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Preparation method of special adhesive for transformers

A technology of adhesives and transformers, applied in the field of transformers, can solve problems such as not being able to meet the needs of the industry, achieve the effects of improving heat resistance and bonding strength, improving aging resistance, and improving dispersibility

Inactive Publication Date: 2019-01-25
岳西县明杰电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing preparation process has gradually been unable to meet the needs of the industry

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] A preparation method of special adhesive for transformers, comprising the steps of:

[0019] S1. Add phenolic resin, epoxy resin, and ethylenediamine to a mixed solvent of benzene and ethanol, and mix uniformly to obtain component A; the phenolic resin is a modified phenolic resin;

[0020] S2. Add the accelerator and zinc naphthenate to the nitrile latex, and mix evenly to obtain the B component;

[0021] S3. Mix components A and B together and knead them to form a glue.

Embodiment 2

[0023] A preparation method of special adhesive for transformers, comprising the steps of:

[0024] S1. Add phenolic resin, epoxy resin, and ethylenediamine to a mixed solvent of benzene and ethanol, and mix uniformly to obtain component A; the phenolic resin is a modified phenolic resin;

[0025] S2. Add the accelerator and zinc naphthenate to the nitrile latex, and mix evenly to obtain the B component;

[0026] S3. Mix components A and B together and knead them to form a glue;

[0027] Wherein, the modified phenolic resin is prepared according to the following process: mix phenol and ginkgoxanthin evenly, add catalyst oxalic acid, adjust the pH value to acidity, heat up, react at a constant temperature, cool down, add formaldehyde, keep warm for reaction, add white carbon black , stirred and reacted, heated up for distillation and dehydration to obtain modified phenolic resin.

Embodiment 3

[0029] A preparation method of special adhesive for transformers, comprising the steps of:

[0030] S1. Add phenolic resin, epoxy resin, and ethylenediamine to a mixed solvent of benzene and ethanol, and mix uniformly to obtain component A; the phenolic resin is a modified phenolic resin;

[0031] S2. Add the accelerator and zinc naphthenate to the nitrile latex, and mix evenly to obtain the B component;

[0032] S3. Mix components A and B together and knead them to form a glue;

[0033] Wherein, the modified phenolic resin is prepared according to the following process: mix phenol and ginkgoxanthin evenly, add catalyst oxalic acid, adjust the pH value to 2, heat up to 110°C, react at constant temperature for 2 hours, cool down to 90°C, add formaldehyde, Insulate and react for 2 hours, add white carbon black, stir and react for 50 minutes, heat up to 135°C for distillation and dehydration, and obtain modified phenolic resin;

[0034] The mass ratio of the phenol, ginkgoxanth...

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Abstract

The invention relates to the technical field of transformers, and particularly discloses to a preparation method of a special adhesive for transformers. The preparation method comprises: S1, adding aphenol formaldehyde resin, an epoxy resin and ethylenediamine to a mixed solvent of benzene and ethanol, and mixing uniformly to obtain a component A, wherein the phenol formaldehyde resin is a modified phenol formaldehyde resin; S2, adding a promoter and zinc naphthenate to acrylonitrile-butadiene latex, and uniformly mixing to obtain a component B; and S3, mixing the component A and the component B to form the adhesive. According to the present invention, the prepared specific adhesive has excellent heat resistance and excellent aging resistance.

Description

technical field [0001] The invention relates to the technical field of transformers, in particular to a method for preparing a special adhesive for transformers. Background technique [0002] With the rapid development of the electronic industry, the performance requirements for the circuit board of the transformer in the charger are also getting higher and higher. Generally, the circuit board is required to have good mechanical properties at a temperature of 100-250°C, and the mechanical properties of the circuit board depend to a large extent on the heat resistance and thermal conductivity of the thermal insulation layer of the circuit board. The existing preparation process has gradually been unable to meet the needs of the industry. The emergence of insulating and thermally conductive materials with good heat resistance and thermal conductivity has become an urgent need. Contents of the invention [0003] Based on the technical problems existing in the background tec...

Claims

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Application Information

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IPC IPC(8): C09J161/14C09J163/00C09J109/04C09J11/04C09J11/06C08G8/28
CPCC08G8/28C08L2201/08C08L2205/03C09J11/04C09J11/06C09J161/14C08L63/00C08L9/04C08K13/02C08K3/36C08K5/098
Inventor 胡锋舒小群刘春胡雪锋徐玉峰
Owner 岳西县明杰电子有限公司
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