with hydrochloric acid at 60°C for 2 hours, then adjust the pH to about 3-5 with sodium hydroxide, add urea, heat up to 90°C, and keep it warm 0.5h, then lower the temperature to 70°C.

[0067] (2) Slowly drop the pre-configured seed emulsion into the reaction kettle, the stirrer speed is about 300r / min, observe the condenser tube, when the reflux liquid is significantly reduced;

[0068] (3) Add the initiator of remaining total addition 50% in the reactor, slowly add dropwise remaining monomer solution, dropwise time is 3h, add the initiator of 15% total addition to continue reaction 1.5h;

[0069] (4) After the addition of the monomers is completed, the temperature is raised to 85°C and kept for 0.5h to volatilize the residual monomers, and the temperature is lowered to 50°C to add a hydroquino...

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PUM

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Abstract

The invention discloses a thermoset artificial board starch adhesive and a preparation method thereof, and belongs to the technical field of adhesive preparation. In the invention, starch is adopted as a main raw material; after acidolysis of the starch, the control on monomer polymerization stability is improved by semi-continuous seed emulsion polymerization. The preparation method comprises thefollowing steps: after grafting, adding cross-linked monomers with two functional groups of polymerization type double bond and condensation type hydroxymethyl for polymerization, wherein the cross-linked monomers are added also in a semi-continuous way; after the cross-linking reaction, performing gelatinization and heat preservation to finally obtain a thermoset adhesive for bonding a hot-pressed artificial board. With the properties of two-step crosslinking and high-temperature fast crosslinking and curing, the adhesive disclosed by the invention has the advantages of good film forming property, high heat resistance and strong cohesion; by adopting the developed gluing way, the temperature, the pressure and the matching hot-pressing technology, the produced artificial board exceeds type-II artificial board in all properties and can be widely applied to the bonding of hot-pressed wood decoration, artificial boards and plywood.

Description

technical field [0001] The invention relates to a thermosetting artificial board starch adhesive and a preparation method thereof, belonging to the technical field of adhesive preparation. Background technique [0002] With the development of construction and decoration, the demand for wood products in my country has greatly increased, but the per capita forest area in my country is small, so wood-based panels have become an excellent way to solve the shortage of wood. Most of the wood-based panels on the market are hot-pressed production methods, using "trialdehyde" series adhesives with high heat resistance, which have high production efficiency, but the raw materials of the adhesives are not renewable, and the release of formaldehyde and other harmful gases is harmful to the environment. Negative Effects. [0003] Starch is an extremely abundant biomacromolecule in nature. It has a wide range of sources, is cheap, is environmentally friendly and renewable, has good bondi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J151/02C08F251/00C08F218/08C08F220/58C08F2/26
CPCC09J151/02C08F2/26C08F251/00C08F218/08C08F220/58C09J5/06C09J2451/00C09J2400/303C09J2403/00B32B2307/50B32B2607/00B32B2307/748B32B7/12B32B21/14B32B21/13B32B2451/00B32B2250/03B32B21/042B32B2405/00C08F8/00C08F2/00C08F285/00C08F8/12
Inventor 程力顾正彪顾泳李兆丰洪雁李才明
Owner JIANGNAN UNIV
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